Manufacturing method of substrate structure, substrate structure and metal component

Patent metadata

Field	Value
Publication number	US-2016014907-A1
Application number	US-201514719329-A
Country	US
Kind code	A1
Filing date	May 22, 2015
Priority date	Jul 14, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

First claim

What is claimed is:

1 . A manufacturing method of substrate structure comprising:
performing a chemical surface treatment on a metal base to form a passivation layer on a surface of the metal base; assembling the metal base to a substrate; and forming a metal pattern on the substrate, wherein the metal pattern is separated from the metal base.

2 . The manufacturing method of substrate structure according to claim 1 , wherein the step of performing the chemical surface treatment on the metal base comprises:
submerging the metal base in a solution of the thiol compound.

3 . The manufacturing method of substrate structure according to claim 1 , wherein the step of forming the metal pattern on the substrate comprises electroless plating.

4 . A substrate structure comprising:
a substrate; a metal pattern, disposed on the substrate; a metal base, disposed on the substrate; and a passivation layer, being covered on a surface of the metal base, and the passivation layer is chemically bonded to the surface of the metal base.

5 . The substrate structure according to claim 4 , wherein the passivation layer totally covers on the surface of the metal base.

6 . The substrate structure according to claim 4 , wherein a portion of the metal base is buried within the substrate and the passivation layer is disposed between the metal base and the substrate.

7 . The substrate structure according to claim 4 , wherein the metal base comprises a metal nut or a metal sheet.

8 . The substrate structure according to claim 4 , wherein the material of the metal pattern comprises Cu, Ni, Au, or any combination of the above.

9 . The substrate structure according to claim 4 , wherein the passivation layer is bonded to the surface of the metal base through alkylthiol, arylthiol, or aralkylthiol.

10 . A metal component comprising:
a metal base; and a passivation layer, covering on at least a portion of a surface of the metal base, and the passivation layer is chemically bonded to the surface of the metal base.

11 . The metal component according to claim 10 , wherein the passivation layer totally covers on the surface of the metal base.

12 . The metal component according to claim 10 , wherein the passivation layer is bonded to the surface of the metal base through alkylthiol, arylthiol, or aralkylthiol.

Assignees

• Wistron Neweb Corp

Inventors

• Chuang Tzu-Wen
• Radi Babak
• Chen Shih-Hong
• Chen Chun-Lin

Classifications

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title

• C23C18/1603

  coating on selected surface areas · CPC title

• C23C22/02

  using non-aqueous solutions · CPC title

• C25D5/34 Primary

  Pretreatment of metallic surfaces to be electroplated · CPC title

• C23C18/38

  Coating with copper · CPC title