Film capacitor

Patent metadata

Field	Value
Publication number	US-2016126016-A1
Application number	US-201514919033-A
Country	US
Kind code	A1
Filing date	Oct 21, 2015
Priority date	Oct 28, 2014
Publication date	May 5, 2016
Grant date	—

Abstract

A film capacitor includes metalized films in each of which a metal electrode is formed on a surface of a dielectric film, the metalized films being stacked in a thickness direction. The dielectric film includes a high dielectric layer that has a relatively high content of a high dielectric filler, and a low dielectric layer that has a relatively low content of the high dielectric filler or that does not contain the high dielectric filler. The low dielectric layer is provided in at least one of a position between the high dielectric layer and the metal electrode, and a position on an opposite side of the high dielectric layer from the metal electrode.

First claim

What is claimed is:

1 . A film capacitor comprising
metalized films in each of which a metal electrode is formed on a surface of a dielectric film, the metalized films being stacked in a thickness direction, wherein: the dielectric film includes a high dielectric layer that has a relatively high content of a high dielectric filler, and a low dielectric layer that has a relatively low content of the high dielectric filler or that does not contain the high dielectric filler; and the low dielectric layer is provided in at least one of a position between the high dielectric layer and the metal electrode, and a position on an opposite side of the high dielectric layer from the metal electrode.

2 . The film capacitor according to claim 1 , wherein:
the metal electrode is provided on a surface of the high dielectric layer; and the low dielectric layer is provided on another surface of the high dielectric layer on which the metal electrode is not provided.

3 . The film capacitor according to claim 1 , wherein:
the dielectric film has a double-layer structure consisting of the high dielectric layer and the low dielectric layer; and the low dielectric layer is provided between the high dielectric layer and the metal electrode.

4 . The film capacitor according to claim 1 , wherein:
the dielectric film has a triple-layer structure consisting of the high dielectric layer and the two low dielectric layers; and one of the low dielectric layers is provided between the high dielectric layer and the metal electrode, and the other of the low dielectric layers is provided on the opposite side of the high dielectric layer from the metal electrode.

5 . The film capacitor according to claim 1 , wherein a plurality of pairs of the metalized films are superimposed on each other or a pair of the metalized films is wound such that the metalized films are stacked in the thickness direction.

Assignees

• Toyota Motor Co Ltd

Inventors

• Hase Kohei
• Saito Takahiro

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/33 Primary

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title