Composite Formulation and Composite Product

Patent metadata

Field	Value
Publication number	US-2016012933-A1
Application number	US-201414329654-A
Country	US
Kind code	A1
Filing date	Jul 11, 2014
Priority date	Jul 11, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix, tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%, copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%, and one or both of solder flux and density-lowering particles blended into the polymer matrix. The tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.

First claim

What is claimed is:

1 . A composite product formed from a composite formulation, the composite formulation comprising:
a polymer matrix; tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%; copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%; and solder flux blended into the polymer matrix at a concentration, by weight, of at least 0.2% for reducing or eliminating oxides in the copper-containing particles; wherein the tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.

2 . The composite formulation of claim 1 , wherein the polymer matrix comprises dioctyl sebacate at a concentration in the composite formulation, by weight, of between 2% and 4%

3 . The composite formulation of claim 1 , wherein the tin-containing particles are at a concentration, by weight, of between 27% and 31%.

4 . The composite formulation of claim 1 , wherein the copper-containing particles are at a concentration, by weight, of between 50% and 55%.

5 . The composite formulation of claim 1 , wherein the copper-containing particles include copper fibers and copper dendrites, the copper fibers being at a concentration of at least 25% of the composite formulation and the copper dendrites being at a concentration, by weight, of at least 24% of the composite formulation.

6 . The composite formulation of claim 1 , wherein the composite formulation has a viscosity after blending of the tin-containing particles, the copper-containing particles, and the solder flux that is lower than the polymer matrix viscosity without the blending.

7 . The composite formulation of claim 1 , wherein the polymer matrix includes polyvinylidene fluoride.

8 . The composite formulation of claim 1 , further comprising density-lowering particles in the form of glass spheres blended into the polymer matrix at a concentration, by weight, of between 3% and 10%.

9 . The composite formulation of claim 1 , further comprising carbon black blended into the polymer matrix at a concentration, by weight, of between 7% and 15%.

10 . The composite formulation of claim 1 , wherein the composite formulation has an electrical resistivity of between 3×10 −5 ohm·cm and 7×10 −5 ohm·cm.

11 . The composite formulation of claim 1 , wherein the copper-containing particles have a maximum length of less than 3 millimeters.

12 . The composite formulation of claim 1 , wherein the copper-containing particles have a maximum length of 0.5 millimeters to 1.5 millimeters.

13 . The composite formulation of claim 1 , wherein the copper-containing particles have a maximum width of less than 300 micrometers.

14 . The composite formulation of claim 1 , wherein the copper-containing particles have a maximum width of less than 200 micrometers.

15 . The composite formulation of claim 1 , wherein the copper-containing particles have a maximum width of less than 100 micrometers.

16 . The composite formulation of claim 1 , wherein the copper-containing particles have a maximum width of between 25 micrometers and 50 micrometers.

17 . The composite formulation of claim 1 , wherein the intermetallic phases include phases are selected from the group consisting of an ε-phase, an η-phase, and combinations thereof.

18 . The composite formulation of claim 1 , wherein the intermetallic phases include intermetallics are selected from the group consisting of an Cu 3 Sn, Cu 6 Sn 5 , and combinations thereof.

19 . A composite product formed from a composite formulation, the composite formulation comprising:
a polymer matrix; tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 13%; copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%; density-lowering particles blended into the polymer matrix at a concentration, by weight, of between 3% and 15%; and wherein the tin-containing particles and the copper-containing particles have intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.

20 . A composite formulation, comprising:
a polymer matrix; tin-containing particles blended within the polymer matrix at a concentration, by weight, of between 13% and 31%; one or more shapes of copper-containing particles blended within the polymer matrix at a concentration, by weight, of between 25% and 56%; and one or both of solder flux and density-lowering particles blended into the polymer matrix; wherein the tin-containing particles and the copper-containing particles have intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.

Assignees

• Tyco Electronics Corp

Inventors

• Das Jaydip
• Gao Ting
• Wang Jialing
• Pugliano Nicola
• Bharadwaj Kavitha
• Lloyd Richard B

Classifications

• C08K3/08 Primary

  Metals · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• C08K7/06

  Elements · CPC title

• C08K7/00

  Use of ingredients characterised by shape · CPC title

• C08K2003/085

  Copper · CPC title