Techniques for forming recess in substrate and articles including recesses

Patent metadata

Field	Value
Publication number	US-2016101499-A1
Application number	US-201414895029-A
Country	US
Kind code	A1
Filing date	May 28, 2014
Priority date	Jun 7, 2013
Publication date	Apr 14, 2016
Grant date	—

Abstract

An assembly may include a substrate defining at least one recess and a component located adjacent to the recess and attached to the substrate. In some examples, the recess may be formed by frictionally contacting a structured abrasive layer of an abrasive article with a surface of the substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate, and rotating the substrate around a rotational axis substantially perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate thereby forming the recess therein. In some examples, the recess may be formed in the substrate after the component is attached to the substrate. Moreover, the recess may be formed without using added loose abrasive particles or abrasive slurry.

First claim

1 . A method comprising:
forming an assembly comprising a substrate and component attached to a first surface of the substrate, wherein the substrate further comprises a second surface substantially opposite to the first surface; frictionally contacting a structured abrasive layer of an abrasive article with the second surface of the substrate, wherein the abrasive article comprises a structured abrasive member disposed along a peripheral surface of a support member, wherein the structured abrasive member comprises the structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member, and wherein the shaped abrasive composites comprise abrasive particles retained in a binder material; longitudinally advancing the structured abrasive layer relative to the second surface of the substrate; and rotating the substrate around a rotational axis substantially perpendicular to the second surface of the substrate such that the structured abrasive layer maintains contact with and abrades the second surface of the substrate thereby forming a recess therein.

2 . The method of claim 1 , wherein the method is carried out in the absence of added loose abrasive particles or abrasive slurry.

3 . The method of claim 1 , wherein the recess comprises at least one of a dimple, ellipsoidal recess, an oval recess, a trough, and a ring recess, and wherein the radius of curvature of the recess is substantially consistent in at least one plane substantially perpendicular to the second surface.

4 - 6 . (canceled)

7 . A method comprising:
forming a treated substrate comprising a modified surface; frictionally contacting a structured abrasive layer of an abrasive article with the modified surface of the substrate, wherein the abrasive article comprises a structured abrasive member disposed along a peripheral surface of a support member, wherein the structured abrasive member comprises the structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member, and wherein the shaped abrasive composites comprise abrasive particles retained in a binder material; longitudinally advancing the structured abrasive layer relative to the modified surface of the substrate; and rotating the substrate around a rotational axis substantially perpendicular to the modified surface of the substrate such that the structured abrasive layer maintains contact with and abrades the modified surface of the substrate thereby forming a recess therein.

8 - 10 . (canceled)

11 . The method of claim 7 , wherein the method is carried out in the absence of added loose abrasive particles or abrasive slurry.

12 . An article comprising:
a substrate comprising a surface defining a recess, wherein the recess has a substantially consistent radius of curvature in at least one plane substantially perpendicular to the surface for at least about 98% of a depth of the recess, wherein the depth of the recess is measured from the plane of the surface to a point of the recess furthest from the surface in a direction substantially normal to the plane of the surface.

13 . The article of claim 12 , wherein edge roll off from the recess to the surface of the substrate is confined to less than about 2% of the depth of the recess.

14 . The article of claim 12 , wherein the substrate comprises at least one of glass or sapphire.

15 . The article of claim 12 , wherein the article comprises an electronic device including a housing and display, and wherein the substrate comprises a portion of the housing facing an opposite direction to the display.

16 . (canceled)

17 . The article of claim 12 , wherein the article comprises an electronic device including a display, and wherein the substrate comprises a cover sheet of the display.

18 . The article of claim 12 , further comprising a component selected from the group consisting of an electronic module, a component of a display, a biometric sensor, a biomedical sensor, a speaker, a microphone, a haptic device, a presence-sensitive sensor, and combinations thereof, wherein the component is attached to the substrate.

19 . (canceled)

20 . The article of claim 18 , wherein the component is at least partially disposed within a volume defined by the recess.

21 . The article of claim 12 , wherein the surface comprises a first surface, wherein substrate further comprises a second surface substantially opposite to the first surface, the article further comprising a cylindrical passage extending between the recess and the second surface.

22 . (canceled)

23 . The article of claim 21 , further comprising a flexible membrane covering the recess and attached to the first surface, and liquid disposed in the recess and the cylindrical passage, and wherein the component comprises a reservoir.

24 . The article of claim 12 , wherein the recess comprises at least one of a dimple, an ellipsoidal recess, an oval recess, a trough and a ring recess.

25 . An assembly comprising:
a substrate comprising a recess, wherein the recess is formed by:
frictionally contacting a structured abrasive layer of an abrasive article with a surface of the substrate, wherein the abrasive article comprises a structured abrasive member disposed along a peripheral surface of a support member, wherein the structured abrasive member comprises the structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member, and wherein the shaped abrasive composites comprise abrasive particles retained in a binder material;
longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and
rotating the substrate around a rotational axis substantially perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate thereby forming the recess therein; and
a component located adjacent to the recess and attached to the substrate.

26 . The assembly of claim 25 , wherein the component is disposed at least partially within a volume defined by the recess.

27 . The assembly of claim 25 , wherein the component is selected from the group consisting of an electronic module, a component of a display, a biometric sensor, a biomedical sensor, a speaker, a microphone, a haptic device, a presence-sensitive sensor, and combinations thereof.

28 . The assembly of claim 25 , wherein the recess is formed in a first surface of the substrate, and wherein the component is located adjacent to a second surface substantially opposite to the first surface.

29 . The assembly of claim 25 , wherein the recess comprises at least one of a dimple, an ellipsoidal recess, an oval recess, a trough and a ring recess.

Assignees

• 3M Innovative Properties Co

Inventors

• Sventek Bruce A
• Bretscher Kathryn R
• Baird David G
• Fain Lee A
• Nelson Mitchell L

Classifications

• B32B3/02

  characterised by features of form at particular places, e.g. in edge regions {(non-uniform thickness B32B3/263)} · CPC title

• B24B37/24 Primary

  characterised by the composition or properties of the pad materials · CPC title

• B32B2457/00

  Electrical equipment · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• B32B9/04

  comprising such {particular} substance as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} · CPC title