Porous separator having inverse opal structure for secondary battery and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016013464-A1
Application number	US-201414771720-A
Country	US
Kind code	A1
Filing date	Oct 31, 2014
Priority date	Oct 31, 2013
Publication date	Jan 14, 2016
Grant date	—

Abstract

The present disclosure provides a porous separator substrate with an inverse opal structure obtained by using an engineering plastic resin with high heat-resistance, and a manufacturing method thereof. In the method, a non-crosslinked polymer resin is used to form an opal structure and a crosslinked polymer resin is penetrated into the opal structure and an organic solvent is used to remove the polymer particles being used to form the opal structure, thereby manufacturing a porous substrate with an inverse opal structure. According to the present disclosure, a separator having good porosity and air permeability can be provided without the problems of heat-resistance decrease, pore closing and thickness decrease.

First claim

1 . A method for manufacturing a porous substrate with an inverse opal structure, comprising:
preparing a colloid solution containing polymer particles (S 10 ); coating the colloid solution on a substrate to form a coating layer of the polymer particles with an opal structure (S 20 ); dispersing a polymer resin in a first organic solvent to obtain a polymer resin dispersion (S 30 ); filling the opal structure of the polymer particles with the polymer resin dispersion (S 40 ); and melting the polymer particles with a second solvent (S 50 ).

2 . The method of claim 1 , wherein the polymer particles are a non-crosslinked polymer, and the polymer resin is a crosslinked polymer.

3 . The method of claim 1 , wherein the polymer particles are selected from the group of consisting of syrene-butadiene rubber (SBR), polybutadiene rubber, polychloroprene (neoprene), nitrile rubber, acryl rubber, fluorinated rubber (FKM), polyvinyl chloride (PVC), polystyrene, polymethylmethacrylate (PMMA), acrylonitrile-butadiene-styrene (ABS), polyvinylidene fluoride, polyvinyl fluoride, polytetrafluoroethylene (PTFE), polyvinyl acetate or a copolymer thereof, vinylacetate-ethylene copolymer, and a mixture thereof.

4 . The method of claim 1 , wherein the polymer particles have a diameter of 0.1 to 1 μm.

5 . The method of claim 1 , wherein the polymer resin is an engineering plastic resin with high heat-resistance.

6 . The method of claim 5 , wherein the engineering plastic resin with high heat-resistance is selected from the group of consisting of polysulfone (PSF), polyethersulfone (PES), polyetherimide (PEI), polyphenylenesulfide (PPS), polyether ether ketone (PEEK), polyacrylate (PA), polyamideimide (PAI), polyimide (PI), and a mixture thereof.

7 . The method of claim 1 , wherein the first organic solvent is a chlorinated solvent.

8 . The method of claim 1 , wherein the second organic solvent is a solvent capable of melting the polymer particles selectively.

9 . An electrode assembly, comprising a cathode, an anode and a separator interposed between the cathode and the anode,
wherein the separator comprises a porous substrate manufactured by the method of claim 1 .

10 . An electrochemical device, comprising the electrode assembly of claim 9 .

11 . A porous substrate for an electrochemical device, the porous substrate having an inverse opal structure, comprising multiple pores in the inside and the surface thereof, and exhibiting a pore diameter distribution with a standard deviation of 1% to 35%.

12 . The porous substrate of claim 11 , wherein the pores have a diameter of 0.1 to 1 μm.

13 . The porous substrate of claim 11 , which comprises an engineering plastic resin with high heat-resistance.

14 . The porous substrate of claim 13 , wherein the engineering plastic resin with high heat-resistance is selected from the group of consisting of polysulfone (PSF), polyethersulfone (PES), polyetherimide (PEI), polyphenylenesulfide (PPS), polyether ether ketone (PEEK), polyacrylate (PA), polyamideimide (PAI), polyimide (PI), and a mixture thereof.

15 . The porous substrate of claim 13 , wherein the engineering plastic resin with high heat-resistance has a molecular weight of 100,000 to 10,000,000 Da.

16 . The porous substrate of claim 13 , wherein the engineering plastic resin with high heat-resistance is a linear polyimide or an aromatic heterocyclic polyimide comprising an imide group in the main chain.

17 . The porous substrate of claim 11 , which comprises a crosslinked polymer resin.

Assignees

• Lg Chemical Ltd

Inventors

• Yu Hyung-Kyun
• Kim Seok-Koo
• Ryu Bo-Kyung
• Kim Jong-Hun

Classifications

• C08J9/26 Primary

  by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out · CPC title

• H01M50/443

  Particulate material · CPC title

• H01M50/457

  comprising three or more layers · CPC title

• H01M50/423

  Polyamide resins · CPC title

• H01M50/42

  Acrylic resins · CPC title