Optoelectronic Component And Method For Producing An Optoelectronic Component

Patent metadata

Field	Value
Publication number	US-2016013369-A1
Application number	US-201414769699-A
Country	US
Kind code	A1
Filing date	Mar 4, 2014
Priority date	Mar 12, 2013
Publication date	Jan 14, 2016
Grant date	—

Abstract

An optoelectronic component, comprising: a carrier ( 1 ) and a semiconductor layer sequence ( 20 ) configured for emission of electromagnetic primary radiation and arranged on the carrier ( 10 ). The semiconductor layer sequence ( 20 ) comprises a radiation main side ( 21 ) facing away from the carrier. A connecting layer is applied directly at least on the radiation main side ( 21 ) of the semiconductor layer sequence. A conversion element ( 40 ) is configured for emission of electromagnetic secondary radiation and is arranged directly on connecting layer ( 30 ), and being formed as a prefabricated body. Connecting layer ( 30 ) comprises at least one inorganic filler ( 31 ) embedded in matrix material and being formed with a layer thickness of less than or equal to 2 μm. The prefabricated body is attached to the semiconductor layer sequence by the connecting layer which is configured in order to filter out a short-wave component of the electromagnetic primary radiation.

First claim

1 . An optoelectronic component, comprising:
a carrier; a semiconductor layer sequence which is configured for the emission of electromagnetic primary radiation and is arranged on the carrier, wherein the semiconductor layer sequence comprises a radiation main side facing away from the carrier, a connecting layer which is applied directly at least on the radiation main side of the semiconductor layer sequence; a conversion element which is configured for the emission of electromagnetic secondary radiation and is arranged directly on the connecting layer, the conversion element being formed as a prefabricated body; the connecting layer comprising at least one inorganic filler embedded in a matrix material; the connecting layer being formed with a layer thickness of less than or equal to 2 μm; the prefabricated body being attached to the semiconductor layer sequence by the connecting layer; and, the connecting layer being configured in order to filter out a short-wave component of the electromagnetic primary radiation.

2 . The optoelectronic component according to claim 1 , wherein the inorganic filler is TiO 2 or ZnO, and TiO 2 or ZnO comprises doping.

3 . The optoelectronic component according to claim 2 , wherein the doping is selected from a group consisting of Nb, Al and In.

4 . The optoelectronic component according to claim 1 , wherein the inorganic filler comprises a proportion of greater than or equal to 5 wt % and less than or equal to 50 wt % in the matrix material.

5 . The optoelectronic component according to claim 1 , wherein the inorganic filler is selected from a group consisting of TiO 2 , n-doped TiO 2 , Al-doped TiO 2 , ZnO, n-doped ZnO, In-doped ZnO, AgI, GaN, In x Ga 1-x N, SrTiO 3 and FeTiO 3 .

6 . The optoelectronic component according to claim 1 , wherein the inorganic filler is formed as particles, the particles having a particle size of greater than or equal to 50 nm and less than or equal to 800 nm.

7 . The optoelectronic component according to claim 1 , wherein the inorganic filler is formed as particles, the particles being both in direct contact with the conversion element and in direct contact with the radiation main side of the semiconductor layer sequence.

8 . The optoelectronic component according to claim 1 , wherein the conversion element comprises a main material in which a conversion substance is embedded, the conversion substance being configured for the emission of electromagnetic secondary radiation, and wherein the main material of the conversion element and the matrix material of the connecting layer being identical.

9 . The optoelectronic component according to claim 1 , wherein the connecting layer comprising the inorganic filler is electrically insulating and is not configured for the electrical conduction of the optoelectronic component.

10 . The optoelectronic component according to claim 1 , wherein the connecting layer is formed with a form fit with the radiation main side of the semiconductor layer sequence and with a form fit with the side of the conversion element facing toward the semiconductor layer sequence.

11 . The optoelectronic component according to claim 1 , wherein the connecting layer additionally covers at least a part of the side surfaces of the semiconductor layer sequence.

12 . The optoelectronic component according to claim 1 , wherein the connecting layer protrudes beyond the side surfaces of the semiconductor layer sequence and beyond the side edges of the conversion element.

13 . The optoelectronic component according to claim 1 , wherein the electromagnetic primary radiation is selected from the UV and/or blue wavelength range.

14 . The optoelectronic component according to claim 1 , wherein the connecting layer has a layer thickness which corresponds to the maximum diameter of the particles of the inorganic filler.

15 . The optoelectronic component according to claim 1 , wherein a first and a second terminal layer are arranged between the carrier and the connecting layer.

16 . A method for producing an optoelectronic component according to claim 1 , comprising, having the following method steps:
1) providing a carrier; 2) applying a semiconductor layer sequence, which is configured for the emission of electromagnetic primary radiation, onto the carrier; 3) applying a liquid connecting layer onto the semiconductor layer sequence; 4) applying a conversion element, which is formed as a solid prefabricated body and is configured for the emission of electromagnetic secondary radiation, onto the connecting layer; 5) curing the connecting layer; 6) fastening the prefabricated body by means of the connecting layer on the semiconductor layer sequence; wherein method step 3) is carried out before method step 4) or wherein method steps 3) and 4) are carried out simultaneously, wherein the conversion element comprises a main material, in which a conversion substance is embedded, and wherein the conversion substance is configured for the emission of electromagnetic secondary radiation, and wherein the main material of the conversion element and the matrix material of the connecting layer are identical.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Schmidtke Kathy
• Stoll Ion
• Albrecht Tony
• Klein Markus

Classifications

• H10H20/8514

  characterised by their shape, e.g. plate or foil · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/0361

  of wavelength conversion means · CPC title