Polymer thick film silver conductor with inverted cure profile behavior

Patent metadata

Field	Value
Publication number	US-2016017156-A1
Application number	US-201514736791-A
Country	US
Kind code	A1
Filing date	Jun 11, 2015
Priority date	Jul 15, 2014
Publication date	Jan 21, 2016
Grant date	—

Abstract

This invention is directed to a polymer thick film conductor composition that provides a better conductor when dried at 80° C. than when dried at 130° C., in contrast to typical PTF conductors. More specifically, the polymer thick film conductor may be used in applications where low temperature curing is required.

First claim

What is claimed is:

1 . A polymer thick film conductor composition, comprising:
(a) 30-90 wt % silver powder; and (b) 10-70 wt % organic medium comprising 10-60 wt % thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin dissolved in 40-90 wt % organic solvent consisting of triethyl phosphate, wherein the weight percent of said thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin and said triethyl phosphate organic solvent are based on the total weight of said organic medium; wherein said silver powder is dispersed in said organic medium and wherein the weight percent of said silver powder and said organic medium are based on the total weight of said polymer thick film conductor composition.

2 . The polymer thick film conductor composition of claim 1 , said silver powder comprising particles selected from the group consisting of silver flakes, silver-coated copper particles and mixtures thereof.

3 . The polymer thick film conductor composition of claim 1 , said silver powder comprising silver flakes.

4 . The polymer thick film conductor composition of claim 1 , said silver powder comprising a mixture of silver flakes and silver-coated copper particles.

5 . The polymer thick film conductor composition of claim 1 , comprising:
(a) 40-80 wt % silver powder; and (b) 20-60 wt % organic medium.

6 . The polymer thick film conductor composition of claim 5 , comprising:
(a) 58-70 wt % silver powder; and (b) 30-42 wt % organic medium.

7 . The polymer thick film conductor composition of claim 1 , said organic medium comprising 20-45 wt % thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin dissolved in 55-80 wt % organic solvent consisting of triethyl phosphate, wherein the weight percent of said thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin and said triethyl phosphate organic solvent are based on the total weight of said organic medium.

8 . The polymer thick film conductor composition of claim 7 , said organic medium comprising 25-35 wt % thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin dissolved in 65-75 wt % organic solvent consisting of triethyl phosphate, wherein the weight percent of said thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin and said triethyl phosphate organic solvent are based on the total weight of said organic medium.

9 . The polymer thick film conductor composition of claim 5 , said silver powder comprising particles selected from the group consisting of silver flakes, silver-coated copper particles and mixtures thereof.

10 . The polymer thick film conductor composition of claim 7 , said silver powder comprising particles selected from the group consisting of silver flakes, silver-coated copper particles and mixtures thereof.

11 . An electrical circuit comprising a polymer thick film conductor formed from the polymer thick film conductor composition of claim 1 .

12 . The electrical circuit of claim 11 , wherein said polymer thick film conductor composition has been dried at a temperature less than 90° C.

13 . The electrical circuit of claim 12 , wherein said polymer thick film conductor composition has been dried at a temperature of 80° C.

14 . The electrical circuit of claim 12 , said electrical circuit further comprising a substrate of polyvinylidene difluoride or polyvinyl chloride.

15 . The electrical circuit of claim 13 , said electrical circuit further comprising a substrate of polyvinylidene difluoride or polyvinyl chloride.

16 . An electrical circuit comprising a polymer thick film conductor formed from the polymer thick film conductor composition of claim 2 .

17 . The electrical circuit of claim 16 , wherein said polymer thick film conductor composition has been dried at a temperature less than 90° C.

18 . The electrical circuit of claim 17 , wherein said polymer thick film conductor composition has been dried at a temperature of 80° C.

19 . The electrical circuit of claim 17 , said electrical circuit further comprising a substrate of polyvinylidene difluoride or polyvinyl chloride.

20 . The electrical circuit of claim 18 , said electrical circuit further comprising a substrate of polyvinylidene difluoride or polyvinyl chloride.

Assignees

• Du Pont

Inventors

• Dorfman Jay Robert

Classifications

• C08K3/08 Primary

  Metals · CPC title

• C09D127/16

  Homopolymers or copolymers of vinylidene fluoride · CPC title

• C08K2003/0806

  Silver · CPC title

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title