Oxide material and semiconductor device
US-2024395942-A1 · Nov 28, 2024 · US
US2016118253A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016118253-A1 |
| Application number | US-201614989059-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 6, 2016 |
| Priority date | Jul 10, 2013 |
| Publication date | Apr 28, 2016 |
| Grant date | — |
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A metal oxide thin film according to the present invention has a peak which is attributed to 1s electrons of nitrogen in a binding energy range of 402 eV to 405 eV in an XPS spectrum obtained by X-ray photoelectron spectroscopy, in which peak areas, which are obtained by separation of peaks having a peak energy of a metal-oxygen bond attributed to 1s electrons of oxygen, satisfy the following expression. 0.9< D/E (1) (D represents a peak area of a component having a peak position in a binding energy range of 529 eV or higher and lower than 531 eV, and E represents a peak area of a component having a peak position in a binding energy range of 531 eV to 532 eV)
Opening claim text (preview).
What is claimed is: 1 . A metal oxide thin film comprising a component having a peak position which is attributed to 1s electrons of nitrogen in a binding energy range of 402 eV to 405 eV in an XPS spectrum obtained by X-ray photoelectron spectroscopy, wherein peak areas, which are obtained by separation of peaks attributed to 1s electrons of oxygen, satisfy 0.9<D/E, D represents a peak area of a component having a peak position in a binding energy range of 529 eV or higher and lower than 531 eV, and E represents a peak area of a component having a peak position in a binding energy range of 531 eV to 532 eV. 2 . The metal oxide thin film according to claim 1 , wherein in the XPS spectrum, a component having a peak position in a binding energy range of 406 eV to 408 eV is not substantially contained. 3 . The metal oxide thin film according to claim 1 , wherein 0.9<D/E≦5.5 is satisfied. 4 . The metal oxide thin film according to claim 3 , wherein 1≦D/E≦5.1 is satisfied. 5 . The metal oxide thin film according to claim 3 which is a semiconductor thin film. 6 . The metal oxide thin film according to claim 3 , wherein at least indium is contained. 7 . The metal oxide thin film according to claim 6 , wherein not only indium but also at least one metal selected from the group consisting of zinc, tin, gallium, and aluminum are contained. 8 . The metal oxide thin film according to claim 6 , wherein a content of indium is 50 atom % or higher with respect to all the metal elements contained in the metal oxide thin film. 9 . A thin film transistor comprising the metal oxide thin film according to claim 5 as an active layer. 10 . A display apparatus comprising the thin film transistor according to claim 9 . 11 . A coating solution for forming a metal oxide thin film, wherein 1<B/(A×C) is satisfied, A represents a mol concentration (mol/L) of metal components contained in the coating solution, B represents a total mol concentration (mol/L) of nitrate ions and nitrite ions in the coating solution, and C represents an average valence when the metal component is a metal oxide thin film. 12 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein 1<B/(A×C)≦1.9 is satisfied. 13 . The coating solution for forming a metal oxide thin film according to claim 12 , wherein 1.1≦B(A×C)≦1.6 is satisfied. 14 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein at least indium is contained as the metal. 15 . The coating solution for forming a metal oxide thin film according to claim 14 , wherein not only indium but also at least one metal selected from the group consisting of zinc, tin, gallium, and aluminum are contained as the metal. 16 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein the mol concentration A of the metal is 0.01 mol/L to 0.5 mol/L. 17 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein a nitrate of the at least one metal is dissolved in a solvent. 18 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein concentrated nitric acid, fuming nitric acid, or a nitrate is added. 19 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein the solvent contains methanol or methoxyethanol. 20 . A method of producing a metal oxide thin film, the method comprising: a precursor thin film forming step of forming a metal oxide precursor thin film by preparing a substrate, coating the substrate with the coating solution for forming a metal oxide thin film according to claim 11 , and drying the substrate; and a conversion step of converting the metal oxide precursor thin film into an oxide thin film of the metal. 21 . The method of producing a metal oxide thin film according to claim 20 , wherein a maximum temperature of the substrate in the conversion step is 200° C. or lower. 22 . The method of producing a metal oxide thin film according to claim 21 , wherein a maximum temperature of the substrate in the conversion step is 120° C. or higher. 23 . The method of producing a metal oxide thin film according to claim 20 , wherein the conversion step includes a step of irradiating the metal oxide precursor thin film with ultraviolet rays. 24 . The method of producing a metal oxide thin film according to claim 23 , wherein, in the ultraviolet irradiation step, the metal oxide precursor thin film is irradiated with ultraviolet rays having a wavelength of 300 nm or shorter at an intensity of 10 mW/cm 2 or higher. 25 . The method of producing a metal oxide thin film according to claim 20 , wherein, in the precursor thin film forming step, the drying is performed such that the maximum temperature of the substrate is 35° C. to 100° C. 26 . The method of producing a metal oxide thin film according to claim 20 , wherein, in the precursor thin film forming step, the coating is performed using at least one coating method selected from the group consisting of an ink jet method, a dispenser method, a relief printing method, and an intaglio printing method. 27 . A thin film transistor comprising a metal oxide thin film, which is formed using the method of producing a metal oxide thin film according to claim 20 , as an active layer. 28 . A display apparatus comprising the thin film transistor according to claim 27 .
Oxides · CPC title
using solutions · CPC title
being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title
Subject matter not provided for in other groups of this subclass · CPC title
characterised by the materials · CPC title
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