Anisotropic conductive film, method of manufacturing the same, and printed circuit board using the same

Patent metadata

Field	Value
Publication number	US-2016100481-A1
Application number	US-201514755947-A
Country	US
Kind code	A1
Filing date	Jun 30, 2015
Priority date	Oct 1, 2014
Publication date	Apr 7, 2016
Grant date	—

Abstract

There are provided an anisotropic conductive film, a method of manufacturing the same, and a printed circuit board using the same. More specifically, the anisotropic conductive film according to an exemplary embodiment of the present disclosure includes an insulating mattress containing a non-conductive polymer, and a plurality of conductive cylinders formed in a direction from an upper surface to a lower surface of the insulating mattress, containing a conductive polymer. Further, the printed circuit board using the anisotropic conductive film of the present disclosure may prevent open or short between upper circuit patterns and lower circuit patterns, and allow a fine pitch between the circuit patterns, due to the structure of the anisotropic conductive film formed between the substrates.

First claim

What is claimed is:

1 . An anisotropic conductive film comprising:
an insulating mattress containing a non-conductive polymer; and a plurality of conductive cylinders formed in a direction from an upper surface to a lower surface of the insulating mattress, containing a conductive polymer.

2 . The anisotropic conductive film of claim 1 , wherein the insulating mattress and the conductive cylinder are formed of a block copolymer.

3 . The anisotropic conductive film of claim 1 , wherein the insulating mattress contains one or more selected from the group consisting of an epoxy resin and an acrylate resin.

4 . The anisotropic conductive film of claim 1 , wherein the conductive cylinder contains one or more selected from the group consisting of polyacetylene, poly(p-phenylene), polypyrrole and polyaniline.

5 . A method of manufacturing an anisotropic conductive film comprising:
stirring a composition containing a non-conductive polymer and a conductive polymer; applying the stirred composition on a release film and semi-curing the stirred composition; and removing the release film.

6 . The method of claim 5 , wherein the stirring of the composition is carried out using beads in a ball mill.

7 . The method of claim 5 , wherein the non-conductive polymer and the conductive polymer form a block copolymer by a covalent bond.

8 . The method of claim 5 , wherein the non-conductive polymer contains one or more selected from the group consisting of an epoxy resin and an acrylate resin.

9 . The method of claim 5 , wherein the conductive polymer contains one or more selected from the group consisting of polyacetylene, poly(p-phenylene), polypyrrole and polyaniline.

10 . The method of claim 5 , wherein the applying and semi-curing of the composition on the release film are carried out by a coating method selected from the group consisting of a comma coating, a roll coating, a spin coating, a slot die coating, a spray coating and an inkjet coating methods.

11 . A printed circuit board comprising:
a first substrate on which a first circuit pattern is formed; an anisotropic conductive film formed on the first substrate on which the first circuit pattern is formed; and a second substrate on which a second circuit pattern is formed, formed on the anisotropic conductive film.

Assignees

• Samsung Electro Mech

Inventors

• Kim Young Soon

Classifications

• B29C39/003

  characterised by the choice of material · CPC title

• B29K2995/0005

  Conductive · CPC title

• H01B1/20 Primary

  Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)} · CPC title

• B29L2007/008

  Wide strips, e.g. films, webs · CPC title

• H05K1/0353 Primary

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title