Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
US-2015194331-A1 · Jul 9, 2015 · US
Temporary bonding laminates for used in manufacture of semiconductor devices and methods for manufacturing semiconductor devices
US2016104635A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016104635-A1 |
| Application number | US-201514865353-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 25, 2015 |
| Priority date | Mar 27, 2013 |
| Publication date | Apr 14, 2016 |
| Grant date | — |
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Abstract
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Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes comprising (A) a release layer and (B) an adhesive layer wherein the release layer (A) comprises (a1) a resin 1 having a softening point of 200° C. or more and (a2) a resin 2; the resin 2 after curing has capable of being dissolved at 5% by mass or more, at 25° C., in at least one of solvents selected from hexane and the like.
First claim
Opening claim text (preview).
1 . A temporary bonding laminate for used in a manufacture of semiconductor devices, comprising (A) a release layer and (B) an adhesive layer, wherein the release layer (A) comprises (a1) a resin 1 having a softening point of 200° C. or more and (a2) a resin 2 ; the resin 2 after curing has capable of being dissolved at 5% by mass or more, at 25° C., in at least one of solvents selected from hexane, heptane, ethyl acetate, acetone, methanol, ethanol, isopropanol, 1,4-dioxane, tetrahydrof…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2016104635A1 cover?
- Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature pr…
- Who is the assignee on this patent?
- Fujifilm Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/74. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).