Ephemeral bonding

Patent metadata

Field	Value
Publication number	US-2016122601-A1
Application number	US-201614992251-A
Country	US
Kind code	A1
Filing date	Jan 11, 2016
Priority date	Oct 31, 2013
Publication date	May 5, 2016
Grant date	—

Abstract

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

First claim

What is claimed is:

1 . A temporary bonding composition comprising a curable adhesive material, a polyether release additive, and a compatibilizer, wherein the release additive is free of silicon.

2 . The composition of claim 1 wherein the curable adhesive material is chosen from polyarylene oligomers, cyclic-olefin oligomers, arylcyclobutene oligomers, vinyl aromatic oligomers, and mixtures thereof.

3 . The composition of claim 1 wherein the release additive is chosen from polyalkylene oxide homopolymers or polyalkylene oxide copolymers.

4 . The composition of claim 1 wherein the release additive contains one or more polar end groups chosen from alkoxy, aryloxy, hydroxy, carboxylate, alkoxycarbonyl, mercapto, alkylthio, primary amine, secondary amine, and tertiary amine.

5 . The composition of claim 1 wherein the compatibilizer is a polyether comprising butylene oxide units.

6 . The composition of claim 5 wherein the compatibilizer is a polybutyleneoxide having the formula R 14 —O—(C 4 H 8 O) z —(C 3 H 6 O) y —R 15 ; wherein each of R 14 and R 15 is independently chosen from H, (C 1 -C 20 )alkyl, H—(R 16 O) w —R 17 , or (C 6 -C 20 )aryl; each R 16 and R 17 are independently (C 1 -C 6 )alkylidene; w is an integer from 1 to 5; z is an integer from 5 to 250, and y is an integer from 0 to 200.

7 . The composition of claim 1 wherein the release additive and the combatilizer are in a weight ratio of 5:1 to 1:5.

8 . The composition of claim 1 wherein the release additive phase separates from the adhesive material during curing of the adhesive material.

9 . The composition of claim 1 wherein the compatibilizer lowers an elastic modulus of the cured adhesive material, as compared to when no compatibilizer is used.

10 . The composition of claim 1 wherein the compatibilizer does not phase separate from the from the adhesive material during curing of the adhesive material.

11 . The composition of claim 1 wherein the compatibilizer increases the amount of the release additive that can be dissolved or dispersed in the adhesive material as compared to when no compatibilizer is used.

12 . The composition of claim 1 wherein the compatibilizer does not phase separate from the from the adhesive material during curing of the adhesive material.

13 . The composition of claim 1 further comprising an organic solvent.

14 . The composition of claim 13 wherein the curable adhesive material is present in an amount of 50 to 99 wt %, the polyether release additive is present in an amount of 1 to 50 wt %, and the compatibilizer is present in an amount of 1 to 40 wt %.

15 . A structure comprising: a semiconductor wafer having a front side and a back side; a carrier substrate having an attachment surface; and a temporary bonding layer disposed between the front side of the semiconductor wafer and the attachment surface of the carrier substrate; wherein the temporary bonding layer comprises a cured adhesive material, a compatibilizer and a polyether release additive, the release additive being free of silicon; wherein the temporary bonding layer is composed of a first region adjacent to the attachment surface of the carrier substrate having a relatively lower amount of release additive and a second region adjacent to the front side of the semiconductor wafer having a relatively greater amount of release additive.

16 . The structure of claim 15 wherein the cured adhesive material is a cured arylcyclobutene adhesive material.

17 . The structure of claim 16 wherein the cured adhesive material has a modulus of >1 GPa and an elongation of <20% at a breaking point.

18 . The structure of claim 15 having a lower adhesion energy between the front side of the semiconductor wafer and the temporary bonding layer as compared to an adhesion energy between the attachment surface of the carrier substrate and the temporary bonding layer.

Assignees

• Rohm & Haas Elect Mat
• Dow Global Technologies Llc

Inventors

• Bai Zhifeng
• Oliver Mark S
• Gallagher Michael K
• Tucker Christopher J
• Brantl Karen R
• Iagodkine Elissei
• Wang Zidong

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title