Light emitting unit and light emitting module

Patent metadata

Field	Value
Publication number	US-2016013384-A1
Application number	US-201414474277-A
Country	US
Kind code	A1
Filing date	Sep 1, 2014
Priority date	Jul 14, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A light emitting unit includes multiple light emitting dice, a molding compound, a substrate and a patterned metal layer. Each of the light emitting dice includes a light emitting component, a first electrode and a second electrode. The molding compound encapsulates the light emitting dice and exposes a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice. The molding compound is located between the substrate and the light emitting dice. The patterned metal layer is disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice. The light emitting dice are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection by the patterned metal layer.

First claim

1 . A light emitting unit, comprising:
a plurality of light emitting dice, each of the light emitting dice comprising a light emitting component, a first electrode, and a second electrode, wherein the first electrode and the second electrode are disposed on the same side of the light emitting component, and a gap is set between the first electrode and the second electrode; a molding compound, encapsulating the light emitting dice and exposing a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice; a substrate, wherein the molding compound is located between the substrate and the light emitting dice, and the substrate is a substrate plate; and a patterned metal layer, disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice, wherein the light emitting dice are electrically connected to each other in a series connection, a parallel connection, or a series-parallel connection through the patterned metal layer.

2 . The light emitting unit as claimed in claim 1 , wherein the molding compound has a lower surface, and the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice are aligned with the lower surface of the molding compound.

3 . The light emitting unit as claimed in claim 1 , wherein the molding compound comprises a transparent molding compound or a molding compound mixed with a phosphor.

4 . The light emitting unit as claimed in claim 1 , wherein each of the light emitting dice is a flip chip light emitting die.

5 . The light emitting unit as claimed in claim 1 , wherein the light emitting unit is a flip chip light emitting unit.

6 . The light emitting unit as claimed in claim 1 , wherein a material of the substrate comprises glass, a glass phosphorous material, ceramic, or sapphire.

7 . A light emitting module, comprising:
a light emitting unit, comprising:
a plurality of light emitting dice, each of the light emitting dice comprising a light emitting component, a first electrode, and a second electrode, wherein the first electrode and the second electrode are disposed on the same side of the light emitting component, and a gap is set between the first electrode and the second electrode;
a molding compound, encapsulating the light emitting dice and exposing a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice;
a substrate, wherein the molding compound is located between the substrate and the light emitting dice, and the substrate is a substrate plate; and
a patterned metal layer, disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice, wherein the light emitting dice are electrically connected to each other in a series connection, a parallel connection, or a series-parallel connection through the patterned metal layer; and
an external circuit, disposed under the light emitting unit, wherein the light emitting unit is electrically connected with the external circuit through the patterned metal layer.

8 . The light emitting module as claimed in claim 7 , wherein the external circuit comprises a lead frame, a circuit substrate, or a printed circuit board.

9 . The light emitting module as claimed in claim 7 , wherein the external circuit comprises a carrier board, a first external contact point, and a second external contact point, and the light emitting unit is electrically connected with the first external contact point and the second external contact point respectively through the patterned metal layer.

10 . The light emitting module as claimed in claim 7 , wherein the external circuit comprises a carrier board and a patterned circuit layer corresponding to the patterned metal layer and disposed on the carrier board, and the light emitting unit is electrically connected with the patterned circuit layer through the patterned metal layer.

11 . The light emitting module as claimed in claim 10 , wherein the patterned metal layer and the patterned circuit layer are disposed conformally and correspondingly.

12 . The light emitting module as claimed in claim 10 , further comprising:
a heat dissipating component, disposed between the light emitting unit and the external circuit.

13 . The light emitting unit as claimed in claim 1 , wherein the substrate is a rigid substrate.

14 . The light emitting module as claimed in claim 7 , wherein the substrate is a rigid substrate.

Assignees

• Genesis Photonics Inc

Inventors

• Ting Shao-Ying
• Huang Kuan-Chieh
• Huang Jing-En
• Huang Yi-Ru
• Wu Sie-Jhan
• Ke Long-Lin

Classifications

• H10W90/10

  Configurations of laterally-adjacent chips · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L25/0753

  Electricity · mapped topic