Medical Device

US2016128585A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016128585-A1
Application numberUS-201514934834-A
CountryUS
Kind codeA1
Filing dateNov 6, 2015
Priority dateNov 7, 2014
Publication dateMay 12, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A carrier assembly includes a sub-assembly including a pump, at least one solenoid valve, and a check valve. The pump, the at least one solenoid valve, and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold. Also, the carrier assembly is configured to be mounted to a medical device's main assembly board.

First claim

Opening claim text (preview).

What is claimed is: 1 . A carrier assembly, comprising: a sub-assembly comprising a pump, at least one solenoid valve, and a check valve, wherein the pump, the at least one solenoid valve and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold; and wherein the carrier assembly is configured to be mounted to a medical device's main assembly board. 2 . The carrier assembly of claim 1 , wherein the sub-assembly further comprises: a speaker; a Wi-Fi radio and a Bluetooth radio; and an integrated wire harness holding at least one wire for each of: the pump, the at least one solenoid valve, the check valve, the speaker, the Wi-Fi radio, and the Bluetooth radio. 3 . The carrier assembly of claim 2 , wherein the manifold is mounted to the medical device's main assembly board, and wherein the manifold is configured to form a fluid connection with a blood pressure cuff connector. 4 . The carrier assembly of claim 3 , wherein the medical device's main assembly board has a first surface area on a top surface of the main assembly board, wherein the carrier assembly has a second surface area, and wherein the second surface area is at least less than half of the first surface area. 5 . The carrier assembly of claim 1 , further comprising the main assembly board, wherein the main assembly board includes a printed circuit board. 6 . The carrier assembly of claim 5 , wherein the sub-assembly is carried on the printed circuit board. 7 . The carrier assembly of claim 6 , wherein the sub-assembly and the printed circuit board form an integrated assembly. 8 . A blood pressure module, comprising: a main printed circuit assembly; a manifold positioned on the main printed circuit assembly; at least one pressure transducer positioned on the main printed circuit assembly; and a sub-assembly, comprising: a pump; at least one solenoid valve positioned adjacent to the pump; and a check valve positioned adjacent to both the pump and the at least one solenoid valve, wherein the pump, the at least one solenoid valve and the check valve are in fluid communication with each other and with the at least one pressure transducer via the manifold; and wherein the sub-assembly is configured to be mounted to a medical device's main assembly board. 9 . The blood pressure module of claim 8 , wherein the sub-assembly further comprises: a speaker; a Wi-Fi radio and a Bluetooth radio; and an integrated wire harness holding at least one wire for each of: the pump, the at least one solenoid valve, the check valve, the speaker, the Wi-Fi radio, and the Bluetooth radio. 10 . The blood pressure module of claim 8 , wherein the medical device's main assembly board has a first surface area on a top surface of the main assembly board, wherein the sub-assembly has a second surface area, and wherein the second surface area is at least less than half of the first surface area. 11 . The blood pressure module of claim 8 , wherein the main assembly board includes a printed circuit board. 12 . The blood pressure module of claim 11 , wherein the sub-assembly is carried on the printed circuit board. 13 . The blood pressure module of claim 12 , wherein the sub-assembly and the printed circuit board form an integrated assembly. 14 . A method of forming a carrier assembly for a medical device, the method comprising: forming a sub-assembly comprising a pump, at least one solenoid valve, and a check valve, placing the pump, the at least one solenoid valve and the check valve in fluid communication with each other and with at least one pressure transducer via a manifold; and mounting the sub-assembly is configured to be mounted to a medical device's main assembly board. 15 . The method of claim 14 , wherein the sub-assembly further comprises: a speaker; a Wi-Fi radio and a Bluetooth radio; and an integrated wire harness holding at least one wire for each of: the pump, the at least one solenoid valve, the check valve, the speaker, the Wi-Fi radio, and the Bluetooth radio. 16 . The method of claim 15 , further comprising mounting the manifold to the medical device's main assembly board, and forming a fluid connection between the manifold and a blood pressure cuff connector. 17 . The method of claim 14 , wherein the medical device's main assembly board has a first surface area on a top surface of the main assembly board, wherein the carrier assembly has a second surface area, and wherein the second surface area is at least less than half of the first surface area. 18 . The method of claim 14 , wherein the main assembly board includes a printed circuit board. 19 . The method of claim 18 , further comprising carrying the sub-assembly on the printed circuit board. 20 . The method of claim 19 , wherein the sub-assembly and the printed circuit board form an integrated assembly.

Assignees

Inventors

Classifications

  • The other DC source being a battery actively interacting with the first one, i.e. battery to battery charging (with circuits for polarity protection H02J7/68) · CPC title

  • associated with components mounted in and supported by recessed areas of the PCBs · CPC title

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • Non-printed inductor · CPC title

  • Simultaneously evaluating both cardiovascular condition and temperature · CPC title

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Frequently asked questions

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What does patent US2016128585A1 cover?
A carrier assembly includes a sub-assembly including a pump, at least one solenoid valve, and a check valve. The pump, the at least one solenoid valve, and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold. Also, the carrier assembly is configured to be mounted to a medical device's main assembly board.
Who is the assignee on this patent?
Welch Allyn Inc
What technology area does this patent fall under?
Primary CPC classification A61B5/02141. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Thu May 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).