Box-type vehicle-mounted control device

Patent metadata

Field	Value
Publication number	US-2016106010-A1
Application number	US-201414893774-A
Country	US
Kind code	A1
Filing date	May 12, 2014
Priority date	Jun 17, 2013
Publication date	Apr 14, 2016
Grant date	—

Abstract

Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property.
The box-type vehicle-mounted control device includes a circuit board 12 , a base 13 , and a cover 14 . In addition, a first heat radiating coating layer 31 is formed on at least one surface of the circuit board 12 , and a second heat radiating coating layer 32 is formed on an inner surface of one or both of the base 13 and the cover 14 facing the first heat radiating coating layer 31.

First claim

1 - 17 . (canceled)

18 . A vehicle-mounted control device comprising:
a circuit board on which an electronic component is mounted; a casing configured to contain the circuit board; a connection terminal configured to electrically connect the circuit board with the outside; and a connector housing configured to retain the connection terminal, wherein a heat radiating coating layer is formed on a surface layer of the connection terminal between the circuit board and the connector housing.

19 . The vehicle-mounted control device according to claim 18 ,
wherein the casing comprises a base to which the circuit board is fixed, and a cover assembled to the base so as to cover the circuit board, a first heat radiating coating layer is formed on at least one surface of the circuit board, and a second heat radiating coating layer is formed on an inner surface of one or both of the base and the cover facing the first heat radiating coating layer.

20 . The vehicle-mounted control device according to claim 18 ,
wherein the casing comprises a base to which the circuit board is fixed; and a cover assembled to the base so as to cover the circuit board, a first heat radiating coating layer is formed on one surface of the circuit board, a second heat radiating coating layer is formed on an inner surface of the base or the cover facing the first heat radiating coating layer, and a third heat radiating coating layer is formed on an outer surface of the base or cover on an inner surface of which the second heat radiating coating layer is formed.

21 . The box-type vehicle-mounted control device according to claim 19 ,
wherein the circuit board includes a connector for electrically connecting the circuit board with the outside, the connector including the required number of pin terminals and a housing including a through hole through which each of the pin terminals are inserted, and a fourth heat radiating coating layer is formed on the pin terminal so as to cover a part or all of a portion ranging from a circuit board-side couple-bonding portion to the housing.

22 . The box-type vehicle-mounted control device according to claim 21 ,
wherein the fourth heat radiating coating layer is formed so as to seal a minute gap portion formed between each of the pin terminals and each of the through holes.

23 . The box-type vehicle-mounted control device according to claim 19 ,
wherein infrared absorption regions of two, three, or four heat radiating coating layers formed in the device are overlapping with each other.

24 . The box-type vehicle-mounted control device according to claim 19 ,
wherein a thermal via is provided at a portion on which an electronic component is mounted, on the circuit board.

25 . The box-type vehicle-mounted control device according to claim 19 ,
wherein the first heat radiating coating layer is further formed at a gap portion formed between the circuit board and an electronic component mounted on the circuit board in a state of being spaced from the circuit board.

26 . The box-type vehicle-mounted control device according to claim 19 ,
wherein a heat dissipation fin is provided on an outer surface of the cover or the base on which the second heat radiating coating layer is formed.

27 . The box-type vehicle-mounted control device according to claim 19 ,
wherein a surface condition of each of the heat radiating coating layers is roughened.

28 . The box-type vehicle-mounted control device according to claim 19 ;
wherein a material being used for forming each of the heat radiating coating layers is a composite material made of organic resin to which inorganic particles have been blended.

29 . The box-type vehicle-mounted control device according to claim 28 ,
wherein, the inorganic particles being used include at least one of ceramic powders of aluminum oxide, magnesium oxide, titanium oxide, zirconia, iron oxide, copper oxide, nickel oxide, cobalt oxide, lithium oxide, zinc oxide, silicon dioxide, or the like.

30 . The box-type vehicle-mounted control device according to claim 29 ,
wherein, the ceramic powder being used has a mean particle size of 0.01 to 200 μm.

31 . The box-type vehicle-mounted control device according to claim 28 ,
wherein, the organic resin being used is synthetic resin or aqueous emulsion resin.

32 . The box-type vehicle-mounted control device according to claim 31 ,
wherein the synthetic resin being used is any of the group consisting of phenol resin, alkyd resin, melamine urea resin, epoxy resin, polyurethane resin, silicone resin, vinyl acetate resin, acrylic resin, chlorinated rubber resin, vinyl chloride resin, and fluororesin.

33 . The box-type vehicle-mounted control device according to claim 31 ,
wherein the aqueous emulsion resin being used is any of the group consisting of silicone acrylic emulsion, urethane emulsion, and acrylic emulsion.

34 . The box-type vehicle-mounted control device according to claim 19 ,
wherein a film thickness of each of the heat radiating coating layers is 1 to 200 μm.

35 . The box-type vehicle-mounted control device according to claim 19 ,
wherein a film thickness of each of the heat radiating coating layers is 20 to 40 μm.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Ito Maki
• Ishii Toshiaki
• Kamoshida Masaru
• Yoshinari Hideto
• Saito Masato
• Konno Akitoyo

Classifications

• H05K2201/10189

  Non-printed connector · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/20854 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title