Electronic component with built-in capacitor

Patent metadata

Field	Value
Publication number	US-2016014903-A1
Application number	US-201514862317-A
Country	US
Kind code	A1
Filing date	Sep 23, 2015
Priority date	Sep 5, 2013
Publication date	Jan 14, 2016
Grant date	—

Abstract

A capacitor element includes a plurality of flexible base material layers that are stacked upon each other, and conductor patterns that are provided on the flexible base material layers and that define a capacitor. The capacitor element also includes a flexible portion, and a rigid portion having a larger number of stacked flexible base material layers than the flexible portion. Conductor pattern pairs that define the capacitor are provided in both the flexible portion and the rigid portion. The conductor pattern pair that is provided in the rigid portion is connected in series with the conductor pattern pair that is provided in the flexible portion. The conductor pattern pair that is provided in the rigid portion has a larger number of tiers than the conductor pattern pair that is provided in the flexible portion.

First claim

What is claimed is:

1 . An electronic component with a built-in capacitor, comprising:
a plurality of flexible base material layers that are stacked upon each other; conductor patterns that are provided on the flexible base material layers and define a capacitor; a flexible portion; and a thick-walled portion having a larger number of stacked flexible base material layers than the flexible portion; wherein in both the flexible portion and the thick-walled portion, conductor pattern pairs that define the capacitor are provided when the conductor patterns oppose each other with a corresponding one of the flexible base material layers being interposed between opposing ones of the conductor patterns; and the conductor pattern pair that is provided in the thick-walled portion is connected in series with the conductor pattern pair that is provided in the flexible portion, and the conductor pattern pair that is provided in the thick-walled portion has a larger number of tiers than the conductor pattern pair that is provided in the flexible portion.

2 . The electronic component with a built-in capacitor according to claim 1 , wherein the conductor pattern pair that is provided in the flexible portion extends from the flexible portion to the thick-walled portion, and the conductor pattern pair that is provided in the flexible portion defines a portion of the conductor pattern pair that is provided in the thick-walled portion.

3 . The electronic component with a built-in capacitor according to claim 1 , wherein
the flexible portion is belt-shaped; and as viewed from a stacking direction, the flexible portion is provided with the conductor pattern pair over substantially an entire region in a longitudinal direction of the flexible portion.

4 . The electronic component with a built-in capacitor according to claim 1 , wherein
at least two of the thick-walled portions are provided; the flexible portion is disposed between the at least two thick-walled portions so as to connect the at least two thick-walled portions to each other; and an external connection terminal is provided in each of the at least two thick-walled portions.

5 . The electronic component with a built-in capacitor according to claim 1 , wherein a portion of the conductor pattern pair that is provided in the thick-walled portion defines an external connection terminal.

6 . The electronic component with a built-in capacitor according to claim 1 , further comprising a coil, wherein the capacitor and the coil define an LC circuit.

7 . The electronic component with a built-in capacitor according to claim 1 , wherein an electronic component is mounted on or built in the thick-walled portion.

8 . The electronic component with a built-in capacitor according to claim 1 , wherein the conductor pattern pair in the flexible portion extends over substantially the entire surface of the flexible portion as viewed from the stacking direction.

9 . The electronic component with a built-in capacitor according to claim 1 , wherein the conductor patterns in the thick-walled portion have a same size and a same shape as each other.

10 . The electronic component with a built-in capacitor according to claim 1 , wherein the electronic component is an LC composite element.

11 . The electronic component with a built-in capacitor according to claim 1 , wherein at least one of the conductor patterns has a meandering configuration.

12 . The electronic component with a built-in capacitor according to claim 1 , wherein the electronic component is a π low-pass filter.

13 . The electronic component with a built-in capacitor according to claim 1 , wherein at least one of the conductor patterns has a rectangular or substantially rectangular flat configuration.

14 . The electronic component with a built-in capacitor according to claim 1 , wherein at least two of the conductor patterns are connected by at least one via conductor.

15 . The electronic component with a built-in capacitor according to claim 1 , wherein the electronic component is an RF module.

16 . The electronic component with a built-in capacitor according to claim 15 , wherein the RF module includes an RFIC and a surface acoustic wave filter.

17 . The electronic component with a built-in capacitor according to claim 1 , wherein at least one of the conductor patterns has a spiral configuration and at least another one of the conductor patterns has a linear configuration.

18 . A component mounting structure comprising:
the electronic component with a built-in capacitor according to claim 1 ; a first mount board; and a second mount board; wherein the first mount board and the second mount board are connected by the capacitor.

19 . The component mounting structure according to claim 18 , wherein the flexible portion extends between the first mount board and the second mount board so as to be separated from the first mount board by an amount equal or substantially equal to a thicknesses of the thick-walled portion and a connector.

20 . The component mounting structure according to claim 18 , wherein the first mount board and the second mount board are disposed at different heights.

Assignees

• Murata Manufacturing Co

Inventors

• Kato Noboru

Classifications

• H05K3/4691

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K2201/09263

  Meander · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K1/165

  incorporating printed inductors · CPC title