Electronic device comprising an improved lead frame

Patent metadata

Field	Value
Publication number	US-2016005678-A1
Application number	US-201514744766-A
Country	US
Kind code	A1
Filing date	Jun 19, 2015
Priority date	Jul 3, 2014
Publication date	Jan 7, 2016
Grant date	—

Abstract

An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.

First claim

1 . An electronic device, comprising:
a chip of semiconductor material configured to implement functionalities of the electronic device, a support element for supporting the chip, a plurality of leads each one adapted to be electrically coupled to at least one terminal of the chip, and a coupling element on a free region of the support element that is not occupied by the chip, said coupling element comprising a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain said electrical coupling.

2 . The electronic device according to claim 1 , wherein the conductive portion is electrically connected to the at least one lead by a wire connection between the at least one lead and a region of the conductive portion proximal to the at least one lead, and wherein the conductive portion is electrically connected to the at least one terminal by a wire connection between the at least one terminal and a region of the conductive portion proximal to the at least one terminal.

3 . The electronic device according to claim 1 , further comprising an electronic component configured to be electrically coupled to the at least one lead, said electronic component being mounted, within the electronic device, on the coupling element, and being electrically connected, within the electronic device, to said at least one lead and to said at least one terminal of the chip.

4 . The electronic device according to claim 3 , wherein said conductive portion comprises a first conductive portion electrically connected to a first terminal of the electronic component, and a second conductive portion, electrically insulated from the first conductive portion, electrically connected to a second terminal of the electronic component, the first and the second conductive portions being further connected, respectively, to the at least one lead and to the at least one terminal of the chip.

5 . The electronic device according to claim 4 , wherein the first and second conductive portions are electrically connected to the first and second terminals of the electronic component by an electrically conductive glue.

6 . The electronic device according to claim 1 , further comprising a conductive through-element between an upper surface and a lower surface of the coupling element, the conductive through-element contacting the support element for electrically coupling at least one further terminal of the chip to the support element by said conductive through-element.

7 . The electronic device according to claim 6 , wherein said conductive through-element extends, in plan view, around the chip.

8 . A method for manufacturing an electronic device, comprising:
providing a conductive structure comprising a support element configured to support a chip of semiconductor material of the electronic device, and a plurality of leads, each lead configured to be electrically coupled to at least one terminal of the chip, providing a coupling element comprising a conductive portion, fixing the chip on the support element, fixing said coupling element on a free region of the support element that is not occupied by the chip, and electrically connecting the conductive portion of said coupling element to at least one lead and to the at least one terminal of the chip to obtain said electrical coupling.

9 . The method according to claim 8 , wherein providing the coupling element comprises mounting, on said coupling element, an electronic component, and wherein said electrically connecting the conductive portion of said coupling element to at least one lead and to the at least one terminal of the chip comprises:
electrically connecting a first conductive portion of said conductive portion to a first terminal of the electronic component and to the at least one lead, and electrically connecting a second conductive portion of said conductive portion to a second terminal of the electronic component and to the at least one terminal of the chip, said second conductive portion being electrically insulated from the first conductive portion.

10 . The method according to claim 8 , wherein providing the coupling element comprises forming a conductive through-element between an upper surface and a lower surface of the coupling element and contacting the support element, the method further comprising:
electrically coupling at least one further terminal of the chip to the support element by said conductive through-element.

11 . An electronic device, comprising:
an integrated circuit chip; a lead frame including:
a support element including a central region to which the integrated circuit chip is attached and a side region extending from at least one side of the integrated circuit chip; and
a plurality of lead pins;
a conductive interconnect structure including an insulating body mounted to the side region of the lead frame, said insulating body supporting at least one conductive element; a first wire bond extending between a terminal of the integrated circuit chip and said conductive element; and a second wire bond extending between said conductive element and one of said plurality of lead pins.

12 . The electronic device of claim 11 , wherein said conductive element includes a first end proximal to said integrated circuit chip and a second end proximal to said one of the lead pins, said first wire bond connected to the first end and said second wire bond connected to the second end.

13 . The electronic device of claim 11 , wherein said conductive interconnect structure includes: a first conductive element and a second conductive element supported by said insulating body and separated from each other, said first wire bond connected to the first conductive element and said second wire bond connected to the second conductive element.

14 . The electronic device of claim 13 , further comprising a passive two terminal circuit component that is electrically connected between the first and second conductive elements.

15 . The electronic device of claim 11 , wherein the conductive interconnect structure includes a conductive via extending through the insulating body and in electrical connection with the support element of the lead frame, and further including a third wire bond end extending between a further terminal of the integrated circuit chip and said conductive via.

16 . The electronic device of claim 15 , wherein said via comprises a conductive line extending parallel to said at least one side of the integrated circuit chip.

Assignees

• St Microelectronics Srl

Inventors

• Magni Pierangelo
• Rossi Roberto

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/50

  Bond wires · CPC title

• H10W70/468 Primary

  Circuit boards · CPC title