Methods of forming structures for downhole applications, and related downhole structures and assemblies

Patent metadata

Field	Value
Publication number	US-2016101600-A1
Application number	US-201414510248-A
Country	US
Kind code	A1
Filing date	Oct 9, 2014
Priority date	Oct 9, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described.

First claim

What is claimed is:

1 . A method of forming a structure for a downhole application, comprising forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate.

2 . The method of claim 1 , wherein the interfacial material comprises at least two of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone.

3 . The method of claim 1 , wherein forming an interfacial material between opposing surfaces of a first substrate and a second substrate comprises:
forming a precursor material by mixing at least one solvent and particles of the at least one of self-reinforced polyphenylene, polysulfone, and polyphenylsulfone; providing the precursor material between the opposing surfaces of the first substrate and the second substrate; and removing the solvent from the precursor material after providing the precursor material between the opposing surfaces of the first substrate and the second substrate.

4 . The method of claim 3 , wherein forming a precursor material comprises selecting the at least one solvent to comprise at least one of water, N-methylpyrrolidone, dimethyl sulfoxide, tetrahydrofuran, diemethylformamide, dimethylacetamide, pyridine, a N-substituted pyrrole, a pyrrolidine, a piperidine, a morpholine, chloroform, 1-methoxy-2-propanol acetate, a glycol, a glycol ether, and an alcohol.

5 . The method of claim 3 , further comprising modifying a surface of at least one of the particles with at least one functional group that enhances interactions between at least one of other of the particles and the opposing surfaces of the first substrate and the second substrate prior to forming the precursor material.

6 . The method of claim 3 , wherein the precursor material further comprises at least one of a filler material, a cross-linking agent, and an adhesion promoter.

7 . The method of claim 3 , wherein providing the precursor material between the opposing surfaces of the first substrate and the second substrate comprises:
positioning the second substrate over the first substrate; and substantially simultaneously applying the precursor material over the opposing surfaces of the first substrate and the second substrate after positioning the second substrate over the first substrate.

8 . The method of claim 3 , wherein providing the precursor material between the opposing surfaces of the first substrate and the second substrate comprises:
depositing the precursor material on at least one of the first substrate and the second substrate; and adjoining the first substrate and the second substrate together with the deposited precursor material therebetween.

9 . The method of claim 3 , wherein removing the solvent from the precursor material comprises evaporating the solvent from the precursor material.

10 . The method of claim 1 , wherein forming an interfacial material between opposing surfaces of a first substrate and a second substrate comprises:
faulting a precursor material comprising a molten polymer, the molten polymer comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone; providing the precursor material between the opposing surfaces of the first substrate and the second substrate; and solidifying the precursor material.

11 . The method of claim 10 , wherein solidifying the precursor material comprises cooling the precursor material.

12 . The method of claim 1 , further comprising selecting each of the first substrate and the second substrate to independently comprise at least one of a metal and a metal alloy.

13 . The method of claim 1 , further comprising forming an adhesion promoter on at least one of the opposing surfaces of the first substrate and the second substrate prior to forming the interfacial material between the opposing surfaces of the first substrate and the second substrate.

14 . The method of claim 1 , further comprising curing the interfacial material at a temperature within a range of from about 250° C. to about 400° C.

15 . A downhole structure comprising:
a first substrate; a second substrate; and an interfacial material between the first substrate and the second substrate, the interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone.

16 . The downhole structure of claim 15 , wherein the interfacial material further comprises at least one of a filler material and an adhesion promoter.

17 . The downhole structure of claim 15 , wherein the first substrate and the second substrate each independently comprise at least one metal alloy.

18 . The downhole structure of claim 15 , further comprising at least one adhesion promoter between the interfacial material and at least one of the first substrate and the second substrate.

19 . The downhole structure of claim 18 , wherein the at least one adhesion promoter comprises at least one of zinc phosphate, aluminum phosphate, aluminum dihydrogentripolyphosphate, and cobalt oxide.

20 . A downhole assembly, comprising:
at least one downhole structure comprising:
a first substrate;
a second substrate; and
an interfacial material between the first substrate and the second substrate, the interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone.

Assignees

• Baker Hughes Inc

Inventors

• Potts Jeffrey R
• Roy Sayantan
• Johnson Michael H
• Sadana Anil K

Classifications

• B32B2037/1253

  curable adhesive · CPC title

• C08G75/20

  Polysulfones · CPC title

• B32B15/08 Primary

  of synthetic resin · CPC title

• B32B37/1284

  Application of adhesive · CPC title

• B32B37/18

  involving the assembly of discrete sheets or panels only · CPC title