Metal oxide thin film, method of producing same, and coating solution for forming metal oxide thin film used in said method

US2016118253A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016118253-A1
Application numberUS-201614989059-A
CountryUS
Kind codeA1
Filing dateJan 6, 2016
Priority dateJul 10, 2013
Publication dateApr 28, 2016
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A metal oxide thin film according to the present invention has a peak which is attributed to 1s electrons of nitrogen in a binding energy range of 402 eV to 405 eV in an XPS spectrum obtained by X-ray photoelectron spectroscopy, in which peak areas, which are obtained by separation of peaks having a peak energy of a metal-oxygen bond attributed to 1s electrons of oxygen, satisfy the following expression. 0.9< D/E   (1) (D represents a peak area of a component having a peak position in a binding energy range of 529 eV or higher and lower than 531 eV, and E represents a peak area of a component having a peak position in a binding energy range of 531 eV to 532 eV)

First claim

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What is claimed is: 1 . A metal oxide thin film comprising a component having a peak position which is attributed to 1s electrons of nitrogen in a binding energy range of 402 eV to 405 eV in an XPS spectrum obtained by X-ray photoelectron spectroscopy, wherein peak areas, which are obtained by separation of peaks attributed to 1s electrons of oxygen, satisfy 0.9<D/E, D represents a peak area of a component having a peak position in a binding energy range of 529 eV or higher and lower than 531 eV, and E represents a peak area of a component having a peak position in a binding energy range of 531 eV to 532 eV. 2 . The metal oxide thin film according to claim 1 , wherein in the XPS spectrum, a component having a peak position in a binding energy range of 406 eV to 408 eV is not substantially contained. 3 . The metal oxide thin film according to claim 1 , wherein 0.9<D/E≦5.5 is satisfied. 4 . The metal oxide thin film according to claim 3 , wherein 1≦D/E≦5.1 is satisfied. 5 . The metal oxide thin film according to claim 3 which is a semiconductor thin film. 6 . The metal oxide thin film according to claim 3 , wherein at least indium is contained. 7 . The metal oxide thin film according to claim 6 , wherein not only indium but also at least one metal selected from the group consisting of zinc, tin, gallium, and aluminum are contained. 8 . The metal oxide thin film according to claim 6 , wherein a content of indium is 50 atom % or higher with respect to all the metal elements contained in the metal oxide thin film. 9 . A thin film transistor comprising the metal oxide thin film according to claim 5 as an active layer. 10 . A display apparatus comprising the thin film transistor according to claim 9 . 11 . A coating solution for forming a metal oxide thin film, wherein 1<B/(A×C) is satisfied, A represents a mol concentration (mol/L) of metal components contained in the coating solution, B represents a total mol concentration (mol/L) of nitrate ions and nitrite ions in the coating solution, and C represents an average valence when the metal component is a metal oxide thin film. 12 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein 1<B/(A×C)≦1.9 is satisfied. 13 . The coating solution for forming a metal oxide thin film according to claim 12 , wherein 1.1≦B(A×C)≦1.6 is satisfied. 14 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein at least indium is contained as the metal. 15 . The coating solution for forming a metal oxide thin film according to claim 14 , wherein not only indium but also at least one metal selected from the group consisting of zinc, tin, gallium, and aluminum are contained as the metal. 16 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein the mol concentration A of the metal is 0.01 mol/L to 0.5 mol/L. 17 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein a nitrate of the at least one metal is dissolved in a solvent. 18 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein concentrated nitric acid, fuming nitric acid, or a nitrate is added. 19 . The coating solution for forming a metal oxide thin film according to claim 11 , wherein the solvent contains methanol or methoxyethanol. 20 . A method of producing a metal oxide thin film, the method comprising: a precursor thin film forming step of forming a metal oxide precursor thin film by preparing a substrate, coating the substrate with the coating solution for forming a metal oxide thin film according to claim 11 , and drying the substrate; and a conversion step of converting the metal oxide precursor thin film into an oxide thin film of the metal. 21 . The method of producing a metal oxide thin film according to claim 20 , wherein a maximum temperature of the substrate in the conversion step is 200° C. or lower. 22 . The method of producing a metal oxide thin film according to claim 21 , wherein a maximum temperature of the substrate in the conversion step is 120° C. or higher. 23 . The method of producing a metal oxide thin film according to claim 20 , wherein the conversion step includes a step of irradiating the metal oxide precursor thin film with ultraviolet rays. 24 . The method of producing a metal oxide thin film according to claim 23 , wherein, in the ultraviolet irradiation step, the metal oxide precursor thin film is irradiated with ultraviolet rays having a wavelength of 300 nm or shorter at an intensity of 10 mW/cm 2 or higher. 25 . The method of producing a metal oxide thin film according to claim 20 , wherein, in the precursor thin film forming step, the drying is performed such that the maximum temperature of the substrate is 35° C. to 100° C. 26 . The method of producing a metal oxide thin film according to claim 20 , wherein, in the precursor thin film forming step, the coating is performed using at least one coating method selected from the group consisting of an ink jet method, a dispenser method, a relief printing method, and an intaglio printing method. 27 . A thin film transistor comprising a metal oxide thin film, which is formed using the method of producing a metal oxide thin film according to claim 20 , as an active layer. 28 . A display apparatus comprising the thin film transistor according to claim 27 .

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Classifications

  • Oxides · CPC title

  • using solutions · CPC title

  • being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title

  • Subject matter not provided for in other groups of this subclass · CPC title

  • characterised by the materials · CPC title

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What does patent US2016118253A1 cover?
A metal oxide thin film according to the present invention has a peak which is attributed to 1s electrons of nitrogen in a binding energy range of 402 eV to 405 eV in an XPS spectrum obtained by X-ray photoelectron spectroscopy, in which peak areas, which are obtained by separation of peaks having a peak energy of a metal-oxygen bond attributed to 1s electrons of oxygen, satisfy the following e…
Who is the assignee on this patent?
Fujifilm Corp
What technology area does this patent fall under?
Primary CPC classification H10P14/3434. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Apr 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).