Infrared absorbing compositions, infrared cut filters, camera modules and processes for manufacturing camera modules

Patent metadata

Field	Value
Publication number	US-2016011336-A1
Application number	US-201514861444-A
Country	US
Kind code	A1
Filing date	Sep 22, 2015
Priority date	Mar 27, 2013
Publication date	Jan 14, 2016
Grant date	—

Abstract

Provided are infrared absorbing compositions that allow for preparing infrared absorption patterns having good adhesiveness to substrates on which the infrared absorbing composition is applied. The infrared absorbing composition contains an infrared absorbing material, and a polymerizable compound containing a partial structure represented by formula (1) below: wherein R 1 represents a hydrogen atom or an organic group; the asterisk (*) indicates a point of attachment to another atom.

First claim

What is claimed is:

1 . An infrared absorbing composition comprising: an infrared absorbing material, and a polymerizable compound containing a partial structure represented by formula (1) below:

wherein R1 represents a hydrogen atom or an organic group; the asterisk (*) indicates a point of attachment to another atom.

2 . The infrared absorbing composition according to claim 1 , wherein the polymerizable compound contains two or more partial structures represented by formula (1).

3 . The infrared absorbing composition according to claim 1 , wherein the polymerizable compound contains two or more polymerizable functional groups.

4 . The infrared absorbing composition according to claim 1 , wherein the polymerizable compound is a polymerizable compound containing two or more partial structures represented by formula (1-1):

wherein R 11 represents a hydrogen atom or methyl group; the asterisk (*) indicates a point of attachment to another atom.

5 . The infrared absorbing composition according to claim 1 , wherein the polymerizable compound is represented by formula (1-2):
A 1 —C—(L 1 -A 1 ) 3   Formula (1-2)
wherein A 1 each independently represents a partial structure represented by formula (1-1), and L 1 represents a divalent linking group:

wherein R 11 represents a hydrogen atom or methyl group; the asterisk (*) indicates a point of attachment to another atom.

6 . The infrared absorbing composition according to claim 1 , wherein the polymerizable compound is represented by formula

wherein R 21 each independently represents a hydrogen atom or methyl group; L 21 represents a straight-chain or branched alkylene group containing 2 to 4 carbon atoms, provided that L 21 does not adopt a structure in which an oxygen atom and a nitrogen atom at both ends of L 21 are attached to the same carbon atom of L 21 ; L 22 represents a divalent linking group; k represents 2 or 3; x, y and z each independently represent an integer of 0 to 6, provided that x+y+z satisfies 0 to 18.

7 . The infrared absorbing composition according to claim 1 , wherein the infrared absorbing material is at least one of a copper compound and a pyrrolopyrrole dye.

8 . The infrared absorbing composition according to claim 6 , wherein the infrared absorbing material is a pyrrolopyrrole dye; and the polymerizable compound is represented by formula (1-3).

9 . The infrared absorbing composition according to claim 7 , wherein the pyrrolopyrrole dye is a compound represented by formula (I) below:

wherein R 1a and R 1b each independently represent an alkyl group, aryl group or heteroaryl group; R 2 and R 3 each independently represent a hydrogen atom or a substituent and at least one of R 2 and R 3 represents an electron-withdrawing group, or R 2 and R 3 may be joined together to form a ring; R 4 represents a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, a substituted boron atom or a metal atom, and may form a covalent bond or a coordinate bond with at least one of R 1a , R 1b and R 3 .

10 . The infrared absorbing composition according to claim 1 , wherein the infrared absorbing material has a maximum absorption at a wavelength of 820 to 880 nm.

11 . The infrared absorbing composition according to claim 1 , further comprising a solvent.

12 . The infrared absorbing composition according to claim 1 , which has a solid content 5 to 50% by mass in the infrared absorbing composition.

13 . An infrared cut filter using the infrared absorbing composition according to claim 1 .

14 . A process for manufacturing the infrared cut filter according to claim 13 , comprising:
applying the infrared absorbing composition to form an infrared absorption pattern, wherein the infrared absorbing composition contains water or an aqueous solvent.

15 . A camera module comprising a solid-state image sensor board, and the infrared cut filter according to claim 13 .

16 . A process for manufacturing a camera module comprising a solid-state image sensor board and an infrared cut filter, the process comprising:
coating the infrared absorbing composition according to claim 1 .

Assignees

• Fujifilm Corp

Inventors

• Takakuwa Hideki
• Ezoe Toshihide
• Takahashi Hidenori
• Shimada Kazuto

Classifications

• G02B5/223

  containing organic substances, e.g. dyes, inks or pigments · CPC title

• G03B11/00

  Filters or other obturators specially adapted for photographic purposes · CPC title

• C08K5/0041

  Optical brightening agents, organic pigments · CPC title

• G02B1/04 Primary

  made of organic materials, e.g. plastics (G02B1/08 takes precedence) · CPC title

• G02B5/208 Primary

  for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation · CPC title