Earphones

US2016066081A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016066081-A1
Application numberUS-201514938297-A
CountryUS
Kind codeA1
Filing dateNov 11, 2015
Priority dateJun 30, 2006
Publication dateMar 3, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A headphone includes a housing defining an enclosed volume, an electro-acoustic transducer dividing the enclosed volume into a front volume and a rear volume, a first port in the housing coupling the front volume to an ear canal of a user, a second port in the housing coupling the front volume to space outside the ear, a third port in the housing coupling the rear volume to space outside the ear, and an ear tip configured to surround the first port and seal the ear canal from space outside the ear. The second port has a diameter and a length that provide an acoustic mass with an acoustic impedance with a high reactive component and a low resistive component.

First claim

Opening claim text (preview).

What is claimed is: 1 . A headphone comprising: a housing defining an enclosed volume; an electro-acoustic transducer dividing the enclosed volume into a front volume and a rear volume; a first port in the housing arranged to couple the front volume to an ear canal of a user when the headphone is worn; a second port in the housing arranged to couple the front volume to space outside the ear of the user when the headphone is worn; a third port in the housing arranged to couple the rear volume to space outside the ear of the user when the headphone is worn; and an ear tip configured to surround the first port and seal the ear canal from space outside the ear when the headphone is worn; wherein the second port has a diameter and a length that provide an acoustic mass with an acoustic impedance with a high reactive component and a low resistive component. 2 . The headphone of claim 1 , wherein the second port has a diameter and a length that provide the second port with a low acoustic impedance at low frequencies and a high acoustic impedance at high frequencies. 3 . The headphone of claim 1 , wherein the ear tip is formed from materials having at least two different hardnesses. 4 . The headphone of claim 1 , further comprising a fourth port in the housing arranged to couple the front volume to space outside the ear of the user when the headphone is worn, wherein the fourth port has a diameter and a length that provide the fourth port with a high acoustic impedance with a large resistive component and a low reactive component. 5 . The headphone of claim 4 , wherein the second port and fourth port are arranged in a parallel configuration. 6 . The headphone of claim 1 , further comprising a fourth port in the housing arranged to couple the rear volume to space outside the ear of the user when the headphone is worn, wherein the third port is a resistive port and the fourth port is a reactive port. 7 . The headphone of claim 6 , wherein the third port and fourth port are arranged in a parallel configuration. 8 . The headphone of claim 7 , wherein the third port and fourth port are positioned in the housing at approximately radially opposite positions. 9 . The headphone of claim 1 , wherein the second port is positioned such that it will not be blocked when the headphone is worn. 10 . A headphone comprising: a housing defining an enclosed volume; an electro-acoustic transducer dividing the enclosed volume into a front volume and a rear volume; a first port in the housing arranged to couple the front volume to an ear canal of a user when the headphone is worn; a second port in the housing arranged to couple the front volume to space outside the ear of the user when the headphone is worn; a third port in the housing arranged to couple the rear volume to space outside the ear of the user when the headphone is worn; and an ear tip configured to surround the first port and form a seal between the housing and the ear canal when the headphone is worn. 11 . The headphone of claim 10 , wherein the ear tip is formed from materials having at least two different hardnesses. 12 . The headphone of claim 10 , wherein the second port is positioned such that it will not be blocked when the headphone is worn. 13 . The headphone of claim 10 , wherein the second port has a diameter and a length that provide the second port with a low acoustic impedance at low frequencies and a high acoustic impedance at high frequencies. 14 . The headphone of claim 10 , further comprising a fourth port in the housing arranged to couple the front volume to space outside the ear of the user when the headphone is worn, wherein the fourth port has a diameter and a length that provide the fourth port with a high acoustic impedance with a large resistive component and a low reactive component. 15 . The headphone of claim 14 , wherein the second port and fourth port are arranged in a parallel configuration. 16 . The headphone of claim 10 , further comprising a fourth port in the housing arranged to couple the rear volume to space outside the ear of the user when the headphone is worn, wherein the third port is a resistive port and the fourth port is a reactive port. 17 . The headphone of claim 16 , wherein the third port and fourth port are arranged in a parallel configuration. 18 . A headphone comprising: an ear tip configured to seal the headphone to an ear canal of a user to form an enclosed volume including the ear canal and a front cavity of the headphone, a front reactive port coupling the otherwise-sealed front cavity to space outside the headphone, to provide a consistent response across the audible spectrum, and a rear reactive port and a rear resistive port in parallel coupling a back cavity of the headhpone to space outside the headphone, to provide a high level of output for a given input signal level in combination with the seal. 19 . The headphone of claim 18 , further comprising a front resistive port coupling the front cavity to space outside the headphone in parallel to the front reactive port. 20 . The headphone of claim 18 , wherein the ear tip is formed from materials having at least two different hardnesses. 21 . The headphone of claim 18 , wherein the front reactive port is positioned such that it will not be blocked when the headphone is worn. 22 . A headphone comprising: an ear tip configured to seal the headphone to an ear canal of a user to form an enclosed volume including the ear canal and a front cavity of the headphone, a front reactive port and a front resistive port coupling the otherwise-sealed front cavity to space outside the headphone in parallel, to provide a consistent response across the audible spectrum. 23 . The headphone of claim 22 , further comprising: a rear reactive port and a rear resistive port in parallel coupling a back cavity of the headphone to space outside the headphone, to provide a high level of output for a given input signal level in combination with the seal.

Assignees

Inventors

Classifications

  • Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges · CPC title

  • H04R1/2846Primary

    Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material · CPC title

  • H04R1/1016Primary

    Earpieces of the intra-aural type · CPC title

  • Applications of wireless loudspeakers or wireless microphones · CPC title

  • for loudspeaker transducers · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016066081A1 cover?
A headphone includes a housing defining an enclosed volume, an electro-acoustic transducer dividing the enclosed volume into a front volume and a rear volume, a first port in the housing coupling the front volume to an ear canal of a user, a second port in the housing coupling the front volume to space outside the ear, a third port in the housing coupling the rear volume to space outside the ea…
Who is the assignee on this patent?
Bose Corp
What technology area does this patent fall under?
Primary CPC classification H04R1/2846. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Mar 03 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).