Design of susceptor in chemical vapor deposition reactor

US2016010208A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016010208-A1
Application numberUS-201514741080-A
CountryUS
Kind codeA1
Filing dateJun 16, 2015
Priority dateJul 10, 2014
Publication dateJan 14, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments described herein generally relate to an apparatus for depositing materials on a substrate. The apparatus includes a substrate support assembly. The substrate support assembly includes a susceptor and a substrate support ring disposed on the susceptor. The substrate support ring has a first surface for receiving the substrate and a second surface opposite the first surface. The second surface includes at least three protrusions and each protrusion has a tip that is in contact with the susceptor. The substrate support ring is comprised of a material having poor thermal conductivity, and the contact area between the substrate support ring and the susceptor is minimized, resulting in minimum unwanted heat conduction from the susceptor to the edge of the substrate.

First claim

Opening claim text (preview).

1 . An apparatus, comprising: a susceptor; and a substrate support ring disposed on a surface of the susceptor, wherein the substrate support ring has a first surface for receiving a substrate and a second surface opposite the first surface, wherein the second surface has at least three protrusions, each protrusion has a tip, and each tip is in contact with the susceptor. 2 . The apparatus of claim 1 , wherein the surface of the susceptor has an inner portion and an outer portion, and the substrate support ring is disposed on the outer portion of the surface of the susceptor. 3 . The apparatus of claim 2 , further comprising at least three recesses formed in the outer portion of the surface of the susceptor, wherein each tip of the substrate support ring is placed in a corresponding recess. 4 . The apparatus of claim 3 , further comprising a groove disposed in the outer portion of the surface of the susceptor, wherein the at least three recesses are formed in the groove. 5 . The apparatus of claim 1 , where in the substrate support ring further includes a curved surface between adjacent tips. 6 . The apparatus of claim 5 , wherein the curved surface is an arc. 7 . The apparatus of claim 2 , wherein the inner portion is flat, and the substrate support ring has a height between about 4 mm and about 10 mm. 8 . The apparatus of claim 2 , wherein the inner portion is curved, and the substrate support ring has a height between about 3 mm and about 10 mm. 9 . An apparatus, comprising: a chamber body; and a substrate support assembly disposed in the chamber body, wherein the substrate support assembly comprises: a susceptor; and a substrate support ring disposed on a surface of the susceptor, wherein the substrate support ring has a first surface for receiving a substrate and a second surface opposite the first surface, wherein the second surface has at least three protrusions, each protrusion has a tip, and each tip is in contact with the susceptor. 10 . The apparatus of claim 9 , wherein the surface of the susceptor has an inner portion and an outer portion, and the substrate support ring is disposed on the outer portion of the surface of the susceptor. 11 . The apparatus of claim 10 , further comprising at least three recesses formed in the outer portion of the surface of the susceptor, wherein each tip of the substrate support ring is placed in a corresponding recess. 12 . The apparatus of claim 11 , further comprising a groove disposed in the outer portion of the surface of the susceptor, wherein the at least three recesses are formed in the groove. 13 . The apparatus of claim 9 , where in the substrate support ring further includes a curved surface between adjacent tips. 14 . The apparatus of claim 13 , wherein the curved surface is an arc. 15 . The apparatus of claim 10 , wherein the inner portion is flat, and the substrate support ring has a height between about 4 mm and about 10 mm. 16 . The apparatus of claim 10 , wherein the inner portion is curved, and the substrate support ring has a height between about 3 mm and about 10 mm. 17 . The apparatus of claim 9 , wherein the substrate support ring comprises quartz. 18 . An apparatus, comprising: a susceptor having a surface, wherein at least three recesses are formed in the surface of the susceptor; and a substrate support ring disposed on the surface of the susceptor, wherein the substrate support ring has a first surface for receiving a substrate and a second surface opposite the first surface, wherein the second surface has at least three protrusions, each protrusion has a tip, and each tip is placed in a corresponding recess of the at least three recesses. 19 . The apparatus of claim 18 , further comprising a groove disposed in the surface of the susceptor, wherein the at least three recesses are formed in the groove. 20 . The apparatus of claim 18 , where in the substrate support ring further includes a curved surface between adjacent tips.

Assignees

Inventors

Classifications

  • C23C16/458Primary

    characterised by the method used for supporting substrates in the reaction chamber · CPC title

  • Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds · CPC title

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Frequently asked questions

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What does patent US2016010208A1 cover?
Embodiments described herein generally relate to an apparatus for depositing materials on a substrate. The apparatus includes a substrate support assembly. The substrate support assembly includes a susceptor and a substrate support ring disposed on the susceptor. The substrate support ring has a first surface for receiving the substrate and a second surface opposite the first surface. The secon…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification C23C16/458. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jan 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).