Light pipe heat sink element

Patent metadata

Field	Value
Publication number	US-2016116149-A1
Application number	US-201614990716-A
Country	US
Kind code	A1
Filing date	Jan 7, 2016
Priority date	Jun 13, 2014
Publication date	Apr 28, 2016
Grant date	—

Abstract

An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.

First claim

1 .- 20 . (canceled)

21 . An assembly, comprising:
a heat sink having a side with protrusions; a first light pipe extending along the side of the heat sink, the first light pipe being configured to transmit light through a first optically transmissive core thereof, the first optically transmissive core having a first thermal conductivity; and a thermally conductive layer having a second thermal conductivity greater than the first thermal conductivity, the thermally conductive layer:
covering at least a portion of an outer surface of the first light pipe,
positioned between and in thermally conductive contact with at least a portion of the heat sink protrusions, and
configured to conduct heat away from at least a portion of the heat sink protrusions.

22 . The assembly of claim 21 , wherein the thermally conductive layer includes a metallic film deposited on at least a portion of an outer surface of the optically transmissive core.

23 . The assembly of claim 21 , wherein the thermally conductive layer includes thermally conductive paint.

24 . The assembly of claim 21 , wherein the optically transmissive core is thermally insulative.

25 . The assembly of claim 21 , comprising a second light pipe extending along the side of the heat sink, the second light pipe being configured to transmit light through a second optically transmissive core; and a second thermally conductive layer covering at least a portion of an outer surface of the second light pipe, the second thermally conductive layer having a thermal conductivity greater than a thermal conductivity of the second optically transmissive core.

26 . An assembly, comprising:
a heat sink in thermally conductive contact with a shell configured to at least partially enclose a heat-producing electronic device, the heat sink including a front side, a rear side, and a top side having protrusions extending away from the top side; a first light pipe configured to transmit light through a first optically transmissive core thereof, the first optically transmissive core having a first thermal conductivity; and a thermally conductive layer having a second thermal conductivity greater than the first thermal conductivity, the thermally conductive layer:
covering at least a portion of an outer surface of the first light pipe,
positioned between and in thermally conductive contact with at least a portion of the heat sink protrusions, and
configured to conduct heat away from at least a portion of the heat sink protrusions.

27 . The assembly of claim 26 , wherein the thermally conductive layer is configured to transmit light from the rear side of the heat sink, along the top side of the heat sink to the front side of the heat sink.

28 . The assembly of claim 26 , wherein the thermally conductive layer includes metallic foil.

29 . The assembly of claim 26 , wherein the thermally conductive layer includes a metallic film deposited on at least a portion of an outer surface of the optically transmissive core.

30 . The assembly of claim 26 , wherein the thermally conductive layer includes thermally conductive paint.

31 . The assembly of claim 26 , wherein the optically transmissive core is thermally insulative.

32 . The assembly of claim 26 , comprising the heat-producing electronic device, wherein the heat-producing electronic device includes an integrated circuit (IC).

33 . The assembly of claim 26 , comprising the heat-producing electronic device, wherein the heat-producing electronic device is an electronic module.

34 . The assembly of claim 26 , comprising the heat-producing electronic device, wherein the heat-producing electronic device is an electronic component.

35 . The assembly of claim 26 , comprising a second light pipe configured to transmit light through a second optically transmissive core; and a second thermally conductive layer covering at least a portion of an outer surface of the second light pipe, the second thermally conductive layer having a thermal conductivity greater than a thermal conductivity of the second optically transmissive core.

36 . The assembly of claim 26 , comprising the heat-producing electronic device, the heat producing electronic device including a light-emitting diode (LED) positioned to emit light into the first optically transmissive core of the first light pipe.

37 . The assembly of claim 36 , wherein the first light pipe includes a first portion configured to transmit light upwards from the LED and past the rear side of the heat sink, towards a second portion of the first light pipe optically connected to the first portion; and the second portion configured to transmit light received from the first portion from the rear side of the heat sink, along the top side of the heat sink, to the front side of the heat sink.

38 . The assembly of claim 26 , comprising a second light pipe configured to transmit light through a second optically transmissive core; and a second thermally conductive layer covering at least a portion of an outer surface of the second light pipe, the second thermally conductive layer having a thermal conductivity greater than a thermal conductivity of the second optically transmissive core.

39 . The assembly of claim 38 , comprising the heat-producing electronic device, the heat producing electronic device including at least one light-emitting diode (LED), wherein the first light pipe includes a first portion configured to transmit light upwards from the at least one LED and past the rear side of the heat sink, towards a second portion optically connected to the first portion; and a second portion configured to transmit light received from the first portion from the rear side of the heat sink, along the top side of the heat sink, to the front side of the heat sink, wherein the second light pipe includes a first portion configured to transmit light upwards from the at least one LED and past the rear side of the heat sink, towards a second portion of the second light pipe optically connected to the first portion; and the second portion configured to transmit light received from the first portion from the rear side of the heat sink, along the top side of the heat sink, to the front side of the heat sink.

40 . The assembly of claim 26 , wherein the first light pipe is in direct thermally conductive contact with the heat sink.

Assignees

• Lenovo Entpr Solutions Singapore Pte Ltd

Inventors

• Auyeung Andrew S
• Craven Michael J
• Dang Huu
• Hum Harvey

Classifications

• F21V29/89

  Metals · CPC title

• F21V29/713 Primary

  in direct thermal and mechanical contact of each other to form a single system · CPC title

• F21V29/767

  the planes containing the fins or blades having directions perpendicular to the light emitting axis · CPC title

• G02B6/0008 Primary

  the light being emitted at the end of the fibre · CPC title

• F21Y2101/02

  Mechanical Engineering · mapped topic