Method and apparatus for molding three-dimensional object and molding data generation method for three-dimensional object

US2016075084A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016075084-A1
Application numberUS-201514840669-A
CountryUS
Kind codeA1
Filing dateAug 31, 2015
Priority dateSep 12, 2014
Publication dateMar 17, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for molding a three-dimensional object, includes building up layers formed of bonded powder to form a three-dimensional object; and forming a support below the three-dimensional object. The method is performed by a three-dimensional object molding apparatus that includes a powder lamination molding apparatus to form a three-dimensional object by building up layers formed of bonded powder; and a molding data generator to generate data for each layer of the three-dimensional object that the powder lamination molding apparatus laminates, in which a support is formed below the three-dimensional object.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for molding a three-dimensional object, comprising: building up layers formed of bonded powder to form a three-dimensional object; and forming a support below the three-dimensional object. 2 . The method as claimed in claim 1 , further comprising providing unsolidified powder between the three-dimensional object and the support. 3 . The method as claimed in claim 1 , wherein the support has the same external shape as that of the three-dimensional object as projected onto the support. 4 . The method as claimed in claim 1 , wherein the support has a size larger than that of the three-dimensional object as projected onto the support. 5 . The method as claimed in claim 1 , further comprising setting a molding condition for molding the support different from a molding condition for molding the three-dimensional object. 6 . The method as claimed in claim 5 , further comprising: discharging liquid droplets of a molding liquid to the powder; and forming a layer in which the powder is bonded, while using the liquid droplet for molding the support, other than the liquid droplet for molding the three-dimensional object. 7 . The method as claimed in claim 1 , wherein the support is molded and dried before forming the layer of the three-dimensional object. 8 . The method as claimed in claim 1 , wherein the support is a plate. 9 . The method as claimed in claim 1 , wherein the support is a tray. 10 . A three-dimensional object molding apparatus comprising: a powder lamination molding apparatus to form a three-dimensional object by building up layers formed of bonded powder; and a molding data generator to generate data for each layer of the three-dimensional object that the powder lamination molding apparatus builds up, wherein a support is formed below the three-dimensional object. 11 . A non-transitory computer-readable medium storing computer-executable instructions which, when executed by a processor, causes a computer to: generate data for molding each layer of a three-dimensional object, wherein the three-dimensional object is formed by building up layers formed of bonded powder; and generate data for molding a support below the three-dimensional object, other than the data for molding each layer of the three-dimensional object.

Assignees

Inventors

Classifications

  • Processes of additive manufacturing · CPC title

  • Operations & Transport · mapped topic

  • B29C64/165Primary

    using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title

  • Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title

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What does patent US2016075084A1 cover?
A method for molding a three-dimensional object, includes building up layers formed of bonded powder to form a three-dimensional object; and forming a support below the three-dimensional object. The method is performed by a three-dimensional object molding apparatus that includes a powder lamination molding apparatus to form a three-dimensional object by building up layers formed of bonded powd…
Who is the assignee on this patent?
Sakura Shozo, Ricoh Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C67/0081. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Mar 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).