Heat dissipating module and method of combining the same

Patent metadata

Field	Value
Publication number	US-2016014927-A1
Application number	US-201414484048-A
Country	US
Kind code	A1
Filing date	Sep 11, 2014
Priority date	Jul 11, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

In a heat dissipating module and a method of combining the heat dissipating module, the heat dissipating module includes a circuit board, a heat generating component, a heat dissipating element, and a surface mount layer. The circuit board has a through hole, and the heat generating component is corresponsive to the through hole and installed on the circuit board, and the heat dissipating element has a protruding embedding portion formed on the other side of the circuit board and embedded into the through hole. The surface mount layer is formed on a surface of the circuit board and the internal periphery of the through hole, and the heat generating component and heat dissipating element are combined with both surfaces of the circuit board respectively, and the heat generating component and the embedding portion are contacted with each other through the surface mount layer.

First claim

What is claimed is:

1 . A heat dissipating module, comprising:
a circuit board, having at least one through hole penetrating through the circuit board; a heat generating component, corresponsive to the through hole, and disposed on a surface of the circuit board; a heat dissipating element, installed on the other surface of the circuit board, and having at least one embedding portion formed on the heat dissipating element, and the embedding portion in a protruding form being recessed into the through hole; and a surface mount layer, formed on the circuit board surface and the internal periphery of the through hole, so that the heat generating component and the heat dissipating element are combined with both surfaces of the circuit board respectively, and the heat generating component in contact with the embedding portion through the surface mount layer.

2 . The heat dissipating module of claim 1 , wherein the heat dissipating element is substantially plate-shaped or n-shaped.

3 . The heat dissipating module of claim 1 , wherein the heat dissipating element has at least one fin extended therefrom.

4 . The heat dissipating module of claim 1 , wherein the heat dissipating element has a penetrating portion formed on a side of the heat dissipating element, and the circuit board has a penetrating hole formed thereon and corresponsive to the penetrating portion, and a fin is passed through and installed to the penetrating portion and the penetrating hole and combined with each other by a solder.

5 . The heat dissipating module of claim 1 , wherein the circuit board has a penetrating hole formed thereon, and a thermal conducting layer formed on the other surface of the circuit board and extended to the internal periphery of the penetrating hole, and the thermal conducting layer is in contact with a fin that passes through the penetrating hole, and the heat dissipating element is partially attached onto the thermal conducting layer.

6 . The heat dissipating module of claim 3 , wherein the fin is erected and extended in a direction towards a surface of the circuit board.

7 . The heat dissipating module of claim 1 , wherein the embedding portion has a top end which is a plane.

8 . A heat dissipating module, comprising:
a circuit board, having a first surface and a second surface, and at least one through hole formed on the circuit board and penetrating through the first surface and the second surface; a heat generating component, corresponsive to the through hole, and disposed on the first surface of the circuit board; a heat dissipating element, having a contact surface, a heat dissipating surface, and at least one embedding portion, and the embedding portion being recessed from the heat dissipating surface towards the contact surface and in a protruding form, so that the embedding portion is embedded into the through hole; and a surface mount layer, formed on the first and second surfaces and at the internal periphery of the through hole, so that the heat generating component and the heat dissipating element are combined with the first and second surfaces respectively, and the heat generating component and the embedding portion being in contact with each other through the surface mount layer.

9 . The heat dissipating module of claim 8 , wherein the heat dissipating element is substantially plate-shaped or n-shaped.

10 . The heat dissipating module of claim 8 , wherein the heat dissipating element further includes at least one fin extended therefrom.

11 . The heat dissipating module of claim 8 , wherein the heat dissipating element has a penetrating portion formed on a side of the heat dissipating element, and the circuit board has a penetrating hole formed thereon and corresponsive to the penetrating portion, and a fin is passed through the penetrating portion and the penetrating hole, and combined with each other by a solder.

12 . The heat dissipating module of claim 8 , wherein the circuit board has a penetrating hole formed thereon, and the second surface has a thermal conducting layer disposed thereon and extended to the internal periphery of the penetrating hole, and the thermal conducting layer is in contact with a fin that passes through the penetrating hole, and the heat dissipating element is partially attached onto the thermal conducting layer.

13 . The heat dissipating module of claim 10 , wherein the fin is erected and extended in a direction towards the first surface.

14 . The heat dissipating module of claim 8 , wherein the heat dissipating surface has a thermal conducting element attached thereon.

15 . The heat dissipating module of claim 8 , wherein the heat generating component is attached with a thermal conducting element.

16 . The heat dissipating module of claim 8 , wherein the embedding portion has a top end which is a plane.

17 . The heat dissipating module of claim 8 , wherein the surface mount layer further comprises a first mounting portion, a second mounting portion, a third mounting portion, and a fourth mounting portion, and the first mounting portion is formed between the first surface and the heat generating component, and the second mounting portion is formed between the second surface and the heat dissipating element, and the third mounting portion is formed at the internal periphery of the through hole, and the fourth mounting portion is formed between the embedding portion and the heat generating component.

18 . The heat dissipating module of claim 17 , wherein the third mounting portion is coupled to the first and second mounting portions, and the fourth mounting portion is coupled to the first and third mounting portions.

19 . A method of combining a heat dissipating module, comprising the steps of:
(a) preparing a circuit board, a heat generating component to be installed on the circuit board, and a heat dissipating element to be installed on the circuit board and configured to be back-to-back with the heat generating component; (b) punching a through hole through the circuit board, and aligning the through hole correspondingly between the heat generating component and the heat dissipating element; (c) forming an embedding portion on the heat dissipating element and aligning the embedding portion with the through hole; and (d) combining the heat generating component and the heat dissipating element with the circuit board by surface mount technology, and the embedding portion is in contact with the heat generating component by surface mount technology.

20 . The method of combining a heat dissipating module according to claim 19 , wherein in the step (d), the heat generating component is combined with the circuit board by the surface mount technology, and then the heat dissipating element is combined with the circuit board by the surface mount technology.

21 . The method of combining a heat dissipating module according to claim 19 , wherein in the step (d), the heat dissipating element is combined with the circuit board by the surface mount technology, and then the heat generating component is combined with the circuit board by the surface mount technology.

Assignees

• Delta Electronics Inc

Inventors

• Chen Hung-Chuan
• Liao Shih-Ching

Classifications

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title