Tin/tic coating and method for manufacturing the tin/tic coating and articles so coated

US2016130694A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016130694-A1
Application numberUS-201514589815-A
CountryUS
Kind codeA1
Filing dateJan 5, 2015
Priority dateNov 11, 2014
Publication dateMay 12, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An article includes a substrate, a Ti-bottom layer deposited on the substrate and a TiN/TiC coating deposited on the Ti-bottom layer. The TiN/TiC coating includes a plurality of TiN-nano layers and a plurality of TiC-nano layers. Each TiN-nano layer and each TiC-nano layers are alternately deposited on the Ti-bottom layer. The TiN/TiC coating has good toughness and high hardness. A method for manufacturing the TiN/TiC coating is also provided.

First claim

Opening claim text (preview).

What is claimed is: 1 . A TiN/TiC coating comprising: a plurality of TiN-nano layers; and a plurality of TiC-nano layers; wherein the TiN/TiC coating is a multi-layer composite coating formed by alternate deposition of TiN-nano layers and TiC-nano layers. 2 . The TiN/TiC coating as claimed in claim 1 , wherein the adjacent TiN-nano layer and TiC-nano layer form a two-layer unit, and the thickness of the TiN-nano layer ranges from 10 nm to 60 nm and the thickness of the TiC-nano layer ranges from 10 nm to 80 nm in each two-layer unit. 3 . The TiN/TiC coating as claimed in claim 2 , wherein the thickness of the TiN-nano layer and the thickness of the TiC-nano layer is 50 nm in each two-layer unit. 4 . The TiN/TiC coating as claimed in claim 1 , wherein the TiN/TiC coating can be total 20 layers of coating each layer being made up of the TiN-nano layer and the TiC-nano layer. 5 . The TiN/TiC coating as claimed in claim 1 , wherein the total thickness of the TiN/TiC coating is 1 μm. 6 . The TiN/TiC coating as claimed in claim 1 , wherein the microhardness of the TiN/TiC coating is more than 40 GPa. 7 . A method for manufacturing a TiN/TiC coating, the method comprising: providing a substrate in a coating device; and forming a multi-layer composite coating by alternately sputtering a TiN-nano layer and a TiC-nano layer on the substrate; wherein the TiN-nano layer is formed by sputtering Ti targets in the argon gas and the nitrogen gas; and the TiC-nano layer is formed by sputtering TiC targets in the argon gas. 8 . The method as claimed in claim 7 , wherein the sputtering conditions for forming the TiN-nano layers are as follows: a power of Ti targets is adjusted to 5000-14000 W, a nitrogen flow rate is 200-300 mln/min, an argon flow rate is 300-500 mln/min, a pressure in the coating device is 400-600 MPa, a temperature of the coating device is 400-600° C., a voltage of the ion source is 50-100V, a biased voltage of the substrate can be 50-1000V, and a sputtering time is 100-500 seconds. 9 . The method as claimed in claim 7 , wherein the sputtering conditions for forming the TiC-nano layers are as follows: a power of TiC targets is adjusted to 5000-14000 W, an argon flow rate is 300-500 mln/min, a pressure in the coating device is 300-500 MPa, a temperature of the coating device is 400-600° C., a voltage of the ion source is 50-100V, a biased voltage of the substrate can be 50-100V, and a sputtering time is 300-1000 seconds. 10 . The method as claimed in claim 7 , wherein a Ti-bottom layer is sputtered on the substrate before forming the multi-layer composite coating. 11 . The method as claimed in claim 10 , wherein the sputtering conditions for forming the Ti-bottom layer are as follows: a power of Ti targets is 500-1000 W, an argon flow rate and an krypton flow rate are 200-300 mln/min, a pressure in the coating device is 200-500 MPa, a temperature of the coating device is 400-600° C., a voltage of the ion source is 50-100V, and a biased voltage of the substrate can be 50-1000V, and a sputtering time is 200-1000 seconds. 12 . An article comprising: a substrate; and a TiN/TiC coating deposited on the substrate; wherein the TiN/TiC coating is a multi-layer composite coating formed by alternate deposition of a plurality of TiN-nano layers and a plurality of TiC-nano layers. 13 . The article as claimed in claim 12 , wherein a Ti-bottom layer is formed between the TiN/TiC coating and the substrate. 14 . The article as claimed in claim 12 , wherein the adjacent TiN-nano layer and TiC-nano layer form a two-layer unit, and the thickness of the TiN-nano layer ranges from 10 nm to 60 nm and the thickness of the TiC-nano layer ranges from 10 nm to 80 nm in each two-layer unit. 15 . The article as claimed in claim 12 , wherein the thickness of the TiN-nano layer and the thickness of the TiC-nano layer is 50 nm in each two-layer unit. 16 . The article as claimed in claim 12 , wherein the TiN/TiC coating can be total 20 layers of coating each layer being made up of the TiN-nano layer and the TiC-nano layer, and the total thickness of the TiN/TiC coating is 1 μm. 17 . The article as claimed in claim 12 , wherein the microhardness of the TiN/TiC coating is more than 40 GPa.

Assignees

Inventors

Classifications

  • using more than one target (C23C14/56 takes precedence) · CPC title

  • Variation of parameters during sputtering · CPC title

  • Nitrides (C23C14/0617 takes precedence) · CPC title

  • Carbides · CPC title

  • Reactive sputtering · CPC title

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What does patent US2016130694A1 cover?
An article includes a substrate, a Ti-bottom layer deposited on the substrate and a TiN/TiC coating deposited on the Ti-bottom layer. The TiN/TiC coating includes a plurality of TiN-nano layers and a plurality of TiC-nano layers. Each TiN-nano layer and each TiC-nano layers are alternately deposited on the Ti-bottom layer. The TiN/TiC coating has good toughness and high hardness. A method for m…
Who is the assignee on this patent?
Hongfujin Prec Ind Shenzhen, Hon Hai Prec Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C14/3464. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu May 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).