Clock calibration of remote systems by roundtrip time
US-11905826-B2 · Feb 20, 2024 · US
US2016108718A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016108718-A1 |
| Application number | US-201514978757-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 22, 2015 |
| Priority date | Jun 27, 2013 |
| Publication date | Apr 21, 2016 |
| Grant date | — |
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To cool a SQUID to a stable operational temperature for a long period of time under high pressure that exceeds 1.0 MPa, a highly pressure-resistant cooling container for a sensor includes a pressure-resistant airtight container having a pressure-resistance performance of 1.0 MPa or higher, a phase transition coolant insulating container contained within the pressure-resistant airtight container, and a tube for releasing a phase transition coolant having a pressure-resistance performance of 1.0 MPa or higher and connected to the pressure-resistant airtight container.
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1 - 13 . (canceled) 14 . A highly pressure-resistant cooling container for a sensor comprising: a pressure-resistant airtight container having a pressure-resistance performance of 1.0 MPa or higher; a phase transition coolant insulating container contained within the pressure-resistant airtight container; and a tube for releasing a phase transition coolant having a pressure-resistance performance of 1.0 MPa or higher and connected to the pressure-resistant airtight container; a pressure-resistance exterior for implementing the pressure-resistance performance of 1.0 MPa or higher; a sealing material for sealing the pressure-resistant airtight container; and a protective interior provided within the pressure-resistant airtight container, wherein the pressure-resistance exterior, the sealing material and the protective interior are made of a non-magnetic material having heat resistance of 200° C. or higher. 15 . The highly pressure-resistant cooling container for a sensor according to claim 14 , wherein the phase transition coolant is liquid nitrogen, and the sensor is a high temperature superconducting SQUID. 16 . The highly pressure-resistant cooling container for a sensor according to claim 14 , wherein the phase transition coolant insulating container is a vacuum dewar made of glass of which the length is 10 to 50 times greater than the inner diameter. 17 . The highly pressure-resistant cooling container for a sensor according to claim 14 , wherein an RF shield for shielding a high frequency of 50 KHz or higher is provided inside the pressure-resistant airtight container. 18 . The highly pressure-resistant cooling container for a sensor according to claim 17 , wherein the RF shield is made of an Ni—Cu plating. 19 . The highly pressure-resistant cooling container for a sensor according to claim 14 , wherein a phase transition coolant absorbent is provided inside the phase transition coolant insulating container. 20 . The highly pressure-resistant cooling container for a sensor according to claim 14 , wherein the tube for releasing a phase transition coolant is an aggregate of a number of tubes. 21 . The highly pressure-resistant cooling container for a sensor according to claim 14 , further comprising a cable for inputting/outputting a signal connected to the pressure-resistant airtight container so that the tube for releasing a phase transition coolant is contained in the cable for inputting/outputting a signal. 22 . The highly pressure-resistant cooling container for a sensor according to claim 14 , further comprising a pressure-maintaining mechanism for maintaining the pressure inside the tube for releasing a phase transition coolant at a negative pressure relative to the pressure within the pressure-resistant airtight container and for maintaining the pressure within the pressure-resistant airtight container at 0.04 MPa to 0.13 MPa. 23 . The highly pressure-resistant cooling container for a sensor according to claim 22 , further comprising a pressure sensor inside the pressure-resistant airtight container, wherein the pressure-maintaining mechanism is a mechanism that maintains the temperature of the pressure-resistant airtight container at a constant through the control of feeding back the detected output from the pressure sensor. 24 . The highly pressure-resistant cooling container for a sensor according to claim 23 , wherein the pressure-maintaining mechanism comprising: a decompression mechanism for maintaining at a negative pressure in advance the inside of the tube for releasing a phase transition coolant; and an opening and closing mechanism for opening and closing a valve provided in the tube for releasing a phase transition coolant. 25 . The highly pressure-resistant cooling container for a sensor according to claim 24 , further comprising a cable for inputting/outputting a signal connected to the pressure-resistant airtight container, wherein the cable for inputting/outputting a signal contains a number of tubes for releasing a phase transition coolant, each of which has the same structure as the tube for releasing a phase transition coolant, in such a manner that one tube for releasing a phase transition coolant is in a such a state as to be open to the air all the time, and another tube for releasing a phase transition coolant has the inside maintained at a negative pressure and is connected to the inside of the pressure-resistant airtight container via a valve. 26 . An underground probing equipment comprising: the pressure-resistant cooling container for a sensor according to claim 14 ; and a sensor immersed in the phase transition coolant.
operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices (with electromagnetic waves G01V3/12) · CPC title
operating with magnetic or electric fields produced or modified either by the surrounding earth formation or by the detecting device (with electromagnetic waves G01V3/30) · CPC title
Protecting measuring instruments · CPC title
using liquefied gases, e.g. liquid air {(for cooling semiconductor devices H10W40/305)} · CPC title
Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title
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