Insert Molding Around Glass Members for Portable Electronic Devices
US-2016212872-A1 · Jul 21, 2016 · US
US2016109974A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016109974-A1 |
| Application number | US-201514918518-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 20, 2015 |
| Priority date | Oct 21, 2014 |
| Publication date | Apr 21, 2016 |
| Grant date | — |
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A three-dimensional cover plate includes a transparent substrate, a side panel, and a first binding layer. The side panel is bonded to a part of the transparent substrate, and the first binding layer is disposed between the transparent substrate and the side panel to bond the transparent substrate and the side panel.
Opening claim text (preview).
What is claimed is: 1 . A three-dimensional cover plate, comprising: a transparent substrate; a side panel bonding to a part of the transparent substrate; and a first binding layer disposed between the transparent substrate and the side panel to bond the transparent substrate and the side panel. 2 . The three-dimensional cover plate of claim 1 , wherein the first binding layer comprises silicon-oxygen-silicon bonds, aluminum-oxygen-silicon bonds or aluminum-oxygen-aluminum bonds. 3 . The three-dimensional cover plate of claim 1 , wherein the transparent substrate and the side panel are independently formed of glass or sapphire. 4 . The three-dimensional cover plate of claim 1 , wherein the transparent substrate is a transparent composite substrate, comprising: a sapphire substrate; a glass substrate disposed below the sapphire substrate, and the side panel bonding to a part of the glass substrate; and a second binding layer bonding the sapphire substrate and the glass substrate, and the second bonding layer comprising aluminum-oxygen-silicon bonds. 5 . The three-dimensional cover plate of claim 1 , further comprising an inorganic material layer disposed between the first binding layer and the side panel, and the first binding layer comprising silicon-oxygen-silicon bonds. 6 . The three-dimensional cover plate of claim 5 , wherein the inorganic material layer is a silicon layer or a silicon dioxide layer. 7 . The three-dimensional cover plate of claim 5 , wherein the inorganic material layer has a thickness equal to or greater than 1 um. 8 . The three-dimensional cover plate of claim 1 , wherein the transparent substrate has a lower surface, and an upper surface of the side panel being bonded to a periphery of the lower surface of the transparent substrate. 9 . The three-dimensional cover plate of claim 8 , wherein the transparent substrate has a side surface adjacent to the lower surface, and the side panel has a side surface adjacent to the upper surface, the side surface of the side panel being flush with the side surface of the transparent substrate. 10 . The three-dimensional cover plate of claim 1 , wherein the transparent substrate has a side surface, and a side surface of the side panel being bonded to the side surface of the transparent substrate. 11 . The three-dimensional cover plate of claim 10 , wherein the transparent substrate has an upper surface adjacent to the side surface, and an upper surface of the side panel being flush with the upper surface of the transparent substrate. 12 . A touch panel, comprising: a three-dimensional cover plate as a cover plate of the touch panel, the three-dimensional cover plate comprising: a transparent substrate; a side panel bonding to a part of the transparent substrate; and a first binding layer disposed between the transparent substrate and the side panel to bond the transparent substrate and the side panel; and a touch sensing device disposed below a lower surface of the transparent substrate. 13 . The touch panel of claim 12 , wherein the touch sensing device is a touch sensing film adhered to the lower surface of the transparent substrate. 14 . The touch panel of claim 12 , wherein the touch sensing device comprises: a sensing electrode layer disposed at the lower surface of the transparent substrate; and a wire layer disposed at a side surface of the side panel adjacent to the lower surface of the transparent substrate, and the wire layer electrically connecting to the sensing electrode layer. 15 . The touch panel of claim 14 , further comprising a plurality of touch functional devices disposed at the side surface of the side panel.
comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} · CPC title
Touch screens · CPC title
Transparent · CPC title
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title
comprising such {particular} substance as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} · CPC title
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