Computer device with heat-dissipation channels

Patent metadata

Field	Value
Publication number	US-2016124473-A1
Application number	US-201514919497-A
Country	US
Kind code	A1
Filing date	Oct 21, 2015
Priority date	Oct 30, 2014
Publication date	May 5, 2016
Grant date	—

Abstract

A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

First claim

What is claimed is:

1 . A computer device with heat-dissipation channels, comprising:
a master unit, further comprising:
a main case, having at least one first connection surface, the first connection surface being disposed with at least one first hole, at least one first heat-dissipation channel inside the main case communicating with an external space through the first hole; and
a first operation member, located inside the main case, the at least one first heat-dissipation channel being extended over the first operation member; and

a peripheral unit, further comprising:
an peripheral-unit case, having at least one second connection surface, the second connection surface being disposed with at least one second hole, at least one second heat-dissipation channel inside the peripheral-unit case communicating with the external space through the second hole; and
at least one fan, located inside the peripheral-unit case at a place in a midway of the at least one second heat-dissipation channel;
wherein, when the peripheral unit is assembled to the master unit such that the first connection surface is neighbored to the second connection surface, the at least one first heat-dissipation channel, the first hole, the second hole and the at least one second heat-dissipation channel sequentially communicate with each other to be integrated as an integrated heat-dissipation channel for a first cooling airflow driven by the fan to flow therethrough.

2 . The computer device with heat-dissipation channels of claim 1 , wherein the main case further has at least one first heat-dissipation surface, the first heat-dissipation surface being disposed with at least one third hole, the third hole communicating with the at least one first heat-dissipation channel.

3 . The computer device with heat-dissipation channels of claim 2 , wherein first heat-dissipation surface is a lateral surface of the main case and the first connection surface is a bottom surface of the main case.

4 . The computer device with heat-dissipation channels of claim 1 , wherein peripheral-unit case further has at least one second heat-dissipation surface, the second heat-dissipation surface including at least one fourth hole, the fourth hole being communicating with the at least one second heat-dissipation channel.

5 . The computer device with heat-dissipation channels of claim 4 , wherein second heat-dissipation surface is a lateral surface of the peripheral-unit case and the second connection surface is a top surface of the peripheral-unit case.

6 . The computer device with heat-dissipation channels of claim 4 , wherein peripheral-unit case further has a third heat-dissipation surface, the third heat-dissipation surface being disposed with at least one fifth hole, the fifth hole communicating with the external space through at least one third heat-dissipation channel inside the peripheral-unit case, the at least one third heat-dissipation channel communicating with the fourth hole, a second cooling airflow driven by the fan being to flow through the at least one third heat-dissipation channel.

7 . The computer device with heat-dissipation channels of claim 1 , wherein peripheral unit further has a second operation member located inside the peripheral-unit case by neighboring the fan, the first operation member is a central processing unit (CPU), and the second operation member is a graphics processing unit (GPU).

Assignees

• Inventec Pudong Tech Corp
• Inventec Corp

Inventors

• Lin Chun-Chi
• Wang Feng-Ku
• Song Lung-Hsun
• Shih Chia-Cheng

Classifications

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title