Vacuum cleaning systems for polishing pads, and related methods

Patent metadata

Field	Value
Publication number	US-2016016283-A1
Application number	US-201414530163-A
Country	US
Kind code	A1
Filing date	Oct 31, 2014
Priority date	Jul 15, 2014
Publication date	Jan 21, 2016
Grant date	—

Abstract

Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates.

First claim

What is claimed is:

1 . A cleaning system for a polishing pad, the cleaning system comprising:
an enclosure body including an inlet opening, an exit opening, and an inner volume; a plurality of contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, and configured to position the enclosure body a predetermined distance from the working surface of the polishing pad; and a vacuum source in communication with the exit opening of the enclosure body to move fluid and debris entrained within air through the enclosure body.

2 . The cleaning system of claim 1 , further comprising a containment wall disposed within the enclosure body and extending away from the inlet opening to a lip disposed within the enclosure body, wherein the lip separates a first passageway from a second passageway of the inner volume, wherein first passageway extends from the inlet opening to the lip,
wherein the containment wall is arranged to prevent passage of the fluid and the debris from the second passageway to the first passageway.

3 . The cleaning system of claim 2 , comprising a cleaning system mount which supports the enclosure body at a first end of the enclosure body, wherein the enclosure body extends from the first end to a second end of the enclosure body opposite the first end.

4 . The cleaning system of claim 3 , wherein the containment wall is disposed between a first longitudinal side and a second longitudinal side of the enclosure body, wherein the first passageway of the inner volume is disposed between the first longitudinal side and the containment wall, and the second passageway of the inner volume is at least partially disposed between the second longitudinal side and the containment wall.

5 . The cleaning system of claim 4 , wherein the second passageway of the inner volume tapers from the first end to the second end of the enclosure body as a space between the second longitudinal side and the containment wall narrows with increasing proximity to the second end of the enclosure body.

6 . The cleaning system of claim 2 , wherein the inlet opening, the lip, and the exit opening are configured to be positioned at predetermined distances from a working surface of the polishing pad while the cleaning system removes debris from the working surface of the polishing pad, and the predetermined distance associated with the lip is greater than the predetermined distance associated with the inlet opening and the predetermined distance associated with the exit opening.

7 . The cleaning system of claim 6 , wherein the second passageway of the inner volume is positioned to enable gravity to facilitate movement of fluid disposed therein during polishing to the exit opening.

8 . The cleaning system of claim 3 , wherein the cleaning system mount comprises an actuation system which is arranged to provide relative translational movement between the polishing pad and the enclosure body.

9 . The cleaning system of claim 8 , wherein the cleaning system mount further includes a multi-flexure linkage to provide a virtual pivot point disposed between a first one of the plurality of contact members secured to the first end of the enclosure body and a second one of the plurality of contact members secured to the second end of the enclosure body.

10 . The cleaning system of claim 2 , wherein the first passageway has a uniform cross-section from the inlet opening to the lip.

11 . A method for cleaning a polishing pad, comprising:
disposing an enclosure body of a cleaning system at a predetermined position relative to a working surface of a polishing pad by forming an abutment between the polishing pad and a plurality of contact members secured to the enclosure body, the enclosure body including an inlet opening, an exit opening, and an inner volume; creating, with a vacuum source, a Venturi effect zone between the enclosure body and the working surface of the polishing pad to dislodge fluid and debris from the working surface and to entrain the fluid and the debris into an airflow; and passing the fluid and the debris entrained within the airflow through the enclosure body.

12 . The method of claim 11 , further comprising disposing a containment wall within the enclosure body and extending away from the inlet opening to a lip within the enclosure body,
wherein the lip separates a first passageway from a second passageway of the inner volume, first passageway extends from the inlet opening to the lip, and the containment wall and the lip prevents backflow of fluid and debris from the second passageway to the first passageway of the inner volume.

13 . The method of claim 11 , further comprising supporting, with a cleaning system mount, the enclosure body at a first end of the enclosure body, wherein the enclosure body extends from the first end to a second end of the enclosure body opposite the first end.

14 . The method of claim 12 , wherein the disposing the enclosure body includes positioning the inlet opening, the lip, and the exit opening at predetermined distances from the working surface of the polishing pad, and the predetermined distance associated with the lip is greater than the predetermined distance associated with the inlet opening and the predetermined distance associated with the exit opening.

15 . The method of claim 12 , wherein the disposing the enclosure body includes positioning the second passageway of the inner volume to enable gravity to move the fluid and debris disposed therein to the exit opening.

16 . The method of claim 13 , further wherein the disposing the enclosure body comprises providing relative movement between the polishing pad and the enclosure body.

17 . The method of claim 16 , further wherein the disposing the enclosure body comprises providing a virtual pivot point disposed between a first one of a plurality of contact members secured to the first end of the enclosure body and a second one of the plurality of contact members secured to a second end of the enclosure body.

18 . A chemical-mechanical polishing (CMP) system, comprising:
a polishing pad secured to a rotatable platen; a polishing head arranged to position a surface of a substrate against the polishing pad; a cleaning system for the polishing pad, the cleaning system comprising:
an enclosure body including an inlet opening, an exit opening, and an inner volume;
a plurality of contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, and configured to position the inlet opening a predetermined distance from the working surface of the polishing pad; and
a vacuum source in communication with the exit opening of the outer enclosure body to move fluid and debris entrained within air through the enclosure body.

19 . The CMP system of claim 18 , wherein the cleaning system further comprises a containment wall disposed within the enclosure body and extending away from the inlet opening to a lip disposed within the enclosure body.

20 . The CMP system of claim 19 , wherein the lip separates a first passageway from a second passageway of the inner volume, the first passageway extends from the inlet opening to the lip, and the containment wall is arranged to prevent passage of the fluid and the debris from the second passageway to the first passageway.

Assignees

• Applied Materials Inc

Inventors

• Butterfield Paul D
• Chang Shou-Sung
• Kim Bum Jick

Classifications

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title