Method for sealing a liquid within a glass package and the resulting glass package

US2016005548A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016005548-A1
Application numberUS-201514854671-A
CountryUS
Kind codeA1
Filing dateSep 15, 2015
Priority dateJul 28, 2008
Publication dateJan 7, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for sealing a liquid within a glass package and the resulting sealed glass package are described herein where the sealed glass package can be, for example, a dye solar cell, an electro-wetting display or an organic emitting light diode (OLED) display.

First claim

Opening claim text (preview).

1 . A glass package comprising: a first glass plate having a composition, thickness, coefficient of thermal expansion and an index of refraction; and a second glass plate having a composition, thickness, coefficient of thermal expansion and an index of refraction, a conductive liquid having an third index of refraction, a frit having a composition, thickness, coefficient of thermal expansion, a glass transition temperature and a sealing temperature, and comprising a glass doped with at least one transition metal and having a coefficient of thermal expansion that substantially matches the coefficient of thermal expansion of at least the first glass plate or second glass plate, wherein the first glass plate and the second glass plate are connected to one another by the frit which forms a seal between the first glass plate and the second glass plate and the frit, first glass plate, and second glass plate together form a sealed space that contains the conductive liquid. 2 . The glass package of claim 1 , wherein the coefficient of thermal expansion of the first glass plate or the second glass plate is from about 32-90×10 −7 deg C. 3 . The glass package of claim 1 , wherein the first plate and the second plate have different compositions, thicknesses, or CTEs. 4 . The glass package of claim 1 , wherein the index of refraction of the conductive liquid substantially matches the index of refraction of the second glass plate. 5 . The glass package of claim 1 , wherein the conductive liquid comprises index matching oil, immersion oil, electrolyte iodine solution, distilled water, or 20-50% ethylene glycol-water. 6 . The glass package of claim 1 , wherein the index of refraction of the conductive liquid is from about 1.3 to about 1.9. 7 . The glass package of claim 1 , further comprising a conductive coating on the first glass sheet or the second glass sheet. 8 . The glass package of claim 1 , wherein the frit has a glass transition temperature, T g of <350° C. 9 . The glass package of claim 8 , wherein the frit has a sealing temperature of <550° C. 10 . The glass package of claim 9 , wherein said frit has a CTE of from about 40-80×10 −7 deg C. 11 . The glass package of claim 1 , wherein the frit comprises glass particles having a mean particle size of 5-20 μm. 12 . The glass package of claim 1 , wherein the thickness of the frit varies by less than 5-10 μm. 13 . The glass package of claim 1 , wherein the frit is selected from the group of glasses comprising a titano-vanadium glass, an iron-vanadium glass, a zinc-vanadium glass, a Sn—Zn-phosphate glass, a mixed alkali zinc-phosphate glass, a vanadium-phosphate glass, a Pb-borate glass, and a mixed alkali zinc-phosphate glass with vanadium and lead. 14 . The glass package of claim 1 , wherein the composition of the frit comprises: K 2 O (0-10 mole %); Fe 2 O 3 (0-20 mole %); Sb 2 O 3 (0-20 mole %); ZnO (0-20 mole %); P 2 O 5 (20-40 mole %); V 2 O 5 (30-60 mole %); TiO 2 (0-20 mole %); Al 2 O 3 (0-5 mole %); B 2 O 3 (0-5 mole %); WO 3 (0-5 mole %); and Bi 2 O 3 (0-5 mole %). 15 . The glass package of claim 1 , wherein the frit further comprises a coloring agent. 16 . The glass package of claim 1 , wherein the frit comprises at least 20-30% filler and has a CTE that is in a range of 40-80×10 −7 deg C. 17 . The glass package of claim 16 , wherein the filler comprises a coefficient of thermal expansion (CTE) lowering filler. 18 . The glass package of claim 17 , wherein the frit is selected from the group of glasses comprising a titano-vanadium glass, an iron-vanadium glass, a zinc-vanadium glass, a Sn—Zn-phosphate glass, a mixed alkali zinc-phosphate glass, a vanadium-phosphate glass, a Pb-borate glass, and a mixed alkali zinc-phosphate glass with vanadium and lead. 19 . The glass package of claim 17 , wherein the frit composition, excluding the CTE lowering filler, comprises: K 2 O (0-10 mole %); Fe 2 O 3 (0-20 mole %); Sb 2 O 3 (0-20 mole %); ZnO (0-20 mole %); P 2 O 5 (20-40 mole %); V 2 O 5 (30-60 mole %); TiO 2 (0-20 mole %); Al 2 O 3 (0-5 mole %); B 2 O 3 (0-5 mole %); WO 3 (0-5 mole %); and Bi 2 O 3 (0-5 mole %). 20 . The glass package of claim 1 , wherein said glass package comprises: a solar cell; an electro-wetting display; or an organic emitting light diode device.

Assignees

Inventors

Classifications

  • Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

  • H01G9/2077Primary

    Sealing arrangements, e.g. to prevent the leakage of the electrolyte · CPC title

  • Electricity · mapped topic

  • Dye sensitized solar cells · CPC title

  • Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

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What does patent US2016005548A1 cover?
A method for sealing a liquid within a glass package and the resulting sealed glass package are described herein where the sealed glass package can be, for example, a dye solar cell, an electro-wetting display or an organic emitting light diode (OLED) display.
Who is the assignee on this patent?
Corning Inc
What technology area does this patent fall under?
Primary CPC classification H01G9/2077. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jan 07 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).