Organosilicon compound, adhesive composition and article

Patent metadata

Field	Value
Publication number	US-2016039849-A1
Application number	US-201514921268-A
Country	US
Kind code	A1
Filing date	Oct 23, 2015
Priority date	Mar 25, 2014
Publication date	Feb 11, 2016
Grant date	—

Abstract

An organosilicon compound having a hydrolyzable silyl group and a catechol group in the molecule is novel. When modified by surface treatment with an adhesive composition comprising the organosilicon compound, various inorganic materials such as glass and metals become tightly adherent to epoxy and other resins.

First claim

1 . An organosilicon compound of formula (1):

wherein R 1 to R 4 are each independently selected from the group consisting of hydrogen, substituted or unsubstituted monovalent hydrocarbon groups which may be separated by at least one bond selected from ether, thioether, carbonyl, and thiocarbonyl bonds, and organic groups of formulae (3) to (5), and at least one of R 1 to R 4 is any one of organic groups of formulae (3) to (5):

wherein R 5 is a substituted or unsubstituted divalent hydrocarbon group which may be separated by at least one bond selected from ether, thioether, carbonyl, thiocarbonyl, amino, urethane, and urea bonds, R 6 is an alkyl group of 1 to 10 carbon atoms or aryl group of 6 to 10 carbon atoms, R 7 is an alkyl group of 1 to 20 carbon atoms, alkenyl group of 2 to 10 carbon atoms, aryl group of 6 to 10 carbon atoms or acyl group of 1 to 20 carbon atoms, n is an integer of 1 to 3, and the wavy line designates a bonding site to the benzene ring.

2 . The organosilicon compound of claim 1 wherein formula (3) is formula (11) or (12):

wherein m is an integer of 1 to 8, s is an integer of 1 to 8, and R 6 , R 7 , n and the wavy line are as defined above,
formula (4) is formula (13) or (14):

wherein m is an integer of 1 to 8, s is an integer of 1 to 8, and R 6 , R 7 , n and the wavy line are as defined above,
formula (5) is formula (15):

wherein m is an integer of 1 to 8 and R 6 , R 7 , n and the wavy line are as defined above.

3 . An adhesive composition comprising the organosilicon compound of claim 1 .

4 . An article comprising a substrate having a surface treated with the adhesive composition of claim 3 .

5 . The article of claim 4 wherein the substrate is a glass fiber product selected from the group consisting of glass cloth, glass tape, glass mat, and glass paper.

6 . The article of claim 4 wherein the substrate is an inorganic filler.

7 . The article of claim 4 wherein the substrate is a ceramic or metal.

Assignees

• Shinetsu Chemical Co

Inventors

• Hirokami Munenao

Classifications

• C07F7/1804 Primary

  Compounds having Si-O-C linkages (Si-O-acyl linkages C07F7/1896) · CPC title

• C09J11/06

  organic · CPC title

• C09J2400/263

  in the substrate · CPC title

• C08K7/14

  Glass · CPC title

• C08K5/5419

  containing at least one Si—C bond · CPC title