Chip scale light emitting device package with dome

Patent metadata

Field	Value
Publication number	US-2016118554-A1
Application number	US-201414892193-A
Country	US
Kind code	A1
Filing date	May 5, 2014
Priority date	May 20, 2013
Publication date	Apr 28, 2016
Grant date	—

Abstract

Light Emitting Devices (LEDs) are fabricated on a wafer substrate with one or more thick metal layers that provide structural support to each LED. The streets, or lanes, between individual LEDs do not include this metal, and the wafer can be easily sliced/diced into singulated self-supporting LEDs. Because these devices are self-supporting, a separate support submount is not required. Before singulation, further processes may be applied at the wafer-level; after singulation, these self-supporting LEDs may be picked and placed upon an intermediate substrate for further processing as required. In an embodiment of this invention, protective optical domes are formed over the light emitting devices at the wafer-level or while the light emitting devices are situated on the intermediate substrate.

First claim

1 . A method comprising:
forming a plurality of self-supporting light emitting devices on a first substrate, each self-supporting light emitting device including thick metal layers that have a thickness of at least 50 microns to provide this self-support, removing the first substrate, singulating the plurality of self-supporting light emitting devices, placing the plurality of self-supporting light emitting elements into wells of an intermediate substrate, without adhering the light emitting elements to the intermediate substrate, encapsulating the plurality of self-supporting light emitting devices to form a plurality of encapsulated self-supporting light emitting devices, removing the intermediate substrate, and singulating the plurality of encapsulated self-supporting light emitting devices to provide individual encapsulated self-supporting light emitting devices.

2 . (canceled)

3 . The method of claim 1 , wherein the intermediate substrate includes a dicing/sawing tape.

4 . (canceled)

5 . The method of claim 1 , wherein the placing of the plurality of self-supporting light emitting devices includes selecting the plurality of self-supporting light emitting devices based on a common light emitting characteristic.

6 . The method of claim 5 , wherein the encapsulating includes selecting a preformed sheet based on the common light emitting characteristic, and applying the preformed sheet over the plurality of self-supporting light emitting devices.

7 . The method of claim 1 , wherein the encapsulating includes forming an encapsulating structure of at least one of epoxy, silicone, and glass over each self-supporting light emitting device.

8 . The method of claim 7 , including providing a layer of wavelength-conversion material between the self-supporting light emitting device and the encapsulating structure.

9 . The method of claim 1 , wherein the encapsulating includes forming a structure that includes a wavelength-conversion material over each self-supporting light emitting device.

10 . The method of claim 1 , wherein the encapsulating includes applying a preformed sheet over the plurality of self-supporting light emitting devices.

11 . The method of claim 1 , wherein the encapsulating of the plurality of self-supporting light emitting devices includes forming a plurality of hemispherical domes.

12 - 20 . (canceled)

21 . The method of claim 1 , wherein the encapsulating includes applying an encapsulant material that extends between the self-supporting light emitting devices.

22 . The method of claim 21 , including applying a reflective material to the encapsulant material between the self-supporting light emitting devices before singulating the plurality of encapsulated self-supporting light emitting devices.

23 . The method of claim 22 , wherein applying the reflective material includes placing the reflective material on a mold, then applying the mold to the encapsulant material.

24 . The method of claim 23 , wherein the intermediate substrate is the mold.

Assignees

• Koninkl Philips Nv

Inventors

• Akram Salman
• Bhardwaj Jyoti Kiron

Classifications

• H10W20/031

  of conductive parts of the interconnections · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/853 Primary

  characterised by their shape · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/018 Primary

  Bonding of wafers · CPC title