Method to form primary optic with variable shapes and/or geometries without a substrate

Patent metadata

Field	Value
Publication number	US-2016013373-A1
Application number	US-201414329807-A
Country	US
Kind code	A1
Filing date	Jul 11, 2014
Priority date	Jul 11, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A submount-free light emitter package with primary optic and method of fabricating the same are disclosed, these packages and methods comprising a light emitter with an optic. The optic may have a shape, which includes a portion that is wider at a point further from the light emitter than a point which is closer. The method includes a light emitter disposed on a carrier surface with at least one structure at least partially surrounding the light emitter. The encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.

First claim

We claim:

1 . A method for fabricating a light emitter package, comprising:
providing a surface with a light emitter; providing an at least one structure at least partially surrounding said light emitter and creating a cavity; providing an encapsulant material over said light emitter in said cavity covering at least part of said light emitter such that the shape said encapsulant takes is at least partially defined by said structure; and said package is submount free.

2 . The method of claim 1 , wherein said light emitter is comprised of a LED.

3 . The method of claim 1 , further comprising providing a conversion material over said light emitter.

4 . The method of claim 1 , further comprising at least partially curing said encapsulant.

5 . The method of claim 1 , further comprising releasing said surface.

6 . The method of claim 5 , wherein said surface is a carrier.

7 . The method of claim 5 , wherein said carrier is comprised of a thermal release tape.

8 . The method of claim 6 , wherein said carrier includes a metal frame.

9 . The method of claim 1 , further comprising removing at least a portion of said structure.

10 . The method of claim 9 , wherein removing comprises pushing said package out from said structure.

11 . The method of claim 1 , wherein said primary optic has a tapered shape such that at least a portion closer to the base of said primary optic is narrower than at least a portion closer to the exit face.

12 . The method of claim 1 , wherein said primary optic is shaped to have an overhang portion.

13 . The method of claim 1 , wherein said primary optic includes wavelength conversion material.

14 . The method of claim 1 , further comprising providing a wavelength conversion material over said primary optic.

15 . The method of claim 1 , wherein said structure is permanent and comprises a portion of the package.

16 . The method of claim 1 , further comprising providing a secondary optic over said primary optic.

17 . The method of claim 1 , wherein at least a portion of said structure is reflective.

18 . The method of claim 1 , further comprising providing contacts on said light emitter.

19 . The method of claim 1 , further comprising providing a reflective layer on a side of the package opposite the optic.

20 . The method of claim 1 , further comprising providing surface patterning on said encapsulant.

21 . A light emitter package, comprising:
a light emitter; at least a package contact on said light emitter with no intervening submount between said contact and said light emitter; and an encapsulant over said light emitter forming a shaped primary optic.

22 . The light emitter package of claim 21 , wherein said primary optic is capable of beam shaping.

23 . The light emitter package of claim 21 , further comprising a structure at least partially surrounding said light emitter, said structure at least partially defining the shape of said primary optic.

24 . The light emitter package of claim 23 , wherein at least a portion of said structure is capable of being removed.

25 . The light emitter package of claim 23 , wherein said structure cooperates with a dispense process.

26 . The light emitter package of claim 23 , wherein said structure is a permanent portion of said package.

27 . The light emitter package of claim 23 , wherein at least a portion of said structure is reflective.

28 . The light emitter package of claim 21 , wherein said primary optic is shaped to have an overhang portion.

29 . The light emitter package of claim 21 , wherein said primary optic includes wavelength conversion material.

30 . The light emitter package of claim 21 , further comprising a wavelength conversion material over said primary optic.

31 . The light emitter package of claim 21 , wherein said encapsulant is dispensed over said light emitter.

32 . The light emitter package of claim 21 , wherein said encapsulant is comprised of silicone.

33 . The light emitter package of claim 21 further comprising a secondary optic over said primary optic.

34 . The light emitter package of claim 21 , wherein said primary optic has a tapered shape such that at least a portion closer to the base of said primary optic is narrower than at least a portion closer to the exit face.

35 . The light emitter package of claim 21 , wherein said primary optic has a parabolic shape.

36 . The light emitter package of claim 21 , wherein said package is a cavity optic with a tapered primary optic and reflective cavity walls.

37 . The light emitter package of claim 36 , further comprising a glass lens over said encapsulant.

38 . The light emitter package of claim 21 , further comprising a conversion material over said light emitter.

39 . The light emitter package of claim 21 , wherein said light emitter is on a removable carrier surface, in which said removable carrier surface is a thermal release tape.

40 . The light emitter package of claim 39 , wherein said removable carrier surface is a thermal release tape.

41 . The light emitter package of claim 39 , wherein said removable carrier surface further comprises a metal frame.

42 . The light emitter package of claim 22 , further comprising a reflective material on the same side of the package as said contacts.

43 . The light emitter package of claim 22 , wherein said at least one contact directly connects to circuit board.

44 . A light emitter package, comprising:
a light emitter; an at least one structure at least partially surrounding said light emitter; an encapsulant over said light emitter forming a primary optic, said structure at least partially defining the shape of said primary optic, wherein said primary optic is shaped such that at least a portion closer to the base of said primary optic is narrower than at least a portion closer to the exit face; and wherein said package is submount free.

45 . The light emitter package of claim 44 , wherein said primary optic is capable of beam shaping.

46 . The light emitter package of claim 44 , wherein at least a portion of said structure is capable of being removed.

47 . The light emitter package of claim 44 , wherein said primary optic is shaped to have an overhang portion.

48 . The light emitter package of claim 44 , wherein said structure is a permanent portion of said package.

49 . The light emitter package of claim 44 , wherein at least a portion of said structure is reflective.

50 . The light emitter package of claim 44 , wherein said primary optic has a parabolic shape.

51 . The light emitter package of claim 44 , wherein said package is a cavity optic with a tapered primary optic and reflective cavity walls.

52 . The light emitter package of claim 44 , further comprising a glass lens over said encapsulant.

53 . The light emitter package of claim 44 , further comprising c

Assignees

• Bhat Chandan
• Lowes Theodore
• Tarsa Eric
• Cree Inc

Inventors

• Bhat Chandan
• Lowes Theodore
• Tarsa Eric

Classifications

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title