Curable Silicone Compositions, Electrically Conductive Silicone Adhesives, Methods of Making and Using Same, and Electrical Devices Containing Same

Patent metadata

Field	Value
Publication number	US-2016017185-A1
Application number	US-201414775789-A
Country	US
Kind code	A1
Filing date	Mar 13, 2014
Priority date	Mar 14, 2013
Publication date	Jan 21, 2016
Grant date	—

Abstract

A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.

First claim

1 . A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method; and wherein the curable silicone composition is characterizable by a Thixotropic Index(η 1 /η 10 ) of from 3 to 10.

2 . A curable silicone composition comprising a blend of the following ingredients:
A hydrocarbon vehicle at a concentration of from 4 to 20 weight percent based on weight of the curable silicone composition, wherein the hydrocarbon vehicle is characterizable by a boiling point from 100 to 360 degrees Celsius; A curable organosiloxane composition at a concentration of from 7 to 10 weight percent based on weight of the curable silicone composition; Cu—Ag core-shell particles at a concentration of from 70 to 89 weight percent based on weight of the curable silicone composition; and A mechanical thixotropic filler; Wherein the total concentration of silver is from 7 to 14 weight percent based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method; and Wherein the curable silicone composition is characterizable by a Thixotropic Index(ηn 1 /η 10 ) of from 3 to 10.

3 . The curable silicone composition of claim 2 characterizable by a volume resistivity less than 0.0010 Ohm-centimeter measured according to Volume Resistivity Test Method.

4 . (canceled)

5 . The curable silicone composition of claim 2 characterizable by the following limitations:
Wherein the hydrocarbon vehicle is an alkanes mixture having an initial boiling point greater than 150 degrees Celsius and an end boiling less than 300 degrees Celsius and the hydrocarbon vehicle is at a concentration of from 4 to 15 weight percent based on weight of the curable silicone composition;
Wherein the curable organosiloxane composition comprises at least one diorganosiloxane compound, a catalyst, and an adhesion promoter; wherein the at least one diorganosiloxane compound has on average per molecule at least 1 reactive moiety, wherein each reactive moiety independently is an alkenyl moiety, Si—H moiety, Si—OH moiety, Si—OR moiety, wherein R is (C 1 -C 10 )hydrocarbyl, —C(O)(C 1 -C 10 )hydrocarbyl, or —N=CR 1 R 2 , wherein each of R 1 and R 2 independently is (C 1 -C 10 )hydrocarbyl or R 1 and R 2 are taken together to form a (C 2 -C 10 )hydrocarbylene; and wherein the at least one diorganosiloxane compound is at least 50 weight percent of the curable organosiloxane composition;
Wherein the Cu—Ag core-shell particles are unsintered and are at a concentration of from 75 to 89 weight percent based on weight of the curable silicone composition;
Wherein the total concentration of silver is from 7.1 to 12 weight percent based on weight of the curable silicone composition;
Wherein the mechanical thixotropic filler is carbon nanotubes, wherein the carbon nanotubes are at a concentration of from 0.1 to 5.0 weight percent based on weight of the curable silicone composition; and
Wherein the curable silicone composition is characterizable by a volume resistivity less than 0.0010 Ohm-centimeter measured according to Volume Resistivity Test Method.

6 . The curable silicone composition of claim 5 , characterizable by the following limitations:
Wherein the hydrocarbon vehicle is an alkanes mixture; Wherein the curable organosiloxane composition comprises at least one diorganosiloxane compound, at least one organohydrogensilicon compound, a hydrosilylation catalyst, and an epoxy-functional adhesion promoter; wherein the at least one diorganosiloxane compound has on average per molecule at least 1 alkenyl moiety and the organohydrogensilicon compound has on average per molecule at least 1 Si—H moiety; and wherein the at least one diorganosiloxane compound is from 60 to 80 wt % of the curable organosiloxane composition; Wherein the Cu—Ag core-shell particles are at a concentration of from 79.5 to 86.4 weight percent based on weight of the curable silicone composition; Wherein the total concentration of silver is from 7.5 to 12 weight percent based on weight of the curable silicone composition; and Wherein the carbon nanotubes are single-walled carbon nanotubes, multi-walled carbon nanotubes, derivatized carbon nanotubes or a combination of any two or more of the single-walled carbon nanotubes, multi-walled carbon nanotubes, and derivatized carbon nanotubes; and the concentration of carbon nanotubes is from 0.2 to 2 weight percent based on weight of the curable silicone composition.

7 . The curable silicone composition of claim 6 , characterizable by the following limitations:
Wherein the alkanes mixture is an isoalkanes mixture comprising at least two of (C 9 -C 12 )isoalkanes, at least two of (C 12 -C 16 )isoalkanes or at least two of (C 16 -C 22 )isoalkanes and the hydrocarbon vehicle is at a concentration of from 4.5 to 15 weight percent based on weight of the curable silicone composition; Wherein the curable organosiloxane composition is hydrosilylation curable and comprises the at least one diorganosiloxane compound, the at least one trimethylsiloxy-terminated dimethyl organohydrogensilicon compound, a microencapsulated hydrosilylation catalyst, and a bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane; wherein the alkenyl of the diorganosiloxane is vinyl and the at least one diorganosiloxane compound has on average per molecule at least 1.1 vinyl moieties, the at least one trimethylsiloxy-terminated dimethyl organohydrogensilicon compound is and has on average per molecule at least 1.1 Si—H moieties, or the least one diorganosiloxane compound has on average per molecule at least 1.1 vinyl moieties and the at least one organohydrogensilicon compound has on average per molecule at least 1.1 Si—H moieties; wherein the at least one diorganosiloxane compound having vinyl moieties is from 70 to 75 wt % of the curable organosiloxane composition; wherein the at least one trimethylsiloxy-terminated dimethyl organohydrogensilicon compound is from 1 to 5 weight percent, the microencapsulated hydrosilylation catalyst is from 10 to 15 weight percent, and the bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane is from 5 to 10 weight percent, and together the organohydrogensilicon compound, microencapsulated hydrosilylation catalyst, and the bis(alpha,omega-glycidoxyalkyl-D3 to D6 alkyl,hydrogencyclosiloxane are from 20 to 30 wt % of the curable organosiloxane composition; Wherein the Cu—Ag core-shell particles are at a concentration of from 79.9 to 86 weight percent based on weight of the curable silicone composition; Wherein the total concentration of silver is from 7.5 to 12 weight percent based on weight of the curable silicone composition; and Wherein the carbon nanotubes are multi-walled carbon nanotubes at a concentration of from 0.50 to 1.5 weight percent based on weight of the curable silicone composition; and Wherein the curable silicone composition is characterizable by a volume resistivity less than 0.00090 Ohm-centimeter measured according to Volume Resistivity Test Method.

8 . A curable silicone composition comprising a blend of the following ingredients:
An isoalkanes

Assignees

• Dow Corning

Inventors

• Albaugh John
• Chislea Brian
• Zambova Adriana

Classifications

• C09J183/04

  Polysiloxanes · CPC title

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• C08K9/10

  Encapsulated ingredients · CPC title

• C08L83/00

  Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers · CPC title

• C08K3/08

  Metals · CPC title