Composite Formulation and Composite Product

Patent metadata

Field	Value
Publication number	US-2016012934-A1
Application number	US-201414329666-A
Country	US
Kind code	A1
Filing date	Jul 11, 2014
Priority date	Jul 11, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.

First claim

What is claimed is:

1 . A composite formulation, comprising:
a polymer matrix; and metal particles, the metal particles including dendritic particles at a concentration of between 10% and 36%, by volume, and tin-containing particles; wherein the tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%; wherein the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%; wherein the metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix; wherein the temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.

2 . The composite formulation of claim 1 , further comprising a process aid.

3 . The composite formulation of claim 1 , wherein the composite formulation is extrudable.

4 . The composite formulation of claim 1 , wherein the composite formulation is moldable.

5 . The composite formulation of claim 1 , wherein the formulation further includes metal particles having a morphology selected from the group consisting of spheroid particles, powder, flakes, and blends thereof.

6 . The composite formulation of claim 1 , wherein the dendritic particles have a maximum dimension of between 5 micrometers and 100 micrometers.

7 . The composite formulation of claim 1 , wherein the tin-containing particles have a maximum dimension of between 2 micrometers and 50 micrometers.

8 . The composite formulation of claim 1 , wherein the metal particles have a maximum dimension of 200 micrometers.

9 . The composite formulation of claim 1 , wherein the polymer matrix includes a polymer selected from the group consisting of polyvinylidene fluoride, polyethylene, polyethylene terephthalate, polybutylene terephthalate, and liquid crystal polymer.

10 . The composite formulation of claim 1 , wherein the tin-containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36% and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%.

11 . The composite formulation of claim 1 , wherein the composite formulation has an electrical resistivity of less than 0.0006 ohm·cm at 23° C.

12 . The composite formulation of claim 1 , where the composite melt mixing is done below the melt temperature of the tin containing particle.

13 . The composite formulation of claim 1 , wherein the composite formulation is capable of producing a composite product, the composite product being an electrical component selected from the group consisting of an antenna, shielding, and a connector housing.

14 . The composite formulation of claim 1 , wherein the composite formulation is capable of being molded or extruded into a composite product having electrical contact resistance of less than 100 milliohm at forces of 30 gm per ASTM standard B539-02.

15 . The composite formulation of claim 1 , wherein the composite formulation is capable of producing a composite product that is solderable with one or both of lead-based and lead-free solder.

16 . The composite formulation of claim 1 , wherein the composite formulation is capable of producing a composite product that maintains electrical resistivity and contact resistance within 30% of an initial electrical resistivity and an initial contact resistance after exposure to 150° C. for 10 days.

17 . A composite formulation, comprising:
a polymer matrix; and metal particles, the metal particles including dendritic particles and tin containing particles; wherein the metal particles are blended within the polymer matrix at a temperature higher than the melt temperature of the polymer matrix; wherein the temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing one or both of intermetallic phases and alloy phases; wherein the dendritic particles have a maximum dimension of between 5 micrometers and 50 micrometers; wherein the tin containing particles have a maximum dimension of between 2 micrometers and 50 micrometers; wherein the tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%; wherein the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%; wherein the composite formulation has an electrical resistivity of less than 0.0006 ohm·cm at 23° C.

18 . A composite product produced from a composite formulation, the composite formulation having metal particles blended within a polymer matrix, the composite product comprising:
the polymer matrix; the metal particles, the metal particles including tin containing particles and dendritic particles comprising copper; and intermetallic compounds formed from at least a portion of the metal particles, the intermetallic compounds being formed at least partly by the composite formulation being treated at a temperature of at least the intermetallic annealing temperature during the producing of the composite product or subsequent heat treatment step.

19 . The composite product of claim 18 , wherein the composite product is heat-treated in a controlled atmosphere at a temperature where the metal-metal diffusion occurs, wherein the composite product has an electrical resistivity of less than 0.0004 ohm·cm at 23° C., and wherein the composite product shows electrical contact resistance of less than 100 milliohm at forces of 30 gm per ASTM standard B539-02.

Assignees

• Tyco Electronics Corp

Inventors

• Das Jaydip
• Gao Ting
• Wartenberg Mark F
• Bharadwaj Kavitha
• Lloyd Richard B
• Martens Rodney Ivan

Classifications

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• C08K2201/014

  Additives containing two or more different additives of the same subgroup in C08K · CPC title

• B29K2027/16

  PVDF, i.e. polyvinylidene fluoride · CPC title

• C08K2003/085

  Copper · CPC title

• C08K2201/005

  Additives being defined by their particle size in general · CPC title