Method for the production of monolithic white diodes

Patent metadata

Field	Value
Publication number	US-2016005918-A1
Application number	US-201414763067-A
Country	US
Kind code	A1
Filing date	Jan 24, 2014
Priority date	Jan 24, 2013
Publication date	Jan 7, 2016
Grant date	—

Abstract

The invention relates to a method for the production of a light-emitting diode, characterised in that the method comprises a step of preparing a light-emitting layer ( 20 ) on a front face of a support ( 10 ), said emitting layer comprising at least two adjacent quantum wells ( 21, 22, 23 ) emitting at different wavelengths, said quantum wells ( 21, 22, 23 ) being in contact with the front face of the support. According to the invention, the step in which the light-emitting layer is deposited comprises a sub-step consisting in locally varying the temperature of a rear face of the support opposite the front face such that the front face of the support comprises at least two zones at different temperatures.

First claim

1 . A method of production of a light-emitting diode comprising a step of preparing a light-emitting layer on a front face of a support, said emitting layer comprising at least two adjacent quantum wells emitting at different wavelengths, said quantum wells being in contact with the front face of the support.

2 . The method according to claim 1 , wherein the step in which the light-emitting layer is deposited consists in locally varying the temperature of a back face of the support opposite the front face in such a way that the front face of the support comprises at least two areas at different temperatures.

3 . The method according to claim 2 , wherein the local temperature variation of the support is achieved on areas of different dimensions.

4 . The method according to claim 2 , wherein the step of depositing the emitting layer comprises a sub-step consisting in growing each quantum well on a respective area.

5 . The method according to claim 2 , wherein the sub-step consisting in locally varying the heating temperature of the support consists in eating the support under its back face, said support including at least one island on its back face.

6 . The method according to claim 1 , which comprises a step of preparation of the support consisting in making at least one pattern on the back face of the support.

7 . The method according to claim 6 , wherein the step of preparation of the support consists in making a plurality of patterns to obtain a support having a crenelated back face including steps.

8 . The method according to claim 6 , wherein the step of preparation of the support consists in making a plurality of patterns to obtain a support having a crenelated back face including steps of different thicknesses and/or surfaces.

9 . The method according to claim 6 , wherein the step of preparation comprises the etching of the support on its back face to create at least one trench.

10 . The method according to claim 6 , wherein the step of preparation comprises the deposition of a material on the back face of the support so as to create at least one island on the back face of the support.

11 . The method according to claim 1 , comprising:
the deposition of an electron transport layer on a substrate, the deposition of an electron blocking layer on the light-emitting layer, the deposition of a hole transport layer on the electron blocking layer, the formation of metal contacts to allow the connection of the diode to an electrical power source.

12 . The method according to claim 4 , wherein the growth of each quantum well is achieved by:
organometallic vapour-phase epitaxy from gaseous precursors of indium, aluminium, gallium and nitrogen, or by molecular beam epitaxy from elementary sources comprising indium, aluminium, gallium and nitrogen.

13 . A light-emitting diode comprising a light emitting layer on a front face of a support, said emitting layer comprising at least two adjacent quantum wells emitting at different wavelengths, said quantum wells being in contact with the front face of the support.

14 . The light-emitting diode according to claim 13 , wherein the support comprises a substrate including patterns on its back face, the emitting layer extending over the front face of the substrate.

15 . The light-emitting diode according to claim 13 , wherein the support comprises a gallium nitride GaN substrate.

16 . The light-emitting diode according to claim 13 , wherein the support comprises a semipolar or nonpolar gallium nitride GaN substrate.

17 . The light-emitting diode according to claim 13 , which comprises a metal layer forming a cathode over the whole surface of the back face of the diode.

Assignees

• Centre Nat Rech Scient

Inventors

• Nataf Gilles
• De Mierry Philippe
• Chenot Sébastien

Classifications

• H10P14/3242

  Structure · CPC title

• H10P14/3216

  Nitrides · CPC title

• H10P14/2921

  being crystalline insulating materials · CPC title

• H10P14/2908

  Nitrides · CPC title

• H10P14/3416

  Nitrides · CPC title