Materials and structures for haptic displays with simultaneous sensing and actuation

Patent metadata

Field	Value
Publication number	US-2016124548-A1
Application number	US-201514931209-A
Country	US
Kind code	A1
Filing date	Nov 3, 2015
Priority date	Nov 3, 2014
Publication date	May 5, 2016
Grant date	—

Abstract

A haptic interface device, said device comprising a substrate, a first conducting layer deposited on the substrate, with the first conducting layer being patterned to provide a first axis of individually-addressable conductive electrodes, a first insulating layer deposited on the first conducting layer, with the insulating layer having a uniform thickness, a second conducting layer deposited on the first insulating layer, with the second conducting layer being patterned to provide a second axis of individually-addressable conductive electrodes, and a dielectric layer deposited on the second conducting layer, with the dielectric layer having a uniform thickness and hardness and being scratch resistant.

First claim

1 . A haptic interface device, said device comprising:
a substrate; a first conducting layer deposited on the substrate, with the first conducting layer being patterned to provide a first axis of individually-addressable conductive electrodes; a first insulating layer deposited on the first conducting layer, with the insulating layer having a uniform thickness; a second conducting layer deposited on the first insulating layer, with the second conducting layer being patterned to provide a second axis of individually-addressable conductive electrodes; and a dielectric layer deposited on the second conducting layer, with the dielectric layer having a uniform thickness and hardness and being scratch resistant.

2 . The device of claim 1 , wherein the insulating layer is deposited across the entire surface of the first conductive layer such that the surface of the insulating layer is planar with no protrusions.

3 . The device of claim 1 , wherein the dielectric coating layer is deposited at a temperature of at least 170 C, and the substrate, the conductive layers and the insulating layer are capable of withstanding a temperature of at least 170 C without degradation.

4 . The device of claim 1 , wherein the dielectric layer further comprises alternating layers of organic and inorganic materials.

5 . The method of claim 1 , wherein the insulating layer is made of silica (SiO2).

6 . The device of claim 1 , wherein the dielectric layer is at least 1 micron thick.

7 . The device of claim 1 , wherein the dielectric layer is no more than 50 microns thick.

8 . The device of claim 1 , wherein the substrate, the conductive layers, the insulating layer, and the dielectric layer are transparent.

9 . The device of claim 1 , wherein signals for touch sensing are obtained from capacitance of each electrode, and wherein haptic effects are produced by generating an electric field between an electrode and an appendage of a user that touches a touch surface of the device.

10 . The device of claim 1 , wherein an index matching layer is provided underneath the first conductive layer.

11 . A method of forming a haptic device, the method including the steps of:
forming a substrate; depositing a first conductive layer on the substrate; patterning electrodes into the first conductive layer; depositing an insulation layer on the first conductive layer; depositing a second conductive layer on the insulation layer; patterning electrodes into the second conductive layers; and depositing a dielectric layer on the second conductive layer.

12 . The method of claim 11 , wherein the insulating layer is deposited across the entire surface of the first conductive layer such that the surface of the insulating layer is planar with no protrusions.

13 . The method of claim 11 , wherein the insulating layer is made of silica (SiO2).

14 . The method of claim 11 , wherein the dielectric layer is deposited at a temperature of at least 170 C, and the substrate, the conductive layers and the insulating layer are capable of withstanding a temperature of at least 170 C without degradation.

15 . The method of claim 11 , wherein the dielectric layer further comprises alternating layers of organic and inorganic materials.

16 . The method of claim 11 , wherein the dielectric layer is at least 1 micron thick.

17 . The method of claim 11 , wherein the dielectric layer is no more than 50 microns thick.

18 . The method of claim 11 , wherein the substrate, the conductive layers, the insulating layer, and the dielectric layer are transparent.

19 . The method of claim 11 , wherein signals for touch sensing are obtained from capacitance of each electrode, and wherein haptic effects are produced by generating an electric field between an electrode and an appendage of a user that touches a touch surface of the device.

20 . The method of claim 11 , wherein an index matching layer is provided underneath the first conductive layer.

Assignees

• Univ Northwestern

Inventors

• Cherif Mondher
• Colgate James E
• Peshkin Michael A
• Olley Michael F D
• Topel Gregory

Classifications

• G06F3/0412

  Digitisers structurally integrated in a display · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/016 Primary

  Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

• B05D7/58

  No clear coat specified · CPC title