Transparent conductive film and method for producing transparent conductive film

Patent metadata

Field	Value
Publication number	US-2016081184-A1
Application number	US-201514947831-A
Country	US
Kind code	A1
Filing date	Nov 20, 2015
Priority date	May 24, 2013
Publication date	Mar 17, 2016
Grant date	—

Abstract

A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra 2 /Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.

First claim

1 . A transparent conductive film comprising a support and a metal wiring portion formed thereon,
wherein at least a part of the metal wiring portion has a surface shape satisfying a condition of Ra 2 /Sm>0.01 μm and has a metal volume content of 35% or more, the Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than a thickness of a thin metal wire located in a position where a surface roughness is measured, and the Sm represents an average distance between convex portions and is 0.01 μm or more.

2 . The transparent conductive film according to claim 1 , wherein
at least the part of the metal wiring portion has Sm of 4 μm or less.

3 . The transparent conductive film according to claim 1 , wherein
at least the part of the metal wiring portion has a difference of less than 3% between the specular reflectances of a front surface and a back surface.

4 . The transparent conductive film according to claim 1 , wherein
at least the part of the metal wiring portion has a mesh pattern containing the thin metal wire.

5 . The transparent conductive film according to claim 1 , wherein
the transparent conductive film is obtained by a production method containing: an exposure step of exposing a photosensitive material having the support and a silver salt emulsion layer formed thereon; and a development step of developing the exposed silver salt emulsion layer to form a conductive pattern containing a metallic silver portion on the support.

6 . A method for producing a transparent conductive film comprising:
a step of forming a metal wiring portion on a support; and a calender step of pressing a metal member having a concave-convex surface against at least a part of the metal wiring portion, wherein the surface of the metal member has a shape with Ra 2 /Sm of more than 0.015 μm, the Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than a thickness of a thin metal wire located in a position where a surface roughness is measured, and the Sm represents an average distance between convex portions and is 0.01 μm or more.

7 . The method according to claim 6 , wherein
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire.

8 . A method for producing a transparent conductive film comprising
a step of forming a metal wiring portion on a support and a calender step of pressing a metal member having a concave-convex surface against at least a part of the metal wiring portion, wherein the surface of the metal member has such a shape that Sm is equal to or smaller than a line width of a thin metal wire in at least a part of the metal wiring portion, Ra is equal to or smaller than ⅙ of a thickness of the thin metal wire measured before the calender step, and Ra 2 /Sm is more than 0.015 μm, the Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of the thin metal wire located in a position where a surface roughness is measured, and the Sm represents an average distance between convex portions and is 0.01 μm or more.

9 . The method according to claim 8 , wherein
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire.

10 . A method for producing a transparent conductive film comprising
a step of forming a metal wiring portion on a support and a calender step of conveying a resin film having a concave-convex surface together with the metal wiring portion to press the resin film against at least a part of the metal wiring portion, wherein the surface of the resin film has a shape with Ra of more than 0.15 μm, and the Ra represents an arithmetic average roughness and is equal to or smaller than the thickness of a thin metal wire located in a position where the surface roughness is measured.

11 . The method according to claim 10 , wherein
the surface of the resin film has a shape with Ra 2 /Sm of more than 0.01 μm, and the Sm represents an average distance between convex portions and is 0.01 μm or more.

12 . The method according to claim 10 , wherein
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire.

13 . A method for producing a transparent conductive film comprising
a step of forming a metal wiring portion on a support having a concave-convex surface, wherein the surface of the support has a shape with Ra of more than 0.15 μm, and Ra 2 /Sm of more than 0.02 μm and the Ra represents an arithmetic average roughness and is equal to or smaller than a thickness of a thin metal wire located in a position where a surface roughness is measured.

14 . The method according to claim 13 , wherein
the step of forming the metal wiring portion on the support contains vapor-depositing a metal on the surface of the support.

15 . The method according to claim 13 , wherein
the step of forming the metal wiring portion on the support contains plating the surface of the support with a metal.

16 . The method according to claim 13 , wherein
at least a part of the metal wiring portion has a mesh pattern containing the thin metal wire.

Assignees

• Fujifilm Corp

Inventors

• Katagiri Kensuke
• TAJIRI Shin
• Hase Akihiko

Classifications

• H01B1/02 Primary

  mainly consisting of metals or alloys · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/09209

  Shape and layout details of conductors · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• H05K1/0296 Primary

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title