Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle

Patent metadata

Field	Value
Publication number	US-2016129792-A1
Application number	US-201414895789-A
Country	US
Kind code	A1
Filing date	Nov 17, 2014
Priority date	Nov 28, 2013
Publication date	May 12, 2016
Grant date	—

Abstract

A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

First claim

1 . A method for manufacturing a cooler for a semiconductor module, the cooler including: a heat sink having an appearance of a cuboid structure; a heat radiation plate to an outer surface of which a semiconductor device is bonded; and a tray-shaped cooling jacket including: a coolant introduction channel to introduce a coolant through a coolant inlet portion; a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel between the coolant introduction and extraction channels, the method comprising:
fixing a flow rate control plate to one side of the heat sink; arranging the heat sink in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels; and bonding the heat radiation plate by brazing so as to close an opening the cooling jacket.

2 . The method of claim 1 , wherein the flow rate control plate includes:
a flow rate decreasing section standing from a lower edge of the heat sink to a height t 1 below an upper edge of the heat sink; and a flow rate increasing section having a height t 2 from the lower edge of the heat sink which is lower than that of the flow rate decreasing section.

3 . The method of claim 1 , wherein a one end of the flow rate control plate fixed to the heat sink is located near side of the coolant outlet portion.

4 . The method of claim 1 , wherein the flow rate control plate has a shape that increases a flow rate of the coolant flowing through the channels of the heat sink just under a part of the heat radiation plate to which the semiconductor device is bonded.

5 . The method of claim 1 , wherein the heat sink is a member made by a number of fins arranged at predetermined intervals in a thickness direction of the fins, and the flow rate control plate holds each interval of the fins adjacent to each other.

6 . A cooler for a semiconductor module, comprising:
a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a heat radiation plate, to an outer surface of which a semiconductor device is bonded; and a tray-shaped cooling jacket including: a coolant introduction channel to introduce a coolant through a coolant inlet portion; a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels, wherein the heat sink is arranged in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels; the heat radiation plate is fixed so as to close an opening of the cooling jacket; and upper and lower surfaces of the heat sink that face an inner surface of the cooling jacket and an inner surface of the heat radiation plate respectively contact to the inner surfaces of the cooling jacket and heat radiation plate.

7 . The cooler of claim 6 , wherein the flow rate control plate includes:
a flow rate decreasing section standing from a lower edge of the heat sink to a height t 1 below an upper edge of the heat sink; and a flow rate increasing section having a height t 2 from the lower edge of the heat sink which is lower than that of the flow rate decreasing section.

8 . The cooler of claim 6 , wherein a one end of the flow rate control plate fixed to the heat sink is located near side of the coolant outlet portion.

9 . The cooler of claim 6 , wherein the flow rate control plate has a shape that increases a flow rate of the coolant flowing through the channels of the heat sink under a part of the heat radiation plate to which the semiconductor device is bonded.

10 . The cooler of claim 6 , wherein the heat sink is a member made by a number of fins arranged at predetermined intervals in a thickness direction of the fins, and the flow rate control plate holds each interval of the fins adjacent to each other.

11 . A semiconductor module, comprising:
a cooler externally supplied with a coolant, configured to cool a semiconductor device provided on an outer surface of the cooler, the cooler including: a heat sink which has an appearance of a cuboid structure and a one side of which is fixed to a flow rate control plate; a heat radiation plate, to an outer surface of which a semiconductor device is bonded; and a tray-shaped cooling jacket including: a coolant introduction channel to introduce a coolant through a coolant inlet portion; a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel between the coolant introduction and extraction channels, wherein the heat sink is arranged in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels; the heat radiation plate is fixed so as to close an opening of the cooling jacket; and upper and lower surfaces of the heat sink that face an inner surface of the cooling jacket and an inner surface of the heat radiation plate respectively contact to the inner surfaces of the cooling jacket and heat radiation plate.

12 . An electrically-driven vehicle, comprising:
a semiconductor module according to claim 11 ; a motor driven by electric power provided by the semiconductor module; a central processing unit controlling the semiconductor module; a pump transporting a coolant to cool the semiconductor module; a heat exchanger cooling the coolant; and a tube forming a coolant path, connecting the semiconductor module, the pump, and the heat exchanger in a closed loop, which are integrated with the cooler.

Assignees

• Fuji Electric Co Ltd

Inventors

• Gohara Hiromichi
• Arai Nobuhide

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title