Signal paths for radio-frequency modules

Patent metadata

Field	Value
Publication number	US-2016126199-A1
Application number	US-201514927698-A
Country	US
Kind code	A1
Filing date	Oct 30, 2015
Priority date	Oct 31, 2014
Publication date	May 5, 2016
Grant date	—

Abstract

Signal paths for radio-frequency (RF) modules. In some embodiments, an RF module can include a plurality of components configured to facilitate processing of an RF signal, and a packaging substrate on which the plurality of components are mounted. The packaging substrate can have multiple layers and include an RF signal path implemented on a selected layer. Each of at least one neighboring layer above the selected layer and at least one neighboring layer below the selected layer can be configured to be sufficiently free of a ground feature relative to the RF signal path to yield a reduced parasitic capacitance while substantially maintaining a desired impedance for the RF signal path.

First claim

What is claimed is:

1 . A radio-frequency (RF) module comprising:
a plurality of components configured to facilitate processing of an RF signal; and a packaging substrate on which the plurality of components are mounted, the packaging substrate having multiple layers and including an RF signal path implemented on a selected layer, each of at least one neighboring layer above the selected layer and at least one neighboring layer below the selected layer configured to be sufficiently free of a ground feature relative to the RF signal path to yield a reduced parasitic capacitance while substantially maintaining a desired impedance for the RF signal path.

2 . The RF module of claim 1 wherein the RF module is a front-end module (FEM).

3 . The RF module of claim 2 wherein the RF signal is an amplified transmit (Tx) signal.

4 . The RF module of claim 2 wherein the RF signal is a received (Rx) signal.

5 . The RF module of claim 1 wherein the packaging substrate includes a laminate substrate.

6 . The RF module of claim 5 wherein the laminate substrate includes at least 6 layers.

7 . The RF module of claim 1 wherein each of at least one neighboring layer above the selected layer and at least one neighboring layer below the selected layer is substantially free of a ground feature that would yield parasitic capacitance with the RF signal path on the selected layer.

8 . The RF module of claim 7 wherein each of at least two neighboring layers above the selected layer and at least two neighboring layers below the selected layer is substantially free of a ground feature that would yield parasitic capacitance with the RF signal path on the selected layer.

9 . The RF module of claim 8 wherein each of the at least two neighboring layers above the selected layer and at least two neighboring layers below the selected layer is substantially free of a ground feature that overlaps with the RF signal path on the selected layer.

10 . The RF module of claim 1 wherein the desired impedance for the RF signal path includes an impedance value in a range of +/−10%, +/−5%, or +/−2% about an ideal impedance value.

11 . The RF module of claim 10 wherein the ideal impedance value is approximately 50 Ohms.

12 . The RF module of claim 1 wherein the plurality of components includes a semiconductor die having an RF integrated circuit (RFIC).

13 . The RF module of claim 12 wherein the plurality of components further includes a surface-mount technology (SMT) device.

14 . The RF module of claim 13 further comprising an overmold implemented over the packaging substrate to substantially encapsulate the plurality of components.

15 . A wireless device comprising:
a transceiver configured to process a radio-frequency (RF) signal; an RF module in communication with the transceiver, the RF module including a plurality of components configured to facilitate processing of the RF signal, the RF module further including a packaging substrate on which the plurality of components are mounted, the packaging substrate having multiple layers and including an RF signal path implemented on a selected layer, each of at least one neighboring layer above the selected layer and at least one neighboring layer below the selected layer configured to be sufficiently free of a ground feature relative to the RF signal path to yield a reduced parasitic capacitance while substantially maintaining a desired impedance for the RF signal path; and an antenna in communication with the RF module, the antenna configured to facilitate transmission and/or reception of the RF signal.

16 . The wireless device of claim 15 wherein the wireless device is a cellular phone.

17 . A device for fabrication of packaged radio-frequency (RF) modules, the device comprising:
a substrate panel having an array of units, each unit configured to be a packaging substrate for an individual packaged RF module, the substrate panel including multiple layers; and an RF signal path implemented on a selected layer of each unit of the substrate panel, each of at least one neighboring layer above the selected layer and at least one neighboring layer below the selected layer configured to be sufficiently free of a ground feature relative to the RF signal path to yield a reduced parasitic capacitance while substantially maintaining a desired impedance for the RF signal path.

18 . The device of claim 17 wherein the substrate panel includes a laminate substrate panel.

19 . The device of claim 18 wherein each of the at least one neighboring layer above the selected layer and at least one neighboring layer below the selected layer is substantially free of a ground feature that overlaps with the RF signal path on the selected layer.

20 . The device of claim 19 wherein each of the selected layer, the at least one neighboring layer above the selected layer and the at least one neighboring layer below the selected layer includes a ground feature that is sufficiently displaced laterally from the RF signal path to contribute at least partially to the maintaining of the desired impedance.

Assignees

• Skyworks Solutions Inc

Inventors

• Roy Ambarish
• Blin Guillaume Alexandre

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W44/248

  for antennas · CPC title