Electronic circuit component mounting system

Patent metadata

Field	Value
Publication number	US-2016128246-A1
Application number	US-201314894444-A
Country	US
Kind code	A1
Filing date	Aug 20, 2013
Priority date	May 27, 2013
Publication date	May 5, 2016
Grant date	—

Abstract

A method using an electronic circuit component mounter including a circuit substrate conveying and holding device, and a bulk feeder that is a head-side feeder which can be moved to any position on a plane inside the mounter. An electronic circuit component mounting system including a control device that performs control such that that the component holding tool positioned at a component pickup position for a component supplied from the head-side feeder and an electronic component contact each other, and the electronic circuit component and the head-side feeder contact each other during contact between the component holding tool positioned at a component mounting position and an electronic circuit component and during contact between the electronic circuit component and the circuit substrate.

First claim

1 . An electronic circuit component mounting system comprising:
a mounter main body; (a) a circuit substrate conveying and holding device held on the mounter main body that conveys and fixes and holds a circuit substrate, (b) a head main body that is moved with respect to the mounter main body by a head moving device to any position on a movement plane inside the mounter main body, (c) at least one head-side feeder held on the head main body that supplies electronic circuit components, (d) a mounting device that receives the electronic circuit component from the head-side feeder and mounts the electronic circuit components on a circuit substrate held by the circuit substrate conveying and holding device using multiple component holding tools provided on the head main body, (e) a control device that controls the circuit substrate conveying and holding device, the head moving device, the head-side feeders, and the mounting device, and (f) a control device that performs control such that, during contact between the component holding tool positioned at a component mounting position and an electronic circuit component and during contact between the electronic circuit component and the circuit substrate, the component holding tool positioned at a component pickup position of a component supplied from the head-side feeder and an electronic component contact each other, and the electronic circuit component and the head-side feeder contact each other.

2 . The electronic circuit component mounting system according to claim 1 , wherein the component mounting position and the component pickup position for components supplied by the head-side feeder are provided on the head main body at a different position on a moving plane of the head main body inside the mounter main body.

3 . The electronic circuit component mounting system according to claim 1 wherein the electronic circuit component mounting system is provided with a mounting device that receives an electronic circuit component from a mounter-side feeder provided inside the mounter main body and mounts the electronic circuit component on a circuit substrate held by the circuit substrate conveying and holding device, and the component holding tool positioned at the component mounting position receives an electronic circuit component from the mounter-side feeder.

4 . The electronic circuit component mounting system according to claim 1 , wherein the electronic circuit component mounting system is provided with a control device that performs raising/lowering axis bend correction when the component holding tool positioned at the component mounting position mounts a component on a circuit substrate held by the circuit substrate conveying and holding device, or when the component holding tool positioned at the component mounting position receives an electronic circuit component from the mounter-side feeder.

5 . The electronic circuit component mounting system according to claim 1 , wherein the component holding tool holds or releases an electronic circuit component by controlling electrically a magnetic force.

6 . The electronic circuit component mounting system according to claims 5 , wherein the head-side feeder performs component supply using magnetism.

7 . An electronic circuit component mounting system comprising:
a mounter main body; (a) a circuit substrate conveying and holding device held on the mounter main body that conveys and fixes and holds a circuit substrate, (b) a head main body that is moved with respect to the mounter main body by a head moving device to any position on a movement plane inside the mounter main body, (c) at least one head-side feeder held on the head main body that supplies electronic circuit components, (d) a mounting device that receives the electronic circuit component from the head-side feeder and mounts the electronic circuit components on a circuit substrate held by the circuit substrate conveying and holding device using multiple component holding tools provided on the head main body, (e) a control device that controls the circuit substrate conveying and holding device, the head moving device, the head-side feeders, and the mounting device, and (f) a control device that performs control such that, during contact between the component holding tool positioned at a component pickup position of a component supplied from the head-side feeder and an electronic component, and during contact between the electronic circuit component and the head-side feeder, the component holding tool positioned at a component mounting position and an electronic circuit component and contact each other and the electronic circuit component and the circuit substrate contact each other.

Assignees

• Fuji Machine Mfg

Inventors

• Kubota Tomokatsu
• Suzuki Junichi

Classifications

• H05K13/04 Primary

  Mounting of components {, e.g. of leadless components} · CPC title

• H05K13/0069

  Holders for printed circuit boards · CPC title

• H05K13/02

  Feeding of components · CPC title

• H05K13/028 Primary

  Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields · CPC title

• H05K13/041

  having multiple pick-up tools · CPC title