Tantalum capacitor and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016133389-A1
Application number	US-201514884711-A
Country	US
Kind code	A1
Filing date	Oct 15, 2015
Priority date	Nov 7, 2014
Publication date	May 12, 2016
Grant date	—

Abstract

A tantalum capacitor includes a capacitor body; a tantalum wire disposed on a surface of the capacitor body; an encapsulant part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the encapsulant part; and a cathode lead frame disposed on a surface of the capacitor body and exposed to the outer surface of the encapsulant part. The anode lead frame includes a pillow head part connected to the tantalum wire and an electrode plate connected to the pillow head part and exposed to the outer surface of the encapsulant part, and the pillow head part includes an etched surface.

First claim

What is claimed is:

1 . A tantalum capacitor comprising:
a capacitor body; a tantalum wire disposed on a surface of the capacitor body; an encapsulant part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the encapsulant part; and a cathode lead frame disposed on a surface of the capacitor body and exposed to the outer surface of the encapsulant part, wherein the anode lead frame includes a pillow head part connected to the tantalum wire and an electrode plate connected to the pillow head part and exposed to the outer surface of the encapsulant part, and the pillow head part includes an etched surface.

2 . The tantalum capacitor of claim 1 , wherein a side surface of the pillow head part is the etched surface.

3 . The tantalum capacitor of claim 1 , wherein the side surface of the pillow head part is inclined.

4 . The tantalum capacitor of claim 1 , wherein the anode lead frame and the cathode lead frame are externally exposed to a lower surface of the tantalum capacitor.

5 . The tantalum capacitor of claim 1 , wherein an upper surface of the electrode plate and an upper surface of the cathode lead frame are etched surfaces.

6 . The tantalum capacitor of claim 1 , wherein a thickest portion of the electrode plate and a thickest portion of the cathode lead frame have the same thickness.

7 . The tantalum capacitor of claim 1 , wherein side surfaces of the electrode plate and the cathode lead frame are cut surfaces.

8 . The tantalum capacitor of claim 1 , wherein the pillow head part has a quadrangular pillar shape.

9 . The tantalum capacitor of claim 1 , wherein the pillow head part has a cylindrical shape.

10 . A method of manufacturing a tantalum capacitor, comprising steps of:
preparing a conductive sheet; etching the conductive sheet to form a pillow head part; forming an anode lead frame including the pillow head part and a cathode lead frame by cutting and compressing the conductive sheet on which the pillow head part is formed; mounting a capacitor body on the anode lead frame and the cathode lead frame, the capacitor body having a tantalum wire disposed on a surface of the capacitor body; and forming an encapsulant part to enclose the capacitor body and the tantalum wire and externally expose surfaces of the anode lead frame and the cathode lead frame.

11 . The method of manufacturing a tantalum capacitor of claim 10 , wherein the step of mounting the capacitor body on the anode lead frame and the cathode lead frame comprises bonding the pillow head part to the tantalum wire.

12 . The method of manufacturing a tantalum capacitor of claim 10 , further comprising, before the step of forming the pillow head part by the etching of the conductive sheet, a step of forming a pattern of the pillow head part on an upper surface of the conductive sheet by applying a photoresist onto the upper surface of the conductive sheet and developing the applied photoresist.

13 . The method of manufacturing a tantalum capacitor of claim 10 , wherein in the step of forming the anode lead frame including the pillow head part and the cathode lead frame by the cutting and the compressing of the conductive sheet on which the pillow head part is formed, the anode lead frame and the cathode lead frame are simultaneously formed in a single process.

14 . The method of manufacturing a tantalum capacitor of claim 10 , wherein in the step of forming the anode lead frame including the pillow head part and the cathode lead frame by the cutting and the compressing of the conductive sheet on which the pillow head part is formed, portions of the conductive sheet in which the pillow head part is not formed are cut and compressed.

15 . The method of manufacturing a tantalum capacitor of claim 10 , wherein the step of mounting the capacitor body on the anode lead frame and the cathode lead frame further comprises attaching the cathode lead frame and the capacitor body to each other by applying a conductive adhesive to the cathode lead frame.

Assignees

• Samsung Electro Mech

Inventors

• Yang Wan Suk
• Shin Hong Kyu
• Choi Kyoung Sup

Classifications

• H01G9/012

  specially adapted for solid capacitors · CPC title

• H01G9/10

  Sealing, e.g. of lead-in wires · CPC title

• H01G9/15 Primary

  Solid electrolytic capacitors (H01G11/00 takes precedence) · CPC title

• H01G9/0029

  Processes of manufacture · CPC title

• H01G9/042 Primary

  characterised by the material (H01G11/22 takes precedence) · CPC title