Structure for bonding metal parts to each other and bonding method therefor

Patent metadata

Field	Value
Publication number	US-2016008916-A1
Application number	US-201414769999-A
Country	US
Kind code	A1
Filing date	Feb 18, 2014
Priority date	Mar 13, 2013
Publication date	Jan 14, 2016
Grant date	—

Abstract

A method for bonding metal parts to each other includes a first step of sandwiching a bonding member between surfaces to be bonded of a first metal part and a second metal part, the bonding member having a melting point within a range of −150° C. to +150° C. with respect to melting points of the first and second metal parts, and a second step of resistance-welding the surfaces to be bonded of the first and second metal parts to each other using the bonding member.

First claim

1 . A structure for bonding metal parts to each other, comprising:
a first metal part; a second metal part and a bonding member having a melting point within a range of −150° C. to +150° C. with respect to melting points of the first and second metal parts that bonds the first metal part to the second metal part.

2 . The structure for bonding metal parts to each other according to claim 1 , wherein conductivity of the bonding member is less than or equal to 30% IACS.

3 . The structure for bonding metal parts to each other according to claim 1 , wherein the bonding member is a wire rod before the bonding.

4 . The structure for bonding metal parts to each other according to claim 1 , wherein a surface to be bonded of each of the first metal part and the second metal part is a planar surface.

5 . The structure for bonding metal parts to each other according to claim 1 , wherein a width of the bonding member before the bonding is less than or equal to one-fifth of a width of a surface to be bonded of each of the first and second metal parts.

6 . The structure for bonding metal parts to each other according to claim 1 , wherein at least one of surfaces to be bonded of the first metal part and the second metal part is subjected to barrel plating.

7 . The structure for bonding metal parts to each other according to claim 1 , wherein at least one of surfaces to be bonded of the first metal part and the second metal part is not subjected to plating.

8 . A method for bonding metal parts to each other, comprising:
a first step of sandwiching a bonding member between surfaces to be bonded of a first metal part and a second metal part, the bonding member having a melting point within a range of −150° C. to +150° C. with respect to melting points of the first and second metal parts; and a second step of resistance-welding the surfaces to be bonded of the first and second metal parts to each other using the bonding member.

9 . The method for bonding metal parts to each other according to claim 8 , wherein a wire rod is used as the bonding member.

10 . The method for bonding metal parts to each other according to claim 9 , wherein the bonding member is a wire rod comprising ends, and the bonding member is inserted while circularly extending along the surfaces to be bonded of the first and second metal parts in the first step.

11 . The method for bonding metal parts to each other according to claim 10 , wherein both ends of the wire rod are disposed in parallel with a gap less than or equal to 1.5 times a width of the wire rod in the first step.

12 . The method for bonding metal parts to each other according to claim 10 , wherein both ends of the bonding member are butted against each other in the first step.

13 . The method for bonding metal parts to each other according to claim 9 , wherein the bonding member is a closed wire rod comprising no end.

14 . The method for bonding metal parts to each other according to claim 9 , wherein a width of the wire rod is less than or equal to one-fifth of a width of the surface to be bonded of each of the first and second metal parts.

15 . The method for bonding metal parts to each other according to claim 9 , wherein the wire rod is tack-welded to the first or second metal part in the first step.

16 . A contact device comprising:
a contact disposed in a space formed by a first metal part and a second metal part, wherein the first metal part and the second metal part are bonded to each other using a bonding member having a melting point within a range of −150° C. to +150° C. with respect to melting points of the first and second metal parts.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Yoshioka Hidekazu
• Nagasaka Shogo
• Tsuchida Makoto
• Yoshida Hitoshi

Classifications

• B23K11/087

  for rectilinear seams · CPC title

• H01H2205/002

  fixed to operating part · CPC title

• B23K11/34

  Preliminary treatment · CPC title

• B23K11/16 Primary

  taking account of the properties of the material to be welded · CPC title

• H01H50/443

  Connections to coils · CPC title