Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder

Patent metadata

Field	Value
Publication number	US-2016018744-A1
Application number	US-201414772721-A
Country	US
Kind code	A1
Filing date	Feb 26, 2014
Priority date	Mar 27, 2013
Publication date	Jan 21, 2016
Grant date	—

Abstract

A method of manufacturing an object holder for use in a lithographic apparatus, the object holder including one or more electrically functional components, the method including: using a composite structure including a carrier sheet different from a main body of the object holder and a layered structure including one or a plurality of layers and formed on the carrier sheet; connecting the composite structure to a surface of the main body such that the layered structure is between the carrier sheet and the surface of the main body; and removing the carrier sheet from the composite structure, leaving the layered structure connected to the main body.

First claim

1 . A method of manufacturing an object holder for use in a lithographic apparatus, the object holder comprising one or more electrically functional components, the method comprising:
using a composite structure comprising a carrier sheet different from a main body of the object holder and a layered structure comprising one or a plurality of layers and formed on the carrier sheet; connecting the composite structure to a surface of the main body such that the layered structure is between the carrier sheet and the surface of the main body; and removing the carrier sheet from the composite structure, leaving the layered structure connected to the main body.

2 . The method according to claim 1 , wherein the carrier sheet comprises a surface containing silicon and the layered structure comprises a first layer formed by thermally oxidizing the surface of the carrier sheet.

3 . The method according to claim 1 , wherein the layered structure comprises one or more of the electrically functional components.

4 . The method according to claim 1 , wherein one or more of the electrically functional components is/are formed outside of the layered structure.

5 . The method according to claim 1 , wherein the one or more electrically functional components comprise one or more selected from: a heater, a sensor, and/or an electrode for electrostatically holding the object against the object holder or the object holder against an object table for supporting the object holder.

6 . The method according to claim 5 , wherein the one or more electrically functional components comprises the electrode and the electrode is formed in the main body of the object holder or to a side of the main body of the object holder opposite to where the layered structure is connected to the object holder.

7 . The method according to claim 1 , further comprising forming one or more projections configured to support an object on the layered structure, the one or more projections formed after removal of the carrier sheet from the composite structure.

8 . The method according to claim 1 , wherein a plurality of projections protrude from a surface of the main body for supporting the object, and the method further comprises:
forming a plurality of indentations penetrating through the layered structure into the carrier sheet, prior to the connection of the composite structure to the surface of the main body, the plurality of indentations spatially complementing the plurality of projections such that when the composite structure is placed onto the main body the plurality of projections engage with the plurality of indentations.

9 . The method according to claim 8 , wherein end surfaces of the projections are brought into contact with the carrier sheet in the indentations.

10 . The method according to claim 1 , wherein the composite structure is connected to the surface of the main body via an adhesive layer formed between the composite structure and the surface of the main body.

11 . The method according to claim 10 , wherein:
the adhesive layer is omitted in a selected region between the composite structure and the surface of the main body so as to allow for the layered structure to be flexed relative to the main body in the selected region.

12 . The method according to claim 11 , wherein:
the main body is provided with a through-hole corresponding to the location of the selected region to allow for the layered structure to be fed through the through-hole in the selected region, thereby allowing an electrical connection to be made to the layered structure from a side of the main body opposite to the object.

13 .- 19 . (canceled)

20 . An object holder for a lithographic apparatus, the object holder comprising:
a plurality of projections protruding from a base surface of the object holder, each projection having a proximal end at the base surface and a distal end furthest from the base surface; an electrode configured either to electrostatically clamp an object to be supported by the object holder against the projections, such that the object is held in contact with the distal ends of the projections, or to electrostatically clamp the object holder to an object table adapted to support the object holder, such that the object table is held in contact with the distal ends of the projections; a grounding layer configured to electrically connect two or more of the projections to ground or a common electrical potential; and a dielectric layer, wherein the grounding layer comprises a portion that is in between the dielectric layer and at least one of the plurality of projections that is/are connected to ground or the common electrical potential by the grounding layer.

21 . An object holder according to claim 20 , wherein the grounding layer is arranged so as not to cover any part of a distal end of at least one of the projections that is/are connected to ground or a common electrical potential by the grounding layer.

22 . An object holder according to claim 20 , wherein:
the object holder further comprises a protective layer and the grounding layer is provided in between the dielectric layer and the protective layer; and an electrical connection is provided through the protective layer between each of the projections that is connected to ground or the common electrical potential by the grounding layer and the grounding layer.

23 . An object holder according to claim 20 , wherein the grounding layer comprises Cr or CrN.

24 . An object holder according to claim 20 , wherein the grounding layer has a thickness of less than 1 micron.

25 . (canceled)

26 . A lithographic apparatus, comprising:
a patterning device holder configured to hold a patterning device; a projection system arranged to project a beam patterned by the patterning device onto a substrate; and a substrate holder arranged to hold the substrate, wherein the patterning device holder and/or the substrate holder is according to the object holder of claim 20 .

27 . (canceled)

28 . A method of manufacturing an object holder for a lithographic apparatus, the method comprising:
forming a plurality of projections protruding from a base surface, each projection having a proximal end at the base surface and a distal end furthest from the base surface; forming an electrode adapted either to electrostatically clamp an object to be supported by the object holder against the projections, such that the object is held in contact with the distal ends of the projections, or to electrostatically clamp the object holder to an object table adapted to support the object holder, such that the object table is held in contact with the distal ends of the projections; forming a grounding layer adapted to electrically connect two or more of the projections to ground or a common electrical potential; and forming a dielectric layer, wherein the grounding layer is formed so as to comprise a portion that is in between the dielectric layer and at least one of the plurality of projections that is/are connected to ground or the common electrical potential by the grounding layer.

29 . (canceled)

30 . A device manufacturing method using a lithographic apparatus, the method comprising:
projecting a beam patterned by a patterning device onto a substrate while holding the patterning device in a patterning device holder and the substrate in a substrate holder, wherein the substrate holder or the patterning device holder is

Assignees

• Asml Netherlands Bv

Inventors

• Lafarre Raymond Wilhelmus Louis
• Achanta Satish
• Filippi Matteo
• Karade Yogesh
• Nellissen Antonius Johannes Maria
• Van Der Wilk Ronal
• Van Doremalen Hendrikus Christoffel Maria
• Welters Wilhelmus Jacobus Johannes

Classifications

• G03F7/70716 Primary

  Stages · CPC title

• G03F7/70708 Primary

  being electrostatic; Electrostatically deformable vacuum chucks · CPC title