Method and Apparatus for Sintering Flat Ceramics

US2016060178A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016060178-A1
Application numberUS-201514933980-A
CountryUS
Kind codeA1
Filing dateNov 5, 2015
Priority dateApr 18, 2012
Publication dateMar 3, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method and apparatus for sintering flat ceramics using a mesh or lattice is described herein.

First claim

Opening claim text (preview).

What is claimed: 1 . A method of sintering a ceramic to produce a sintered ceramic plate, comprising: heating a ceramic precursor material between a first mesh and a second mesh; wherein at least a first portion of the ceramic precursor material contacts the first mesh and at least a second portion of the ceramic precursor material contacts the second mesh during heating, thereby producing a sintered ceramic plate. 2 . The method of claim 1 , wherein either or both of the first mesh and the second mesh comprise heat conductive material, the heat conductive material comprising stainless steel, iron, iron alloys, copper, copper alloys, niobium, niobium alloys, molybdenum, molybdenum alloys, nickel, nickel alloys, platinum, platinum alloys, tantalum, tantalum alloys, titanium, titanium alloys, tungsten, tungsten alloys, rhenium, rhenium alloys, or any combination thereof. 3 . The method of claim 2 , wherein the heat conductive material comprises a tungsten:molybdenum alloy. 4 . The method of claim 3 , wherein the tungsten:molybdenum alloy is about 3% molybdenum. 5 . The method of claim 1 , wherein the ceramic precursor material slidably contacts the first mesh and/or the second mesh at a plurality of substantially periodic and/or substantially uniformly distributed contact points or lines. 6 . The method of claim 5 , further comprising applying sufficient pressure to the precursor material to reduce camber of the sintered ceramic plate but allow sliding engagement of the ceramic precursor material with the first mesh and the second mesh, wherein the applying sufficient pressure comprises placing a metal plate of about 0.1 gm/cm2 to about 20 gm/cm2 on the first mesh. 7 . The method of claim 1 , wherein the ceramic precursor material is a product of a slurry of solvent, binder and ceramic particles that have been heated at a sufficiently high temperature to evaporate or burn substantially all of the binder and solvent. 8 . The method of claim 1 , wherein camber of the sintered ceramic plate is less than 50 μm/mm2 vertical displacement. 9 . The method of claim 1 , wherein either or both of the first mesh and the second mesh have a mesh size of more than about 30 wires per inch to about 100 wires per inch, and a wire diameter of less than 400 μm. 10 . The method of claim 1 , wherein either or both of the first mesh and the second mesh is configured as a plain weave or as a twill weave. 11 . The method of claim 1 , wherein the ceramic precursor material is in the form of an unsintered ceramic compact comprising an oxide material, a garnet material, a nitride material, and/or an oxynitride material. 12 . The method of claim 11 , wherein the oxide material comprises a metallic element or silicon. 13 . The method of claim 11 , wherein the garnet material comprises yttrium. 14 . The method of claim 11 , wherein the oxynitride material comprises a metallic element or silicon. 15 . The method of claim 1 , wherein either or both of the first mesh and the second mesh comprise wires intersecting at an angle of about 10°, about 15°, about 30°, about 45°, about 60°, about 80°, or about 90°. 16 . The method of claim 1 , wherein either or both of the first mesh and the second mesh have a mesh size that is the same in both dimensions, and the mesh size is about 40×40 wires per inch, about 50×50 wires per inch, about 60×60 wires per inch, about 70×70 wires per inch, or about 80×80 wires per inch. 17 . The method of claim 1 , wherein the sintered ceramic plate comprises an optionally doped yttrium aluminum garnet and/or an optionally doped lutetium aluminum garnet. 18 . The method of claim 17 , wherein the yttrium aluminum garnet is a gadolinium-doped yttrium aluminum garnet. 19 . A sintered ceramic plate produced according to the method of claim 1 . 20 . A lighting device comprising the sintered ceramic plate of claim 19 .

Assignees

Inventors

Classifications

  • based on aluminates · CPC title

  • Tolerance; Dimensional accuracy · CPC title

  • characterised by their solids loadings, i.e. the percentage of solids · CPC title

  • based on borides, nitrides, {i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides} or silicides {(containing free binder metal C22C29/00)} · CPC title

  • based on yttrium oxide · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016060178A1 cover?
A method and apparatus for sintering flat ceramics using a mesh or lattice is described herein.
Who is the assignee on this patent?
Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification C04B35/64. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Mar 03 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).