Light emitting device package and light system including the same

Patent metadata

Field	Value
Publication number	US-2016133804-A1
Application number	US-201514931140-A
Country	US
Kind code	A1
Filing date	Nov 3, 2015
Priority date	Nov 10, 2014
Publication date	May 12, 2016
Grant date	—

Abstract

A light emitting device package may include a package body, a light emitting device on the package body, a first molding member that surrounds the light emitting device, and a second molding member having a hemi-spherical structure to surround the first molding member. The molding member includes a viscous material.

First claim

What is claimed is:

1 . A light emitting device package comprising:
a package body; a light emitting device provided on the package body; a first molding member that surrounds the light emitting device; and a second molding member having a hemi-spherical structure to surround the first molding member, wherein the first molding member includes a viscous material.

2 . The light emitting device package of claim 1 , wherein the first molding member has a hemi-spherical structure.

3 . The light emitting device package of claim 1 , wherein the first molding member has a coating thickness in a range of 70 μm to 100 μm.

4 . The light emitting device package of claim 1 , wherein the first molding member includes a silicon-based resin.

5 . The light emitting device package of claim 1 , wherein the second molding member has a hardness greater than a hardness of the first molding member.

6 . The light emitting device package of claim 2 , wherein the first molding member has a curvature equal to a curvature of the second molding member.

7 . The light emitting device package of claim 2 , wherein the first molding member has a curvature different from a curvature of the second molding member.

8 . The light emitting device package of claim 2 , wherein the second molding member includes epoxy-based resin or silicon-based resin.

9 . The light emitting device package of claim 1 , wherein the light emitting device emits light having a ultra-violet wavelength band.

10 . A light emitting device package comprising:
a body part including a cavity having a bottom surface and an internal lateral side; first and second electrodes provided on the body part; a light emitting device provided on a bottom surface of the body part and electrically connected to the first electrode and the second electrode; a liquid-phase or gel-phase molding member provided in the cavity of the body part to surround the light emitting device; a lens member provided on the body part; and at least one groove configured to trap air at an internal lateral side of the body part, wherein the at least one groove forms an upper circumference of the cavity of the body part.

11 . The light emitting device package of claim 10 , wherein the at least one groove includes a first groove between the body part and the lens member and a second groove in the internal lateral side of the body part.

12 . The light emitting device package of claim 11 , wherein the at least one groove includes a third groove formed perpendicularly to one side of the first groove.

13 . The light emitting device package of claim 11 , wherein the first groove gradually increases in size away from the internal lateral side.

14 . The light emitting device package of claim 11 , wherein the second groove gradually decreases in size away from the internal lateral side.

15 . The light emitting device package of claim 11 , wherein the at least one groove further includes an air bubble receiving part provided at an end portion of the second groove.

16 . The light emitting device package of claim 10 , wherein the at least one groove has a concavo-convex structure formed at the internal lateral side of the body part.

17 . The light emitting device package of claim 16 , wherein the at least one groove is provided at an upper portion of the internal lateral side of the body part.

18 . A light system including the light emitting device package according to claim 1 .

Assignees

• Lg Innotek Co Ltd

Inventors

• Lee Eun Dk
• Oh Jung Hun

Classifications

• F21S6/00

  Lighting devices intended to be free-standing (F21S9/00, F21S10/00, {F21S13/12} take precedence {lighting devices specially adapted to be transported from place to place, e.g. lighting devices carried on wheeled supports F21L; details of supports for lighting devices F21V21/00}) · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/127

  characterised by arrangements for sealing or adhesion · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/01515

  Forming coatings · CPC title