Acoustic Assembly and Method of Manufacturing The Same

Patent metadata

Field	Value
Publication number	US-2016100256-A1
Application number	US-201514924907-A
Country	US
Kind code	A1
Filing date	Oct 28, 2015
Priority date	Oct 30, 2013
Publication date	Apr 7, 2016
Grant date	—

Abstract

A microelectromechanical system (MEMS) microphone includes a base; a cover having a port extending therethrough; a MEMS die coupled to the cover, the MEMS die including a diaphragm and a back plate; an application specific integrated circuit (ASIC) coupled to the cover and the MEMS die; and an electrical interconnection from the ASIC to the base, the electrical interconnection being disposed on an inside surface of the cover. The base includes customer pads, the customer pads on the base being connected electrically to the ASIC via the electrical interconnection. The microphone is connected to a customer board at the base and arranged such that sound enters through the port in the cover.

First claim

What is claimed is:

1 . A microelectromechanical system (MEMS) microphone, comprising:
a base; a cover having a port extending therethrough; a MEMS die coupled to the cover, the MEMS die including a diaphragm and a back plate; an application specific integrated circuit (ASIC) coupled to the cover and the MEMS die; an electrical interconnection from the ASIC to the base, the electrical interconnection being disposed on an inside surface of the cover; wherein the base includes customer pads, the customer pads on the base being connected electrically to the ASIC via the electrical interconnection; the microphone being connected to a customer board at the base and arranged such that sound enters through the port in the cover.

2 . The MEMS microphone of claim 1 , wherein the MEMS die and the ASIC are flip-chip connected to the cover.

3 . The MEMS microphone of claim 1 , wherein a back volume is formed between the base and the cover, and a front volume is formed that communicates with the port.

4 . The MEMS microphone of claim 1 , wherein the base is a printed circuit board that comprises a plurality of layers.

5 . The MEMS microphone of claim 4 , wherein the plurality of layers comprises one or more of a substrate layer and a copper layer.

6 . The MEMS microphone of claim 1 , wherein the customer board resides in a cellular phone, a personal computer, or a tablet.

7 . A method of making a microelectromechanical system (MEMS) microphone, comprising:
attaching a MEMS die and application specific integrated circuit (ASIC) to a cover, the cover including a port; providing a base, the base with customer pads disposed on the base, the customer pads communicating electrically with the ASIC and the MEMS die on the cover; attaching the cover to the base, the attachment effective to connect the ASIC to external components via the pads and to enclose the ASIC and MEMS die; flipping the assembled base and cover over and attaching the base to a customer board so that the assembled base and cover appear to be a top port device to a customer.

8 . The method of claim 7 wherein the attaching the cover forms a seal between the cover and the base, the seal being formed with a solder, epoxy, or a combination of solder and epoxy.

9 . The method of claim 7 , wherein a back volume is formed between the base and the cover, and a front volume is formed to communicate with the port.

10 . The method of claim 7 , wherein the base comprises a plurality of layers.

11 . The method of claim 10 , wherein the plurality of layers comprises one or more of a substrate layer and a copper layer.

12 . The method of claim 7 , wherein the customer board resides in a cellular phone, a personal computer, or a tablet.

13 . The method of claim 7 , wherein the cover is formed with a laser direct structuring (LDS) material that has been laser activated.

Assignees

• Knowles Electronics Llc

Inventors

• Watson Joshua
• Del Valle Figueroa Ivelisse

Classifications

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title