Method for fabricating crystalline photovoltaic cells

US2016072001A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016072001-A1
Application numberUS-201514839785-A
CountryUS
Kind codeA1
Filing dateAug 28, 2015
Priority dateSep 4, 2014
Publication dateMar 10, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for fabricating a crystalline semiconductor photovoltaic cell is disclosed. In one aspect, the method includes depositing a dielectric layer at first predetermined locations on a surface of a semiconductor substrate. The method further includes growing a doped epitaxial layer at second predetermined locations on a surface of the semiconductor substrate, the second predetermined locations being different from and non-overlapping with the first predetermined locations. The method further includes maintaining the dielectric layer as a surface passivation layer in the photovoltaic cell. The method also includes forming an emitter region, a back surface field region or a front surface field region of the photovoltaic cell from the doped epitaxial layer.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for fabricating a crystalline semiconductor photovoltaic cell, the method comprising: depositing a dielectric layer at first predetermined locations on a surface of a semiconductor substrate; and growing a doped epitaxial layer at second predetermined locations on a surface of the semiconductor substrate, the second predetermined locations being different from and non-overlapping with the first predetermined locations, wherein the dielectric layer remains on the surface of the semiconductor substrate during fabrication of the photovoltaic cell, and wherein the dielectric layer is maintained as a surface passivation layer of the photovoltaic cell. 2 . The method of claim 1 , wherein the dielectric layer is deposited at a temperature lower than 500° C. 3 . The method of claim 1 , wherein depositing the dielectric layer at the first predetermined locations comprises depositing the dielectric layer by chemical vapor deposition, atomic layer deposition, pyrolytic coating, spin coating, spray coating or dip coating. 4 . The method of claim 1 , wherein the dielectric layer comprises silicon oxide, silicon nitride, silicon carbide, oxynitride or titanium oxide. 5 . The method of claim 1 , wherein growing the doped epitaxial layer comprises growing the doped epitaxial layer at a temperature in the range between 600° C. and 1000° C. 6 . The method of claim 1 , wherein the doped epitaxial layer forms an emitter region, a back surface field region and/or a front surface field region of the photovoltaic cell. 7 . The method of claim 1 , wherein the first predetermined locations and the second predetermined locations are present on a same surface of the semiconductor substrate. 8 . The method of claim 1 , wherein the first predetermined locations and the second predetermined locations are present on opposite surfaces of the semiconductor substrate. 9 . The method of claim 1 , wherein the first predetermined locations are present on both surfaces of the semiconductor substrate. 10 . The method of claim 1 , wherein the second predetermined locations are present on both surfaces of the semiconductor substrate. 11 . The method according to claim 1 , wherein depositing the dielectric layer at the first predetermined locations comprises depositing the dielectric layer at the first predetermined locations and at the second predetermined locations, followed by removing the dielectric layer from the second predetermined locations. 12 . The method according to claim 1 , wherein growing the doped epitaxial layer at the second predetermined locations comprises exposing both surfaces of the semiconductor substrate surfaces to a precursor, the precursor used during epitaxial growth.

Assignees

Inventors

Classifications

  • Monocrystalline silicon PV cells · CPC title

  • for photovoltaic cells · CPC title

  • Back-junction photovoltaic cells, e.g. having interdigitated base-emitter regions on the back side · CPC title

  • Photovoltaic cells having only PN homojunction potential barriers · CPC title

  • Passivating · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016072001A1 cover?
A method for fabricating a crystalline semiconductor photovoltaic cell is disclosed. In one aspect, the method includes depositing a dielectric layer at first predetermined locations on a surface of a semiconductor substrate. The method further includes growing a doped epitaxial layer at second predetermined locations on a surface of the semiconductor substrate, the second predetermined locatio…
Who is the assignee on this patent?
Imec Vzw
What technology area does this patent fall under?
Primary CPC classification H10F71/121. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Mar 10 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).