Fine line 3d non-planar conforming circuit
US-2016105970-A1 · Apr 14, 2016 · US
Conformal 3d non-planar multi-layer circuitry
US2016128185A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016128185-A1 |
| Application number | US-201614993197-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 12, 2016 |
| Priority date | Aug 9, 2012 |
| Publication date | May 5, 2016 |
| Grant date | — |
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- Title
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Abstract
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A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.
First claim
Opening claim text (preview).
1 - 16 . (canceled) 17 . A conformal non-planar multi-layer circuit comprising: a substrate having a first non-planar surface; a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the first non-planar surface of the substrate and having a second non-planar surface; a first conformal circuitry layer applied on the first conformal dielectric layer, the first conformal circuitry layer conforming to the second non-planar surface of the first conformal dielectric layer, the first conformal circuitry layer having a third non-planar surface; a second conformal dielectric layer deposited on the first conformal circuitry layer, the second conformal dielectric layer conforming to the third non-planar surface of the first conformal circuitry layer and having a fourth non-planar surface; and a second conformal circuitry layer applied on the second conformal dielectric layer, the second conformal circuitry layer conforming to the fourth non-planar surface of the second conformal dielectric, the second conformal circuitry layer having a fifth non-planar surface. 18 . The conformal non-planar multi-layer circuit of claim 17 , wherein the first conformal circuitry layer includes a seed layer and a conductor layer. 19 . The conformal non-planar multi-layer circuit of claim 17 , wherein the second conformal circuitry layer includes a seed layer and a conductor layer. 20 . The conformal non-planar multi-layer circuit of claim 17 , wherein the second conformal dielectric layer includes vias.
Assignees
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Classifications
- H05K1/0298Primary
Multilayer circuits · CPC title
Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title
Oxidising metal · CPC title
Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title
the metal substrate being covered by an inorganic insulating layer · CPC title
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- What does patent US2016128185A1 cover?
- A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal …
- Who is the assignee on this patent?
- Lockheed Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0298. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu May 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).