Cooling system and electronic device

Patent metadata

Field	Value
Publication number	US-2016007501-A1
Application number	US-201514857415-A
Country	US
Kind code	A1
Filing date	Sep 17, 2015
Priority date	Mar 22, 2013
Publication date	Jan 7, 2016
Grant date	—

Abstract

An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies.
A cooling system includes a heat dissipating section, plural heat receiving sections, and a bypass section. The heat dissipation section dissipates heat from a coolant by exchanging heat with an external fluid. The plural heat receiving sections are connected in parallel to the heat dissipating section, and heat generated by respective heat generating bodies is absorbed by the coolant. The bypass section couples at least one of the heat receiving sections out of the plurality of heat receiving sections to another heat receiving section.

First claim

What is claimed is:

1 . A cooling system, comprising:
a heat dissipating section that dissipates heat from a coolant by exchanging heat with an external fluid; a plurality of heat receiving sections that are connected in parallel to the heat dissipating section, and in which heat generated by respective heat generating bodies is absorbed by the coolant; and a bypass section that couples at least one of the heat receiving sections out of the plurality of heat receiving sections to another heat receiving section.

2 . The cooling system of claim 1 , wherein
the bypass section is a bypass pipe.

3 . The cooling system of claim 1 , wherein
the plurality of heat receiving sections is a plurality of mutually independent heat receiving devices.

4 . The cooling system of claim 1 , wherein:
the plurality of heat receiving sections is formed by a plurality of heat receiving chambers divided by a partitioning wall formed inside a heat receiving device; and the partitioning wall is provided with an opening portion serving as the bypass section.

5 . The cooling system of claim 1 , wherein:
the plurality of heat receiving sections includes three or more heat receiving sections; and at least one heat receiving section out of the plurality of heat receiving sections is coupled to at least two other heat receiving sections out of the plurality of heat receiving sections through the bypass section.

6 . The cooling system of claim 1 , wherein
the bypass section couples together at least neighboring heat receiving sections out of the plurality of heat receiving sections.

7 . The cooling system of claim 1 , wherein:
the plurality of heat receiving sections is connected in parallel to the heat dissipating section through a feed pipe and a return pipe; the feed pipe includes a feed pipe main body connected to the heat dissipating section, and a plurality of feed pipe branch portions that branch out from the feed pipe main body and that are respectively connected to the plurality of heat receiving sections; and the return pipe includes a return pipe main body connected to the heat dissipating section, and a plurality of return pipe branch portions that branch out from the return pipe main body and that are respectively connected to the plurality of heat receiving sections.

8 . The cooling system of claim 1 , wherein:
the plurality of heat receiving sections are arrayed along two directions; and the feed pipe and the return pipe are connected to each of the plurality of heat receiving sections in sequence on progression from one side in a length direction to another side in the length direction.

9 . The cooling system of claim 1 , wherein
a circulation pump is provided at the feed pipe.

10 . The cooling system of claim 1 , wherein
the heat dissipating section is disposed at a high position that is higher in a vertical direction than the plurality of heat receiving sections.

11 . An electronic device comprising:
a plurality of heat generating bodies; and the cooling system of claim 1 .

Assignees

• Fujitsu Ltd

Inventors

• Nakanishi Teru
• Hayashi Nobuyuki
• Yoneda Yasuhiro

Classifications

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• F28D15/0266 Primary

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title