Multilayer wiring board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016105960-A1
Application number	US-201514880299-A
Country	US
Kind code	A1
Filing date	Oct 12, 2015
Priority date	Oct 10, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction.

First claim

What is claimed is:

1 . A multilayer wiring board, comprising:
a main wiring board comprising a plurality of insulation layers, a plurality of first via conductors formed in the insulation layers, and a first conductive layer including a plurality of first mounting pads such that the plurality of first mounting pads is positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board; and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body comprising a second conductive layer including a plurality of second mounting pads such that the plurality of second mounting pads is positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board, wherein the plurality of first via conductors is formed such that the first via conductors have diameters which increase in a same direction.

2 . A multilayer wiring board according to claim 1 , wherein the plurality of first via conductors is formed such that the first via conductors have the diameters which increase in a direction away from the plurality of first mounting pads.

3 . A multilayer wiring board according to claim 1 , wherein the second conductive layer of the wiring structure body is not in contact with the first conductive layer of the main wiring board.

4 . A multilayer wiring board according to claim 1 , wherein the plurality of first mounting pads is formed such that the first mounting pads are embedded in the outermost insulation layer of the insulation layers and have exposed surfaces on a surface of the outermost insulation layer on a same plane.

5 . A multilayer wiring board according to claim 1 , wherein the wiring structure body comprises a plurality of second via conductors formed such that the second via conductors have diameters which increase in a different direction from the direction in which the diameters of the first via conductors increase.

6 . A multilayer wiring board according to claim 1 , wherein the plurality of first mounting pads in the main wiring board and the plurality of second mounting pads in the wiring structure body are formed such that the first and second mounting pads have mounting surfaces on a same plane.

7 . A multilayer wiring board according to claim 1 , wherein the plurality of insulation layers is formed such that the outermost insulation layer has a thickness which is the greatest of the insulation layers.

8 . A multilayer wiring board according to claim 1 , wherein the plurality of insulation layers is formed such that the outermost insulation layer comprises a plurality of resin layers comprising different materials.

9 . A multilayer wiring board according to claim 1 , wherein the plurality of insulation layers is formed such that the outermost insulation layer comprises a plurality of resin layers having different thicknesses.

10 . A multilayer Wiring board according to claim 1 , wherein the second conductive layer of the wiring structure body is a dedicated conductive layer configured to transmit signal between the first electronic component and the second electronic component.

11 . A multilayer wiring board according to claim 1 , wherein the plurality of first mounting pads in the main wiring board and the plurality of second mounting pads in the wiring structure body are formed such that the first and second mounting pads have roughed mounting surfaces, respectively.

12 . A multilayer wiring board according to claim 1 , wherein the plurality of first mounting pads in the main wiring board and the plurality of second mounting pads in the wiring structure body are formed such that the first and second mounting pads have mounting surfaces having surface treatment films, respectively.

13 . A multilayer wiring board according to claim 1 , wherein the wiring structure body comprises a heat dissipation component.

14 . A multilayer wiring board according to claim 1 , wherein the wiring structure body comprises a heat dissipation component comprising one of a metal plate, a metal-plated layer and a nanocarbon material.

15 . A multilayer wiring board according to claim 1 , wherein the second conductive layer of the wiring structure body comprises a wiring layer having a wiring width which is smaller than a wiring width of the first conductive layer of the main wiring board.

16 . A multilayer wiring board according to claim 15 , wherein the second conductive layer of the wiring structure body comprises the wiring layer having the wiring width which is in a range of 1 μm to 5 μm.

17 . A method for manufacturing a multilayer wiring board, comprising:
forming a first conductive layer comprising a plurality of first mounting pads on a support plate having a carrier copper foil such that the plurality of first mounting pads is formed on the carrier copper foil of the support plate; fixing on the carrier copper foil of the support plate a wiring structure body comprising a plurality of second via conductors and a second conductive layer including a plurality of second mounting pads such that the plurality of second mounting pads faces the carrier copper foil of the support plate; forming on the support substrate a laminated structure comprising a plurality of insulation layers and a plurality of first via conductors formed in the insulation layers such that the laminated structure covers the first conductive layer and the wiring structure body and that the first via conductors have diameters which increase in a different direction from a direction in which diameters of the second via conductors increase; and removing the support plate and the carrier cooper foil from a structure comprising the first conductive layer, the wiring structure body and the laminated structure, wherein the forming of the first conductive layer comprises forming the first mounting pads such that the plurality of first mounting pads is positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and the wiring structure body comprises the second conductive layer including the plurality of second mounting pads such that the plurality of second mounting pads is positioned to connect to the first electronic component and the second electronic component mounted to the first mounting pads.

18 . A method for manufacturing a multilayer wiring board, comprising:
forming a main wiring board comprising a plurality of insulation layers, a plurality of first via conductors formed in the insulation layers, and a first conductive layer including a plurality of first mounting pads such that the plurality of first via conductors is formed such that the first via conductors have diameters which increase in a same direction and that the plurality of first mounting pads is positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board; forming a recess portion in an outermost insulation layer of the insulation layers in the main wiring board; and fixing in the recess portion of the outermost insulation layer in the main wiring board a wiring structure body comprising a second conductive layer including a plurality of second mounting pads such that the plurality of second mounting pads is positioned to connect to the first electronic component and the second electronic component mounted on the main

Assignees

• Ibiden Co Ltd

Inventors

• Sakamoto Hajime
• Shizuno Yoshinori
• Yamada Shigeru
• Kariya Takashi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07252

  changes in structures or sizes · CPC title

• H10W72/227

  Multiple bumps having different sizes · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W70/095

  of vias therein · CPC title